Substrate liquid treatment apparatus, substrate liquid treatment method and storage medium
A substrate liquid treatment method includes: (a) rotating the substrate about the vertical axis; (b) supplying the treatment liquid to the rotating substrate from the second nozzle with a falling point of the treatment liquid supplied from the second nozzle moving from the central portion to the peripheral portion of the substrate, while supplying the treatment liquid to the central portion of the substrate from the first nozzle, (c) after (b), moving the second nozzle from the peripheral portion to the central portion of the substrate with the supplying of the treatment liquid from the second nozzle being stopped, while continuing supplying the treatment liquid to the central portion of the rotating substrate from the first nozzle; and (d) after (c), supplying the treatment liquid to the rotating substrate from the second nozzle.
1. A substrate liquid treatment apparatus comprising:
a substrate holding unit that holds a substrate;
a rotary driving unit that rotates the substrate holding unit about a vertical axis;
a first nozzle that supplies a treatment liquid at least onto a central portion of the substrate held by the substrate holding unit;
a second nozzle that supplies the treatment liquid onto the substrate held by the substrate holding unit;
a first liquid supplying unit that supplies the treatment liquid to the first nozzle;
a second liquid supplying unit that supplies the treatment liquid to the second nozzle;
a second nozzle moving mechanism that moves the second nozzle between the central portion and a peripheral portion of the substrate held by the substrate holding unit; and
a control unit that controls operations at least of the first liquid supplying unit, the second liquid supplying unit and the second nozzle moving mechanism,
wherein the control unit is configured to:
make the second nozzle move from the central portion toward the peripheral portion of the substrate while making the second nozzle supply the treatment liquid therefrom and while making the first nozzle supply therefrom the treatment liquid to the central portion of the substrate;
thereafter make the second nozzle move from the peripheral portion toward the central portion of the substrate while making the second nozzle stop supplying the treatment liquid therefrom, while making the first nozzle supply the treatment liquid therefrom; and
thereafter make the second nozzle start supplying the treatment liquid while making the first nozzle supply the treatment liquid therefrom.
2. The substrate liquid treatment apparatus according to claim 1 , further comprising a first nozzle moving mechanism that moves the first nozzle between the central portion and the peripheral portion of the substrate held by the substrate holding unit,
wherein the control unit is also configured to control the first nozzle moving mechanism, and
wherein the control unit is configured to: make the first nozzle supply the treatment liquid therefrom while making the first nozzle move from the central portion to the peripheral portion of the substrate, and while making the second nozzle supply the treatment liquid to the central portion of the substrate, after the second nozzle has moved from the peripheral portion to the central portion of the substrate and has started the supplying of the treatment liquid; thereafter make the first nozzle stop supplying the treatment liquid and make the first nozzle without supplying the treatment liquid move from the peripheral portion toward the central portion of the substrate, while making the second nozzle supply the treatment liquid therefrom; and thereafter make the first nozzle start supplying therefrom the treatment liquid to the substrate while making the second nozzle supply the treatment liquid therefrom.
3. The substrate liquid treatment apparatus according to claim 1 ,
wherein the control unit is configured to make second nozzle move from the central portion toward the peripheral portion of the substrate while making the second nozzle supply the treatment liquid, while making the first nozzle supply the treatment liquid to the central portion of the substrate, after the second nozzle has moved from the peripheral portion to the central portion of the substrate and has started the supplying of the treatment liquid.
4. The substrate liquid treatment apparatus according to claim 2 ,
wherein the control unit is configured to control a treatment liquid supply rate at which the second nozzle is supplying the treatment liquid to the central portion of the substrate so as to be larger than a treatment liquid supply rate at which the second nozzle is supplying the treatment liquid while moving from the central portion to the peripheral portion of the substrate.
5. The substrate liquid treatment apparatus according to claim 2 , wherein:
the control unit is configured to control a treatment liquid supply rate at which the second nozzle is supplying the treatment liquid to the central portion of the substrate so as to be larger than a treatment liquid supply rate at which the second nozzle is supplying the treatment liquid while moving from the central portion to the peripheral portion of the substrate; and
the control unit is configured to control a treatment liquid supply rate at which the first nozzle is supplying the treatment liquid to the central portion of the substrate so as to be larger than a treatment liquid supply rate at which the first nozzle is supplying the treatment liquid while moving from the central portion to the peripheral portion of the substrate.
