Automatic height compensating and co-planar leveling heat removal assembly for multi-chip packages
Embodiments of the present disclosure may include a heat removal assembly that is to thermally couple with two or more dice of an electronic device. The heat removal assembly may include a bellows to automatically adjust a position of at least one surface of the heat removal assembly relative to another surface of the heat removal assembly. Other embodiments may be described and/or claimed.
1. A heat removal assembly comprising:
a vapor chamber that includes two or more surfaces to thermally couple with respective surfaces of two or more dies; and
bellows coupled to a first surface of the two or more surfaces to automatically adjust a position of the first surface to be at a different plane in relation to a second surface of the two or more surfaces.
2. The heat removal assembly of claim 1 , wherein the bellows is to flex as pressure is increased within the vapor chamber.
3. The heat removal assembly of claim 1 , further comprising a heatsink element coupled with the vapor chamber.
4. The heat removal assembly of claim 1 , wherein the heat removal assembly includes a cold plate assembly.
5. The heat removal assembly of claim 1 , further comprising a spring assembly coupled with the bellows, the spring assembly to adjust the position of at least one surface.
6. The heat removal assembly of claim 5 , wherein the spring assembly includes a coil spring or a leaf spring.
7. The heat removal assembly of claim 5 , further comprising a wicking material between the bellows and the spring assembly.
8. A multi-chip package assembly that includes a first die and a second die mounted on a package substrate, wherein the first die has a height that is greater or less than a height of the second die relative to a surface of the package substrate; and
a heat removal assembly coupled with the first die and the second die, the heat removal assembly comprising:
a vapor chamber that includes a first surface and a second surface to thermally couple with respective surfaces of the first die and the second die; and
bellows coupled to the first surface to automatically adjust a position of the first surface to be at a different plane in relation to the second surface based on the height of the first die or the second die.
9. The multi-chip package assembly of claim 8 , wherein the bellows is to flex as pressure is increased within the vapor chamber.
10. The multi-chip package assembly of claim 8 , wherein the heat removal assembly further includes a heatsink element coupled with the vapor chamber.
11. The multi-chip package assembly of claim 8 , wherein the heat removal assembly further includes a cold plate assembly.
12. The multi-chip package assembly of claim 8 , wherein the heat removal assembly further includes a spring assembly coupled with the bellows, the spring assembly to adjust the position of the first surface or the second surface.
13. The multi-chip package assembly of claim 12 , wherein the spring assembly includes a coil spring or a leaf spring.
14. The multi-chip package assembly of claim 12 , further comprising a wicking material between the bellows and the spring assembly.
15. A system comprising:
a circuit board;
a plurality of dies coupled with the circuit board; and
a heat removal assembly coupled with a first die and a second die of the plurality of dies, the heat removal assembly comprising:
a vapor chamber that includes a first surface and a second surface to thermally couple with respective surfaces of two of the plurality of dies; and
bellows coupled to the first surface to automatically adjust a position of the first surface to be at a different plane in relation to the second surface based on a height of the first die relative to a height of the second die measured from the circuit board.
16. The system of claim 15 , wherein the bellows is to flex as pressure is increased within the vapor chamber.
17. The system of claim 15 , wherein the heat removal assembly further includes a heatsink element coupled with the vapor chamber.
18. The system of claim 15 , wherein the heat removal assembly further includes a cold plate assembly.
19. The system of claim 15 , wherein the heat removal assembly further includes a spring assembly coupled with the bellows, the spring assembly to adjust the position of the first surface or the second surface.
20. The system of claim 19 , wherein the spring assembly includes a coil spring or a leaf spring.
21. The system of claim 19 , further comprising a wicking material between the bellows and the spring assembly.