IP Library › Granted Patent US 9,997,379
Granted Patent B2
US 9,997,379 · App. 12/956,988 · Granted Jun 12, 2018

Method and apparatus for wafer wet processing

Inventors: Harald Kraus (Villach, AT); Marco Nardoni (Villach, AT); Michael Brugger (Millstatt, AT)
Assignee: LAM RESEARCH AG
H01L21/67051
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Quick Facts
Patent No.
US 9,997,379
App. No.
12/956,988
Filed
Nov 30, 2010
Granted
Jun 12, 2018
Kind
B2
Art Unit
3743
USPC
34/443
Abstract

A gas dispenser in a process module for wet processing of wafer-shaped articles is substantially smaller than the article to be processed and is movable laterally of the article as it dispenses inert gas above the article.

Claims (12)

1. A method for processing wafer shaped articles, comprising:

positioning a wafer-shaped article on a holder;

positioning a gas dispenser above the wafer-shaped article at a defined operating distance;

dispensing an inert gas above the wafer-shaped article;

dispensing an etching liquid onto the wafer-shaped article simultaneously with said dispensing an inert gas above the wafer-shaped article; and

moving the gas dispenser laterally relative to the wafer-shaped article while dispensing said inert gas;

wherein the etching liquid is dispensed from a nozzle carried by the gas dispenser.

2. The method according to claim 1 , wherein the gas dispenser has a size such that it overlaps the wafer-shaped article in an area that is from 5 to 50% of an area of an upwardly facing surface of the wafer-shaped article.

3. The method according to claim 1 , wherein said dispensing of an inert gas above the wafer-shaped article comprises dispensing inert gas through an annular nozzle in a direction substantially parallel to an upwardly-facing surface of the wafer-shaped article.

4. The method according to claim 1 , wherein said dispensing of an inert gas above the wafer-shaped article comprises dispensing inert gas through a plurality of downwardly directed gas outlets configured to dispense inert gas downwardly toward the wafer-shaped article.

5. The method according to claim 1 , wherein said dispensing of an inert gas above the wafer-shaped article comprises dispensing inert gas through an annular nozzle in a direction substantially parallel to an upwardly-facing surface of the wafer-shaped article, and dispensing inert gas through a plurality of downwardly directed gas outlets configured to dispense inert gas downwardly toward the wafer-shaped article.

6. The method according to claim 5 , wherein inert gas is dispensed through the annular nozzle via outlets surrounding and directed outwardly of the plurality of downwardly directed gas outlets.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 22, 2010
From: KRAUS, HARALD; NARDONI, MARCO; BRUGGER, MICHAEL
To: LAM RESEARCH AG
Reel/Frame 025535/0818 →
Continuity (1)
Related Publication 20120131815A1 · May 31, 2012