IP Library Granted Patent US 9,778,416
Granted Patent B2
US 9,778,416 · App. 14/467,531 · Granted Oct 3, 2017

Method and structure providing a front-end-of-line and a back-end-of-line coupled waveguides

Inventors: Roy Meade (Boise, ID); Jason Orcutt (Katonah, NY); Milos Popovic (Boulder, CO); Jeffrey Shainline (Boulder, CO); Zvi Sternberg (Metar, IL); Vladimir Stojanovic (Berkeley, CA); Ofer Tehar-Zahav (Hadera, IL)
Assignees: Micron Technology, Inc.; Massachusetts Institute of Technology
G02B6/1228G02B6/12004G02F1/025G02B2006/12061G02B2006/12121G02B2006/12123G02B2006/12142G02F2201/06G02F2202/104
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Quick Facts
Patent No.
US 9,778,416
App. No.
14/467,531
Granted
Oct 3, 2017
Kind
B2
Abstract

An integrated structure and method of formation provide a lower level waveguide having a core of a first material and a higher level waveguide having a core of a second material and a coupling region for coupling the two waveguides together. The different core materials provided different coupled waveguides having different light loss characteristics.

Claims (23)

1. An integrated structure comprising:

a photonic structure comprising:

a first waveguide having a first core of a first material, the first waveguide having a first light propagation loss parameter; and

a second waveguide having a second core of a second material different from the first material, the second waveguide having a second light propagation loss parameter lower than the first light propagation loss parameter

the second waveguide being located above and evanescently coupled to the first waveguide; and

an electronic structure comprising transistors having gates, wherein the first core is at a level of integration corresponding to the same level of integration as the transistor gates.

2. The integrated structure as in claim 1 , wherein the first material comprises polysilicon.

3. The integrated structure as in claim 2 , wherein the second material comprises silicon nitride.

4. The integrated structure as in claim 2 , wherein a cladding surrounds the first material, at least a portion of the cladding comprises silicon nitride.

5. The integrated structure as in claim 4 , wherein another portion of the cladding comprises an oxide.

6. The integrated structure as in claim 1 , wherein at least one of the first and second waveguides comprises an inwardly tapering profile along at least a portion of its longitudinal extent to increase light coupling between the first and second waveguides.

7. The integrated structure as in claim 6 , wherein the first waveguide comprises the inwardly tapering profile.

8. The integrated structure as in claim 7 , wherein the first waveguide comprises a terraced inwardly tapering profile.

9. The integrated structure as in claim 6 , wherein both the first and second waveguides comprise inwardly tapering profiles at least where the second waveguide is located above the first waveguide.

10. The integrated structure as in claim 1 , wherein the first and second waveguide cores are separated by at least an oxide material.

11. The integrated structure as in claim 1 , wherein the first and second waveguide cores are separated by at least an intervening oxide material.

12. The integrated structure as in claim 1 , wherein the first waveguide core is integrated over a substrate on which electronic circuits are also integrated.

13. The integrated structure as in claim 12 , wherein the first waveguide core is formed of the same material as used to form the transistor gates.

14. The integrated structure as in claim 12 , wherein the second waveguide core is integrated over the substrate at a level of integration above transistors of the electronic circuits.

15. The integrated structure as in claim 14 , further comprising an oxide material over the gates of transistors, wherein the second waveguide core is formed above the oxide material.

16. The integrated structure as in claim 15 , wherein the second waveguide core is formed on the oxide material.

17. The integrated structure as in claim 1 , wherein the first and second waveguides are configured such that light passing through the first waveguide exits the first waveguide and passes through the second waveguide.

18. The integrated structure as in claim 1 , wherein the first and second waveguides are configured such that a first portion of light passing through the first waveguide exits the first waveguide and passes through the second waveguide and a second portion of light passing through the first waveguide continues to pass along the first waveguide.

Assignments (9)
CONFIRMATORY LICENSE Recorded Jul 14, 2023
From: MASSACHUSETTS INSTITUTE OF TECHNOLOGY
To: DEFENSE ADVANCED RESEARCH PROJECTS AGENCY
Reel/Frame 064275/0194 →
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 25, 2014
From: MEADE, ROY; ORCUTT, JASON; POPOVIC, MILOS; SHAINLINE, JEFFREY; STERNBERG, ZVI; STOJANOVIC, VLADIMIR; TEHAR-ZAHAV, OFER
To: MICRON TECHNOLOGY, INC.; MASSACHUSETTS INSTITUTE OF TECHNOLOGY
Reel/Frame 033601/0726 →
Continuity (1)
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