System and method for reducing temperature transition in an electrostatic chuck

1. A system for controlling a substrate temperature in a substrate processing system, the system comprising:

a substrate support device configured to support the substrate;

a temperature sensor configured to sense a temperature of the substrate support device;

a thermal control element (TCE) configured to selectively heat the substrate support device;

a controller configured to:

determine a temperature difference between the substrate temperature before the substrate is loaded onto the substrate support device and a desired temperature for the substrate support device;

during a first period, control the TCE to adjust the temperature of the substrate support device to a temperature value based on the temperature difference, the temperature value not equal to the desired temperature for the substrate support device;

wherein the substrate is loaded onto the substrate support device after the first period begins and before the temperature of the substrate support device returns to the desired temperature; and

during a second period that follows the first period, control the temperature of the substrate support device to the desired temperature for the substrate support device.

2. The system of claim 1 , wherein the temperature value is greater than the desired temperature for the substrate support device.

3. The system of claim 1 , wherein the temperature value is less than the desired temperature for the substrate support device.

4. The system of claim 1 , wherein the temperature difference includes a first temperature difference corresponding to a first substrate, and a second temperature difference corresponding to a second substrate.

5. The system of claim 4 , further comprising a memory that stores at least one of the first and second temperature differences.

6. The system of claim 5 , wherein the controller is configured to control the TCE based at least in part on the first and second temperature differences.

7. The system of claim 6 , wherein the controller is configured to control the TCE based on the second temperature difference offset by the first temperature difference.

8. The system of claim 6 , wherein control of the TCE corresponding to the second substrate is determined based on control of the TCE corresponding to the first substrate.

9. The system of claim 6 , wherein the controller is configured to determine a third temperature difference corresponding to a third substrate, and wherein the controller is configured to control the TCE based on the third temperature difference offset by at least one of the first and second temperature differences.

10. The system of claim 9 wherein the controller is configured to determine the third temperature difference after the first and second substrates are loaded on the substrate support device.

11. The system of claim 4 , wherein the controller is configured to control the TCE based on the first temperature difference prior to the second substrate being loaded on the substrate support device.

12. The system of claim 1 , wherein control of the TCE includes control of at least one of a power and a cycle time of the TCE.

13. The system of claim 1 , wherein the TCE is arranged within a heating plate of the substrate support device.

14. The system of claim 1 , wherein the substrate support device includes an electrostatic chuck.

15. The system of claim 1 , wherein the substrate is configured to reduce the temperature of the substrate support device from the temperature value to the desired temperature during the second period.

16. The system of claim 1 , wherein the substrate is configured to increase the temperature of the substrate support device from the temperature value to the desired temperature during the second period.

17. The system of claim 1 , further comprising a sensor configured to measure a temperature of the substrate prior to the first period.

18. The system of claim 1 , wherein the TCE is one of a macro TCE and a micro TCE.