IP Library Granted Patent US 9,796,846
Granted Patent B2
US 9,796,846 · App. 14/422,391 · Granted Oct 24, 2017

Resin composition and resin molded object

Inventors: Kenji Ueda (Kanagawa, JP); Yasuhito Inagaki (Kanagawa, JP); Takahiro Ohe (Tokyo, JP); Atsushi Yamada (Kanagawa, JP)
Assignee: Sony Corporation
C08L69/00C08L2201/02
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Quick Facts
Patent No.
US 9,796,846
App. No.
14/422,391
Granted
Oct 24, 2017
Kind
B2
Abstract

A halogen-free type polycarbonate resin composition and a resin molded object having good flame retardant properties and physical properties that make them suitable for the use as manufactured products are provided. A resin composition of the present disclosure includes a component A, a component B, a component C and a component D. The component A is a polycarbonate resin. The component B is talc having an average median diameter of 4.6 μm or more and 6.0 μm or less, whose content is 5% or more and 20% or less by weight. The component C is an organic sulfonic acid or an organic sulfonic acid metal salt, whose content is 0.05% or more and 2.0% or less by weight. The component D is a drip inhibitor, whose content is 0.05% or more and 1.0% or less by weight.

Claims (32)

1. A resin composition consisting of:

a component A consisting of a polycarbonate resin or a mixture of polycarbonate resins;

a component B being talc, the content of the component B being 5% or more and 20% or less by weight;

a component C being an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component C being 0.05% or more and 2.0% or less by weight;

a component D being a drip inhibitor, the content of the component D being 0.05% or more and 1.0% or less by weight; and

a component E being a silicone compound,

wherein the component A has 36000 or more and 58000 or less of weight-average molecular weight in polystyrene equivalent.

2. The resin composition according to claim 1 , wherein the content of the component E is 0.1% or more and 2.0% or less by weight.

3. The resin composition according to claim 1 , wherein the component C is a sulfonic acid of a polymer having an aromatic ring or a sulfonic acid metal salt of a polymer having an aromatic ring.

4. The resin composition according to claim 1 , wherein the component D is a polytetrafluoroethylene having fibril-forming abilities.

5. A resin composition consisting of:

a component A consisting of a polycarbonate resin or a mixture of polycarbonate resins;

a component B being talc having an average median diameter of 4.6 μm or more and 6.0 μm or less;

a component C being an organic sulfonic acid or an organic sulfonic acid metal salt; and

a component D being a drip inhibitor,

wherein the component A has 36000 or more and 58000 or less of weight-average molecular weight in polystyrene equivalent.

6. A resin molded object comprising a resin composition that consists of:

a component A consisting of a polycarbonate resin or a mixture of polycarbonate resins;

a component B being talc, the content of the component B being 5% or more and 20% or less by weight;

a component C being an organic sulfonic acid or an organic sulfonic acid metal salt, the content of the component C being 0.05% or more and 2.0% or less by weight;

a component D being a drip inhibitor, the content of the component D being 0.05% or more and 1.0% or less by weight; and

a component E being a silicone compound,

wherein the component A has 36000 or more and 58000 or less of weight-average molecular weight in polystyrene equivalent.

7. The resin composition according to claim 1 , wherein among hydrogen atoms in the silicon compound:

a proportion of the hydrogen atoms in the methyl groups ranges from 50% or more to 78% or less; and

a proportion of the hydrogen atoms that are bonded directly to silicon ranges from 22% or more to 50% or less.

8. The resin composition according to claim 1 , wherein among hydrogen atoms in the silicon compound:

a proportion of the hydrogen atoms in phenyl groups is 51% or more; and

a proportion of the hydrogen atoms is methyl groups is 29% or more.

9. The resin molded object according to claim 1 , wherein among hydrogen atoms in the silicon compound:

a proportion of the hydrogen atoms in phenyl groups is 50% or more; and

a proportion of the hydrogen atoms that are bonded directly to silicon is 22% or more.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 20, 2015
From: UEDA, KENJI; INAGAKI, YASUHITO; OHE, TAKAHIRO; YAMADA, ATSUSHI
To: SONY CORPORATION
Reel/Frame 035060/0301 →
Priority Claims (1)
JP 2012-192672 · Aug 31, 2012 · national
Continuity (1)
Related Publication 20150218370A1 · Aug 6, 2015