Systems, methods and apparatus for post-chemical mechanical planarization substrate cleaning
Embodiments of the invention include systems, methods and apparatus for pre-cleaning a substrate after chemical mechanical planarization processing. Embodiments provide a housing; a chuck assembly configured to securely hold a substrate within the housing; and a buffing pad assembly configured to rotate against the substrate while supported within the housing. The buffing pad assembly includes a buff pad, a compressible sub-pad coupled to the buff pad, and a pad holder coupled to the compressible sub-pad and a buffing motor configured to rotate the buffing pad assembly. Numerous additional aspects are disclosed.
1. A substrate pre-clean system comprising:
a housing;
a chuck assembly configured to securely hold a substrate within the housing; and
a buffing pad assembly configured to rotate against the substrate and supported within the housing,
wherein the buffing pad assembly includes:
a buff pad,
a compressible sub-pad coupled to the buff pad, and
a pad holder coupled to the compressible sub-pad and a buffing motor configured to rotate the buffing pad assembly.
2. The substrate pre-clean system of claim 1 wherein the compressible sub-pad is greater than two times more compressible than the buff pad.
3. The substrate pre-clean system of claim 1 wherein the compressible sub-pad is adapted to yield when the pad holder tilts during pre-cleaning so that the buff pad remains flat against the substrate.
4. The substrate pre-clean system of claim 1 wherein the system is adapted to pre-clean substrates after chemical mechanical planarization processing and before application of a cleaning module.
5. The substrate pre-clean system of claim 1 wherein the buffing pad assembly further includes a stiffener layer between the buff pad and the compressible sub-pad.
6. The substrate pre-clean system of claim 1 wherein at least one of adhesive, thermal bonding, and mechanical fasteners is used to couple the buff pad and the compressible sub-pad together within the buffing pad assembly.
7. The substrate pre-clean system of claim 1 wherein the buffing pad assembly has a diameter that is smaller than the diameter of the substrate.
8. A pre-clean buffing pad assembly comprising:
a buff pad;
a compressible sub-pad coupled to the buff pad; and
a pad holder coupled to the compressible sub-pad and a buffing motor configured to rotate the buffing pad assembly against a substrate.
9. The pre-clean buffing pad assembly of claim 8 wherein the compressible sub-pad is greater than two times more compressible than the buff pad.
10. The pre-clean buffing pad assembly of claim 8 wherein the compressible sub-pad is adapted to yield when the pad holder tilts during pre-cleaning so that the buff pad remains flat against the substrate.
11. The pre-clean buffing pad assembly of claim 8 wherein the buffing pad assembly is adapted to be used to pre-clean substrates after chemical mechanical planarization processing and before application of a cleaning module.
12. The pre-clean buffing pad assembly of claim 8 wherein the buffing pad assembly further includes a stiffener layer between the buff pad and the compressible sub-pad.
13. The pre-clean buffing pad assembly of claim 8 wherein at least one of adhesive, thermal bonding, and mechanical fasteners is used to couple the buff pad and the compressible sub-pad together within the buffing pad assembly.
14. The pre-clean buffing pad assembly of claim 8 wherein the buffing pad assembly has a diameter that is smaller than the diameter of the substrate.
15. A method of pre-cleaning substrates in a substrate pre-clean module, comprising:
loading a substrate into a pre-clean system after chemical mechanical planarization processing;
securing the substrate to a chuck assembly;
rotating the substrate as a rotating buffing pad assembly is pressed against, rotated, and swept across the front side of the substrate; and
maintaining a buff pad of the buffing pad assembly flat against the substrate despite tilting of a pad holder of the buffing pad assembly.
16. The method of claim 15 further comprising providing a buffing pad assembly including a compressible sub-pad wherein the compressible sub-pad is greater than two times more compressible than the buff pad.
17. The method of claim 15 further comprising providing a buffing pad assembly including a compressible sub-pad wherein the compressible sub-pad is adapted to yield when the pad holder tilts during pre-cleaning so that the buff pad remains flat against the substrate.
18. The method of claim 15 further comprising providing a buffing pad assembly wherein the buffing pad assembly is adapted to pre-clean substrates after chemical mechanical planarization processing and before application of a cleaning module.
19. The method of claim 15 further comprising providing a buffing pad assembly including a compressible sub-pad and a stiffening layer wherein the stiffener layer is disposed between the buff pad and the compressible sub-pad.
20. The method of claim 15 further comprising providing a buffing pad assembly wherein the buffing pad assembly has a diameter that is smaller than the diameter of the substrate.