Method of manufacturing semiconductor device package

1. A method of manufacturing a semiconductor device package, the method comprising:

forming a base frame provided with an outer frame, a plurality of unit frames spaced apart from the outer frame, and a first connector and a second connector forming connections between each of the plurality of unit frames and the outer frame;

forming a package body in each of the plurality of unit frames to provide a mounting area in each unit frame;

removing one of the first connector and the second connector connected to each unit frame; and

mounting a semiconductor device in the mounting area of each unit frame after the removing one of the first connector and the second connector connected to each unit frame.

2. The method of claim 1 , wherein the plurality of unit frames are disposed at intervals, and

the first connector and the second connector are disposed on both sides of each unit frame facing one another.

3. The method of claim 2 , wherein the first connector and the second connector extend in a first direction, and

one of the first connector and the second connector disposed between the plurality of unit frames further extends in a second direction perpendicular to the first direction so as to be connected to the outer frame.

4. The method of claim 1 , wherein each unit frame includes a first lead frame and a second lead frame, and

the first connector and the second connector are each connected to both sides of the first lead frame and the second lead frame.

5. The method of claim 1 , wherein the mounting of a semiconductor device in the mounting area of each unit frame comprises:

mounting in a flip chip bonding manner using a solder interposed between the mounting area and the semiconductor device.

6. The method of claim 1 , wherein the removing of one of the first connector and the second connector connected to each unit frame comprises:

cutting and removing one of the first connector and the second connector in a state in which the outer frame and the package body are supported on a die.

7. The method of claim 1 , further comprising: separating of each unit frame from the base frame, including:

cutting and separating the other of the first connector and the second connector connected to each unit frame in the state in which the outer frame is supported on a die.

8. The method of claim 1 , further comprising:

forming an encapsulating portion to encapsulate the semiconductor device mounted in the mounting area.

9. The method of claim 8 , wherein the package body is provided with a recess opening the mounting area and accommodating the semiconductor device, and

the encapsulating portion is formed to fill the recess.

10. The method of claim 1 , wherein the removing of one of the first connector and the second connector connected to each unit frame comprises:

cutting and removing one of the first connector and the second connector disposed between the plurality of unit frames.

11. The method of claim 1 , wherein the removing of one of the first connector and the second connector connected to each unit frame is a trimming process that comprises:

cutting and removing one of the first connector and the second connector in a state in which the outer frame and the package body are supported on a die,

wherein each unit frame and the outer frame maintain a connection via the other of the first connector and the second connector that is not cut.

12. The method of claim 1 , wherein the forming a package body in each of the plurality of unit frames to provide a mounting area in each unit frame is performed after the removing one of the first connector and the second connector connected to each unit frame.

13. The method of claim 1 , wherein the forming a package body in each of the plurality of unit frames to provide a mounting area in each unit frame, the mounting a semiconductor device in the mounting area of the unit frame, and the removing one of the first connector and the second connector connected to each unit frame are sequentially performed.

14. The method of claim 1 , wherein the mounting a semiconductor device in the mounting area of each unit frame is performed before the removing one of the first connector and the second connector connected to each unit frame.

15. The method of claim 1 , further comprising:

cutting the other of the first connector and the second connector connected to each unit frame after mounting the semiconductor device in the mounting area of each unit frame.

16. The method of claim 1 , wherein removing the one of the first connector and the second connector connected to each unit frame is performed before mounting the semiconductor device in the mounting area of each unit frame.

17. The method of claim 1 , wherein the forming a package body in each of the plurality of unit frames is performed before the removing one of the first connector and the second connector connected to each unit frame.

18. The method of claim 15 , wherein the forming a package body in each of the plurality of unit frames is performed before the removing one of the first connector and the second connector connected to each unit frame.

19. The method of claim 1 , wherein:

the plurality of unit frames are spaced apart from the outer frame by separating grooves interposed therebetween;

forming the package body in each of the plurality of unit frames includes forming the package body in each of the plurality of unit frames to allow a mounting area in each unit frame to be open;

and further comprising:

after the mounting the semiconductor device in the mounting area, cutting the other of the first connector and the second connector connected to each unit frame, and separating, from the base frame, the unit frame in which the package body is formed.