Moisture and/or electrically conductive remains detection for wafers after rinse / dry process
A method, device, and apparatus is provided for detecting moisture and/or electrically conductive remains on a wafer after the wafer is removed from a drying chamber of a processing tool that includes wet clean processing. Embodiments include fixing a wafer to an endeffector between a processing chamber and a FOUP, moving the wafer from the processing chamber toward the FOUP, detecting moisture and/or electrically conductive remains on the wafer, and delivering the wafer to the FOUP, if no moisture and/or electrically conductive remains are detected, or delivering the wafer to a buffer station, if moisture and/or electrically conductive remains are detected.
1. An apparatus comprising:
a wafer processing tool including a wafer processing chamber;
a front opening unified pod (FOUP);
an endeffector for transporting wafers, one at a time, between the processing chamber and the FOUP;
a moisture and/or electrically conductive remains detection device connected to the endeffector;
a buffer station; and
a circuit, connected to the moisture and/or electrically conductive remains detection device, the endeffector, and the wafer processing chamber, the circuit configured to disable the processing chamber and to instruct the endeffector to deliver a wafer thereon to the buffer station, if the moisture and/or electrically conductive remains detection device detects moisture and/or conductive remains.
2. The apparatus according to claim 1 , further comprising:
an acoustic and/or visual alarm connected to the circuit, wherein the circuit is further configured to trigger the alarm if the moisture and/or conductive remains detection device detects moisture and/or electrically conductive remains.
3. The apparatus according to claim 1 , further comprising:
a wafer storage unit and a transport device for transporting wafers in the processing tool to the wafer storage device if the moisture and/or electrically conductive remains detection device detects moisture and/or electrically conductive remains.
4. The apparatus according to claim 1 , wherein the wafer processing chamber comprises a wafer drying chamber.
5. The apparatus according to claim 1 , wherein the endeffector has a first surface and a second surface opposite the first surface and includes means for holding a wafer proximate to the first surface.
6. The apparatus according to claim 5 , wherein the moisture and/or electrically conductive remains detection device comprises:
metal structures on the first surface of the endeffector connected to a voltage source; and
a resistance, capacity, and/or inductance sensor connected to the metal structures.
7. An apparatus comprising:
a wafer processing tool including a wafer processing chamber;
a front opening unified pod (FOUP);
an endeffector for transporting a wafer between the processing chamber and the FOUP, the endeffector having a first surface and a second surface, opposite the first surface, the endeffector including grippers and a pin for holding the wafer proximate to the first surface;
a moisture and/or electrically conductive remains detection device connected to the endeffector;
a buffer station; and
a circuit, connected to the moisture and/or electrically conductive remains detection device, the endeffector, and the wafer processing chamber, the circuit configured to disable the processing chamber and to instruct the endeffector to deliver the wafer thereon to the buffer station, if the moisture and/or electrically conductive remains detection device detects moisture and/or conductive remains.
8. The apparatus according to claim 7 , further comprising:
an acoustic and/or visual alarm connected to the circuit, wherein the circuit is further configured to trigger the alarm if the moisture and/or conductive remains detection device detects moisture and/or electrically conductive remains.
9. The apparatus according to claim 7 , further comprising:
a wafer storage unit and a transport device for transporting wafers in the processing tool to the wafer storage device if the moisture and/or electrically conductive remains detection device detects moisture and/or electrically conductive remains.
10. The apparatus according to claim 7 , wherein the wafer processing chamber comprises a wafer drying chamber.
11. The apparatus according to claim 7 , wherein the first surface is opposite the second surface.
12. The apparatus according to claim 11 , wherein the moisture and/or electrically conductive remains detection device comprises:
metal structures on the first surface of the endeffector connected to a voltage source; and
a resistance, capacity, and/or inductance sensor connected to the metal structures.
13. The apparatus according to claim 12 , wherein:
the metal structures are sputtered, printed, or deposited on the first surface of the endeffector, and
the metal structures are resistant against sulfuric acid and chemical blends containing hydrogen peroxide.
14. The apparatus according to claim 12 , wherein the metal structures comprise gold, silver, platinum, titanium, or alloys thereof.