Metal via structure
View Patent ↗A filled metal via having an adhesive layer configured on bottom is disclosed. The adhesive layer enhances bonding force between the filled metal via and a bottom element. Further, stacked metal vias can be made to save spaces to enhance circuit density for an electronic system.
1. A metal via structure, comprising:
a bottom metal, having a top surface exposed from a first dielectric layer;
a first adhesive layer, configured on a top surface of the bottom metal;
a first metal block, configured on a top surface of the first adhesive layer; having a top surface coplanar with a top surface of the first dielectric layer;
a second adhesive layer, configured on the top surface of the first dielectric layer; having a first end extended to cover a top surface of the first metal block; and a first metal circuit, configured on a top surface of the second adhesive layer; and
a second dielectric layer, configured on a top surface of the first metal circuit; a top surface of an area of the first metal circuit aligned with the first metal block as seen in a plan view, exposed from the second dielectric laver; a third adhesive layer, configured on the top surface of the exposed area of the first metal circuit; and a second metal block, configured on a top surface of the third adhesive layer, having a top surface coplanar with a top surface of the second dielectric layer.
2. A metal via structure as claimed in claim 1 , wherein the first adhesive layer extends to wrap side surfaces of the first metal block so that the metal block does not contact with the first dielectric layer directly.
3. A metal via structure as claimed in claim 1 , wherein the first metal block is a conductive material selected from a group consisting of Au, Ag, Cu and Al.
4. A metal via structure as claimed in claim 1 , wherein the first adhesive layer is a conductive material selected from a group consisting of Ti, Cr, Nb, W, and TiW.
5. A metal via structure as claimed in claim 1 , wherein the first adhesive layer has a thickness less than 1 um.
6. A metal via structure as claimed in claim 5 , wherein the first adhesive layer has a thickness roughly of 0.3 um.
7. A metal via structure as claimed in claim 1 , wherein the bottom metal is selected from a group consisting of a metal pad, metal circuit, through silicon via, through glass via, and through mold via.
8. A metal via structure as claimed in claim 1 , wherein the first metal circuit is a conductive material selected from a group consisting of Au, Ag, Cu and Al.
9. A metal via structure as claimed in claim 1 , wherein the second adhesive layer is a conductive material selected from a group consisting of Ti, Cr, Nb, W, and TiW.
10. A metal via structure as claimed in claim 1 , wherein the third adhesive layer extends to wrap side surfaces of the second metal block.
11. A metal via structure as claimed in claim 1 , wherein the second metal block is a conductive material selected from a group consisting of Au, Ag, Cu and Al.
12. A metal via structure as claimed in claim 1 , wherein the third adhesive layer is a conductive material selected from a group consisting of Ti, Cr, Nb, W, and TiW.
13. A metal via structure as claimed in claim 1 , wherein the third adhesive layer has a thickness less than 1 um.
14. A metal via structure as claimed in claim 13 , wherein the first adhesive layer has a thickness roughly of 0.3 um.
15. A metal via structure as claimed in claim 1 , further comprising: a fourth adhesive layer, configured on the top surface of the second dielectric layer; having an end extended to cover a top surface of the second metal block; and a second metal circuit, configured on the top surface of the fourth adhesive layer.