IP Library › Granted Patent US 9,935,237
Granted Patent B2
US 9,935,237 · App. 15/069,262 · Granted Apr 3, 2018

Solid state lighting devices with dielectric insulation and methods of manufacturing

Inventor: Scott D. Schellhammer (Meridian, ID)
Assignee: Micron Technology, Inc.
H01L33/025H01L33/0095H01L33/06H01L33/24H01L33/32
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Quick Facts
Patent No.
US 9,935,237
App. No.
15/069,262
Granted
Apr 3, 2018
Kind
B2
Abstract

Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state lighting device includes a first semiconductor material, a second semiconductor material spaced apart from the first semiconductor material, and an active region between the first and second semiconductor materials. The solid state lighting device also includes an indentation extending from the second semiconductor material toward the active region and the first semiconductor material and an insulating material in the indentation of the solid state lighting structure.

Claims (19)

1. A solid state lighting device, comprising:

a solid state lighting structure having:

a first semiconductor material;

a second semiconductor material spaced apart from the first semiconductor material;

an active region between the first and second semiconductor materials and having a topmost surface;

an indentation defining sidewalls extending through the active region and at least partially through the first semiconductor material;

a conductive material over and in contact with the second semiconductor material; and

an insulating material in the indentation of the solid state lighting structure and electrically insulating at least a portion of the first semiconductor material from the second semiconductor material,

wherein the second semiconductor material includes a first portion in contact with the topmost surface of the active region and a second portion between the sidewalls of the indentation and separated from the active region.

2. The solid state lighting device of claim 1 wherein:

the topmost surface of the active region faces away from the first semiconductor material and toward the conductive material.

3. The solid state lighting device of claim 1 wherein:

the topmost surface of the active region faces away from the first semiconductor material; and

the insulating material is between at least a portion of the first semiconductor material and the second semiconductor material and between the active region and at least a portion of the second semiconductor material.

4. The solid state lighting device of claim 1 wherein the insulating material includes a continuous upper surface having a portion above or generally coplanar with the topmost surface of the active region.

5. The solid state lighting device of claim 4 wherein the portion of the continuous upper surface is a first portion, and wherein the insulating material further includes a second portion below the topmost surface of the active region and in contact with the second portion of the second semiconductor material.

6. The solid state lighting device of claim 1 wherein the conductive material is over substantially all of the second semiconductor material.

7. The solid state lighting device of claim 1 wherein the topmost surface of the active region corresponds to a first plane, and wherein the first portion of the second semiconductor material is above the first plane and the second portion of the second semiconductor material is below the first plane.

8. The solid state lighting device of claim 1 wherein the second portion of the second semiconductor material is in contact with the insulating material in the indentation.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 14, 2016
From: SCHELLHAMMER, SCOTT D.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 037968/0019 →
Continuity (2)
Division 12853014 · Aug 9, 2010
Related Publication 20160197231A1 · Jul 7, 2016