Chip electronic component and manufacturing method thereof
There are provided a chip electronic component comprising: a magnetic body including an insulation substrate; an internal coil part formed on at least one surface of the insulation substrate; and an external electrode formed on an end surface of the magnetic body and connected to the internal coil part, wherein the internal coil part includes a first coil pattern formed on the insulation substrate and a second coil pattern formed to coat the first coil pattern, and a ratio a/b of a width a of an upper surface of the first coil pattern with respect to a width b of a lower surface of the first coil pattern is less than 1.
1. A chip electronic component comprising:
a magnetic body including an insulation substrate;
an internal coil part disposed on at least one surface of the insulation substrate; and
an external electrode disposed on an end surface of the magnetic body and connected to the internal coil part,
wherein the internal coil part includes
a first coil pattern disposed on the insulation substrate and
a second coil pattern disposed on the first coil pattern as a coating layer to coat an upper surface and side surfaces of the first coil pattern,
a ratio a/b is less than 1 and a ratio a/b is less than a ratio a′/b′ where a represents a width of an upper surface of the first coil pattern, b represents a width of a lower surface of the first coil pattern, a′ represents a width of an upper surface of the internal coil part, and b′ represents a width of a lower surface of the internal coil part, and
the second coil pattern is a plating layer disposed to coat the first coil pattern.
2. The chip electronic component of claim 1 , wherein the ratio a/b of the width a of the upper surface of the first coil pattern with respect to the width b of the lower surface thereof satisfies 0.5≤a/b<1.
3. The chip electronic component of claim 1 , wherein a cross-section of the first coil pattern may have a thickness direction trapezoidal shape of which a length of a lower surface is greater than that of an upper surface.
4. The chip electronic component of claim 1 , wherein the width b of the lower surface of the first coil pattern is 90 μm to 110 μm.
5. The chip electronic component of claim 1 , wherein the width a of the upper surface of the first coil pattern is 70 μm to 90 μm.
6. The chip electronic component of claim 1 , wherein the internal coil part further comprises a third coil pattern formed to coat the second coil pattern.
7. The chip electronic component of claim 1 , wherein a ratio a′/b′ of a width a′ of an upper surface of the internal coil part with respect to a width b′ of a lower surface thereof is less than 1.
8. The chip electronic component of claim 1 , wherein the internal coil part contains one or more selected from a group consisting of silver (Ag), palladium (Pd), aluminum (Al), nickel (Ni), titanium (Ti), gold (Au), copper (Cu), and platinum (Pt).
9. The chip electronic component of claim 1 , wherein the first coil pattern and the second coil pattern are formed of a single type of metal.
10. The chip electronic component of claim 1 , wherein the internal coil part has an aspect ratio of 1.1 or more.
11. The chip electronic component of claim 1 , wherein the first coil pattern is a seed layer of the plating layer of the second coil pattern.
12. The chip electronic component of claim 1 , wherein the internal coil part further comprises a third coil pattern formed to coat the second coil pattern and formed of a same type of metal as the second coil pattern.
13. The chip electronic component of claim 1 , wherein the internal coil part further comprises a third coil pattern formed to coat the second coil pattern, and the first, second, and third coil patterns are formed of a single type of metal.