6. The substrate liquid treatment apparatus according to claim 5 ,
wherein the control unit is configured to lower a treatment liquid supply rate at which the first nozzle is supplying the treatment liquid, after the first nozzle has started to move from the central portion toward the peripheral portion of the substrate.
7. The substrate liquid treatment apparatus according to claim 1 ,
wherein the control unit is configured to control a moving speed at which the second nozzle is moving from the peripheral portion toward the central portion of the substrate so as to be higher than a moving speed at which the second nozzle is moving from the central portion toward the peripheral portion of the substrate.
8. The substrate liquid treatment apparatus according to claim 2 , wherein:
wherein the control unit is configured to control a moving speed at which the second nozzle is moving from the peripheral portion toward the central portion of the substrate so as to be higher than a moving speed at which the second nozzle is moving from the central portion toward the peripheral portion of the substrate; and
wherein the control unit is configured to control a moving speed at which the first nozzle is moving from the peripheral portion toward the central portion of the substrate so as to be higher than a moving speed at which the first nozzle is moving from the central portion toward the peripheral portion of the substrate.
9. A substrate liquid treatment method employing a substrate liquid treatment apparatus including:
a substrate holding unit that holds a substrate;
a rotary driving unit that rotates the substrate holding unit about an vertical axis;
a first nozzle that supplies a treatment liquid at least onto a central portion of the substrate held by the substrate holding unit;
a second nozzle that supplies the treatment liquid onto the substrate held by the substrate holding unit;
a first liquid supplying unit that supplies the treatment liquid to the first nozzle;
a second liquid supplying unit that supplies the treatment liquid to the second nozzle; and
a second nozzle moving mechanism that moves the second nozzle between the central portion and a peripheral portion of the substrate held by the substrate holding unit,
said substrate liquid treatment method comprising:
(a) rotating the substrate about the vertical axis;
(b) supplying the treatment liquid to the rotating substrate from the second nozzle with a falling point of the treatment liquid supplied from the second nozzle moving from the central portion to the peripheral portion of the substrate, while supplying the treatment liquid to the central portion of the substrate from the first nozzle;
(c) after (b), moving the second nozzle from the peripheral portion to the central portion of the substrate with the supplying of the treatment liquid from the second nozzle being stopped, while continuing supplying the treatment liquid to the central portion of the rotating substrate from the first nozzle; and
(d) after (c), supplying the treatment liquid to the rotating substrate from the second nozzle.
10. The substrate liquid treatment method according to claim 9 , further comprising:
(e) after (d), supplying the treatment liquid to the rotating substrate from the first nozzle with a falling point of the treatment liquid supplied from the first nozzle moving from the central portion to the peripheral portion of the substrate, while supplying the treatment liquid to the central portion of the substrate from the second nozzle.
11. The substrate liquid treatment method according to claim 9 , further comprising:
(f) after (d), supplying the treatment liquid to the rotating substrate from the second nozzle with a falling point of the treatment liquid supplied from the second nozzle moving from the central portion to the peripheral portion of the substrate, while continuing supplying the treatment liquid to the central portion of the substrate from the first nozzle.
12. The substrate liquid treatment method according to claim 10 , wherein:
a treatment liquid supply rate at which the second nozzle is supplying the treatment liquid to the central portion of the substrate is controlled so as to be larger than a treatment liquid supply rate at which the second nozzle is supplying the treatment liquid while moving from the central portion to the peripheral portion of the substrate; and
a treatment liquid supply rate at which the first nozzle is supplying the treatment liquid to the central portion of the substrate is controlled so as to be larger than a treatment liquid supply rate at which the first nozzle is supplying the treatment liquid while moving from the central portion to the peripheral portion of the substrate.
13. The substrate liquid treatment method according to claim 9 , wherein the treatment liquid has a temperature higher than normal temperature.
14. The substrate liquid treatment method according to claim 9 , wherein the treatment liquid is a cleaning liquid or an etching liquid.
15. A non-transitory storage medium storing a program configured such that, upon execution of which by a computer for controlling operations of a substrate liquid treatment apparatus, the computer controls the substrate liquid treatment apparatus to perform the substrate liquid treatment method according to claim 9 .