Method of forming a chip assembly with a die attach liquid
A method of forming a chip assembly may include forming a plurality of cavities in a carrier; The method may further include arranging a die attach liquid in each of the cavities; arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier; evaporating the die attach liquid; and after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.
1. A method of forming a chip assembly, the method comprising:
forming a plurality of cavities in a carrier;
arranging a die attach liquid in each of the cavities;
arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization and a rear side interconnect material disposed over the rear side metallization, wherein the rear side interconnect material faces the carrier;
evaporating the die attach liquid; and
after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.
2. The method of claim 1 , further comprising:
holding the plurality of chips, by a holding force, in respective positions in which they are arranged.
3. The method of claim 2 ,
wherein the holding force is provided by the die attach liquid.
4. The method of claim 1 ,
wherein the evaporating of the die attach liquid comprises heating the chip assembly.
5. The method of claim 1 ,
wherein the die attach liquid evaporates essentially completely.
6. The method of claim 1 ,
wherein the die attach liquid comprises an organofluorine compound.
7. The method of claim 1 ,
wherein the die attach liquid comprises a hydrofluoroether.
8. The method of claim 1 ,
wherein the die attach liquid comprises an alcohol or secondary alcohol.
9. The method of claim 1 ,
wherein the fixing the plurality of chips to the carrier comprises heating the chip assembly.
10. The method of claim 1 ,
wherein the fixing the plurality of chips to the carrier comprises diffusion soldering.
11. The method of claim 1 ,
wherein the fixing the plurality of chips to the carrier comprises pressing the plurality of chips onto the carrier until the plurality of chips is flush with a top side of the carrier outside the cavities.
12. The method of claim 1 ,
wherein the forming the plurality of cavities in the carrier comprises forming the plurality of cavities with side walls inclined away from the cavity in a direction from a bottom of the cavity to a top of the cavity.
13. The method of claim 1 , further comprising:
forming a rear side interconnect material repellent coating on at least one of: side walls of the plurality of cavities and side walls of the plurality of chips.
14. The method of claim 1 , further comprising:
forming a barrier coating for the rear side interconnect material on at least one of: side walls of the plurality of cavities and/or the side walls of the plurality of chips.
15. The method of claim 1 , further comprising:
forming a metallic coating for improved wetting or intermetallic formation on the bottom or on at least one of the side walls of the cavities.
16. A method of forming a chip assembly, the method comprising:
forming a plurality of cavities in a carrier;
disposing a carrier interconnect material over a bottom of each of the cavities;
arranging a die attach liquid in each of the cavities;
arranging a plurality of chips on the die attach liquid, each chip comprising a rear side metallization;
evaporating the die attach liquid; and
after the evaporating the die attach liquid, fixing the plurality of chips to the carrier.