Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same
A resin composition containing (A) a polyimide having acidic functional groups and (B) a compound having functional groups that react with the acidic functional groups, where (a) a solution rate in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1, (b) the solution rate in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after the heat history of 180° C. for 60 minutes, (c) a bleed-out amount is 50 mg/m 2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG). When a multilayer flexible wiring board is manufactured using the resin composition, it is possible to obtain the resin layer excellent in alkali processability, embeddability in press, heat resistance, bendability, insulation reliability, and adhesion to the conductive layer.
1. A resin composition containing:
(A) a polyimide having acidic functional groups; and
(B) a compound having functional groups that react with the acidic functional groups,
wherein (a) a solution rate of the resin composition in 3 mass % aqueous sodium hydroxide at 45° C. is 0.95 or more after a heat history of 90° C. for 10 minutes with the solution rate before the heat history assumed to be 1,
wherein (b) the solution rate of the resin composition in 3 mass % aqueous sodium hydroxide at 45° C. ranges from 0.001 μm/sec to 0.02 μm/sec after a heat history of 180° C. for 60 minutes,
wherein (c) a bleed-out amount of the resin composition is 50 mg/m 2 or less in storing at 40° C. for 2 weeks after the heat history of 180° C. for 60 minutes, and
wherein (d) a thermogravimetric decrease at 260° C. is 2.0% or less in measuring on a temperature rising condition of 10° C./min from 40° C. by thermogravimetric analysis (TG), and
wherein the resin composition includes a flame retardant, the flame retardant including a phosphorus-containing compound.
wherein the phosphorus-containing is a phosphazene.
2. The resin composition according to claim 1 , wherein the solution rate of the resin composition in 3 mass % aqueous sodium hydroxide at 45° C. is 0.10 μm/sec or more before the heat history.
3. The resin composition according to claim 1 , wherein the acidic functional groups of the polyimide (A) are of structure containing phenolic hydroxyl groups.
4. The resin composition according to claim 1 , wherein the compound (B) is of structure containing oxazoline groups.
5. A resin composition solution wherein the solution is obtained by dissolving the resin composition according to claim 1 in an organic solvent.
6. A layered product comprising:
a substrate; and
the resin composition according to claim 1 provided on the substrate.
7. The layered product according to claim 6 , wherein the substrate is a carrier film.
8. The layered product according to claim 6 , further comprising:
a cover film provided on the resin composition.
9. The layered product according to claim 6 , wherein the substrate is a conductive material.
10. The layered product according to claim 9 , wherein the conductive material is copper foil.
11. A multilayer printed wiring board comprising:
a substrate having wiring; and
the resin composition according to claim 1 provided to cover the wiring.
12. The multilayer printed wiring board according to claim 11 , wherein the board is in the shape of a roll.
13. A resin composition containing:
(A-1) a polyimide having a structure expressed by following general formula (1) as a polyimide having phenolic hydroxyl groups;
(B-1) an oxazoline compound, and
a flame retardant, the flame retardant including a phosphorus-containing compound, wherein the phosphorus-containing compound is a phosphazene, and
wherein In formula (1), X represents a single bond or —C(CF 3 ) 2 —, and n represents an integer of from 1 to 4.
14. The resin composition according to claim 13 , wherein the polyimide has a structure expressed by following general formula (2),
wherein In formula (2), Y represents a tetravalent organic group containing an aromatic group and/or an alicyclic group.
15. The resin composition according to claim 13 , wherein a ratio (hydroxyl group/oxazoline group) of the hydroxyl groups that the polyimide has to the oxazoline groups that the oxazoline compound (B-1) has is in the range of 4.0 to 0.5.
16. The resin composition according to claim 13 , wherein the polyimide further has a structure of following general formula (3),
wherein in formula (3), Q 1 represents an alkylene group with the carbon number of from 1 to 18, m is an integer of 1 or more, and Q 1 may be different from one another for each repetition unit of m.
17. The resin composition according to claim 16 , wherein the structure of general formula (3) is contained in an amount of 25 to 55 mass % relative to all mass of the polyimide.
18. The resin composition according to claim 16 , wherein the composition contains a structure in which Q 1 in the general formula (3) in the polyimide is a linear tetramethylene group.
19. The resin composition according to claim 13 , wherein the polyimide is terminally blocked with a terminal blocking agent comprised of a monoamine derivative or a carboxylic acid derivative.
20. The resin composition according to claim 13 , wherein a bleed-out amount is 50 mg/m 2 or less in storing at 40° C. for 2 weeks after a heat history of 180° C. for 60 minutes.
21. The resin composition according to claim 13 , wherein a content of (C) a polyfunctional hydroxyl group-containing compound having two or more hydroxyl groups ranges from 0 to 3 mass %.