Broadcast signal receiving apparatus and multi-layer printed circuit board

1. A broadcast signal receiving apparatus comprising:

a multi-layer printed circuit board comprising a transmission line configured to connect with at least one component mounted on the multi-layer printed circuit board, the at least one component being configured to process a broadcast signal received from an outside of the apparatus through a cable,

wherein a signal line for receiving the broadcast signal is at least partially provided on an inner layer of the multi-layer printed circuit board,

wherein an impedance of the inner layer where the signal line is provided is a predetermined reference value configured to decrease distortion of the broadcast signal due to interference with an external signal.

2. The broadcast signal receiving apparatus according to claim 1 , wherein the external signal is configured to have a frequency band overlapped with a frequency band of the broadcast signal.

3. The broadcast signal receiving apparatus according to claim 1 , wherein the reference value is determined so that a magnitude of a predetermined parameter measured in the multi-layer printed circuit board configured to have impedance corresponding to the reference value satisfies regulations at a predetermined frequency band.

4. The broadcast signal receiving apparatus according to claim 1 , wherein the signal line is formed as a pattern on the inner layer of the multi-layer printed circuit board, and a thickness of the pattern and a distance between the pattern and both ground surfaces are configured so that the impedance of the inner layer corresponds to the reference value.

5. The broadcast signal receiving apparatus according to claim 1 , wherein the multi-layer printed circuit board is configured to have a multi-layered structure comprising first to fourth layers, and

the signal line corresponding to a signal input portion is provided on one from among a second layer and a third layer of the multi-layer printed circuit board.

6. The broadcast signal receiving apparatus according to claim 1 , wherein the multi-layer printed circuit board is configured to have a multi-layered structure comprising first to sixth layers, and

the signal line corresponding to a signal input portion is provided on one from among a second layer and a fourth layer of the multi-layer printed circuit board.

7. The broadcast signal receiving apparatus according to claim 1 , wherein the signal line is shielded from an external interference signal by an outer layer and by a portion of the inner layer where the signal line is not provided.

8. The broadcast signal receiving apparatus according to claim 1 , further comprising:

a filter configured to filter the broadcast signal received from the outside of the apparatus through the cable; and

a low noise amplifier configured to amplify the filtered broadcast signal,

wherein the filtered broadcast signal is input to the low noise amplifier through the signal line provided on the inner layer.

9. The broadcast signal receiving apparatus according to claim 1 , wherein the inner layer comprises one from among a ground layer or a power layer.

10. A multi-layer printed circuit board inside a broadcast signal receiving apparatus, the multi-layer printed circuit board comprising:

a transmission line configured to connect with at least one component mounted on a topmost layer of the multi-layer printed circuit board, the at least one component being configured to process a broadcast signal received from an outside of the apparatus through a cable,

wherein a signal line for receiving the broadcast signal is at least partially provided on an inner layer of the multi-layer printed circuit board,

wherein an impedance of the inner layer where the signal line is provided is a predetermined reference value configured to decrease distortion of the broadcast signal due to interference with an external signal.

11. The multi-layer printed circuit board according to claim 10 , wherein the external signal is configured to have a frequency band overlapped with a frequency band of the broadcast signal.

12. The multi-layer printed circuit board according to claim 10 , wherein the reference value is determined so that a magnitude of a predetermined parameter measured in the multi-layer printed circuit board configured to have impedance corresponding to the reference value satisfies regulations at a predetermined frequency band.

13. The multi-layer printed circuit board according to claim 10 , wherein the signal line is formed as a pattern on the inner layer of the multi-layer printed circuit board, and a thickness of the pattern and each of a distance between the pattern and both ground surfaces are configured so that the impedance of the inner layer corresponds to the reference value.

14. The multi-layer printed circuit board according to claim 10 , wherein the multi-layer printed circuit board is configured to have a multi-layered structure comprising first to fourth layers, and

the signal line corresponding to a signal input portion is provided on one from among second layer and a third layer of the multi-layer printed circuit board.

15. The multi-layer printed circuit board according to claim 10 , wherein the multi-layer printed circuit board is configured to have a multi-layered structure comprising first to sixth layers, and

the signal line corresponding to a signal input portion is provided on one from among a second layer and a fourth layer of the multi-layer printed circuit board.

16. The multi-layer printed circuit board according to claim 10 , wherein the signal line is shielded from an external interference signal by an outer layer and by a portion of the inner layer where the signal line is not provided.

17. The multi-layer printed circuit board according to claim 10 , further comprising:

a filter configured to filter the broadcast signal received from the outside of the apparatus through the cable; and

a low noise amplifier configured to amplify the filtered broadcast signal,

wherein the filtered broadcast signal is input to the low noise amplifier through the signal line provided on the inner layer.

18. The multi-layer printed circuit board according to claim 10 , wherein the inner layer comprises one from among a ground layer or a power layer.