Non-volatile resistance-switching thin film devices
Disclosed herein are resistive switching devices having, e.g., an amorphous layer comprised of an insulating aluminum-based or silicon-based material and a conducting material. The amorphous layer may be disposed between two or more electrodes and be capable of switching between at least two resistance states. Circuits and memory devices including resistive switching devices are also disclosed, and a composition of matter involving an insulating aluminum-based or an silicon-based material and a conducting material. Also disclosed herein are methods for switching the resistance of an amorphous material.
1. A resistive device, comprising:
at least one amorphous layer that comprises:
a composition comprising:
an electrically insulating composition that comprises N and both Al and Si;
an electrically conducting composition that comprises
(a) a metal M, wherein M comprises Pt, Pd, Ni, W, Au, Ag, Cu, Al, Rh, Re, Ir, Os, Ru, Nb, Ti, Zr, Hf, V, Ta, Cr, Mo, Mn, Tc, Fe, Co, Zn, Ga, In, Cd, Hg, Tl, Sn, Pb, Sb, Bi, Be, Mg, Ca, Sr, Ba, Li, Na, K, Rb, Cs,
(b) a conducting metal (Me) nitride, MeN x , wherein x is in the range of from about 0.5 to about 3,
or any combination of (a) and (b), and
wherein the electrically conducting composition comprises from about 1 percent to about 40 percent by molar percentage of the amorphous layer, wherein the molar percentage of the electrically conducting composition is defined as (% M+% Me)/(% Al+% Si+% M+% Me)×100, according to the M and Me present in the electrically conducting composition and Al and Si present in the electrically insulating composition; and
at least two electrodes in electrical contact with one another via the amorphous layer.
2. The resistive device of claim 1 , wherein the electrically insulating composition comprises an oxynitride of Al and an oxynitride of Si.
3. The resistive device of claim 2 , wherein the electrically insulating composition comprises one or more of Si 3-x Al x N 4-x O x , termed SiAlON, wherein 3>x>0.
4. The resistive device of claim 2 , wherein the electrically insulating composition comprises doped (Si,Al)(O,N).
5. The resistive device of claim 1 , wherein the electrically conducting composition comprises from about 1 percent to about 35 percent by molar percentage of the amorphous layer.
6. The resistive device of claim 1 , wherein the distance between the at least two electrodes is from about 2 to about 60 nm.
7. A method for switching a resistive device, comprising:
to the resistive device comprising:
at least one amorphous layer that comprises:
a composition comprising:
an electrically insulating composition that comprises N and both Al and Si;
an electrically conducting composition that comprises
(a) a metal M, wherein M comprises Pt, Pd, Ni, W, Au, Ag, Cu, Al, Rh, Re, Ir, Os, Ru, Nb, Ti, Zr, Hf, V, Ta, Cr, Mo, Mn, Tc, Fe, Co, Zn, Ga, In, Cd, Hg, Tl, Sn, Pb, Sb, Bi, Be, Mg, Ca, Sr, Ba, Li, Na, K, Rb, Cs,
(b) a conducting metal (Me) nitride, MeN x , wherein x is in the range of from about 0.5 to about 3,
or any combination of (a) and (b), and
wherein the electrically conducting composition comprises from about 1 percent to about 40 percent by molar percentage of the amorphous layer, wherein the molar percentage of the electrically conducting composition is defined as (% M+% Me)/(% Al+% Si+% M+% Me)×100, according to the M and Me present in the electrically conducting composition and Al and Si present in the electrically insulating composition; and
at least two electrodes in electrical contact with one another via the amorphous layer,
providing a first current or voltage via the electrodes to the amorphous layer so as to change a resistance state of the resistive device.