Method of producing a hybridized device including microelectronic components

1. A method of producing a hybridized device comprising two microelectronic components, including a first microelectronic component having conductive inserts on a connection surface, and a second microelectronic component having ductile conductive pads on one surface that is opposed to the connection surface of the first microelectronic device,

wherein each conductive insert of the first microelectronic component comprises

a hollow metal core formed of a bottom arranged on the connection surface and of a lateral wall protruding from said bottom, defining an internal surface of the insert, at least a portion of said internal surface being non-oxidized, and

a metal layer substantially only covering the internal surface of the metal core and adapted to contact one of the ductile conductive pads of the second microelectronic component associated with the insert, the metal layer being made of an inoxidizable metal, or the metal layer comprising a first metal sub-layer non-oxidized over at least a portion of its surface, covering at least the non-oxidized portion of the internal surface of the core, wherein the first sub-layer has a greater plasticity than the core, and a second sub-layer covering at least the first sub-layer over its non-oxidized portion and having a lower plasticity than the first sub-layer, and

wherein the pads of the second microelectronic component are made of a material with a lower hardness than that of the metal core of the hollow inserts of the first microelectronic component,

the method comprising the steps of:

hybridizing the first and second microelectronic components face-to-face by arranging the connection surface of the first microelectronic component to oppose the surface of the second microelectronic component having the ductile conductive pads; and

establishing an electro-mechanical connection between the first microelectronic component and the second microelectronic component by inserting, at ambient temperature, the inserts of the first microelectronic component, provided with the second metal sub-layer, into the ductile conductive pads of the second microelectronic component.

2. The method of claim 1 , wherein an interconnect pitch between the first and second microelectronic components is smaller than 10 micrometers.

3. The method of claim 1 , wherein the first sub-layer is made of an oxidizable metal and wherein the second sub-layer is made by oxidizing the first sub-layer to create a layer of native oxide of the metal forming the first sub-layer having a plasticity lower than that of the first sub-layer.

4. The method of claim 3 , wherein the first sub-layer is made of aluminum, and the second sub-layer is made of an aluminum oxide.

5. The method of claim 1 , wherein the hollow metal core is made of a hard material.

6. The method of claim 5 , wherein the hard material is selected from the group consisting of titanium nitride, tungsten nitride, copper, vanadium, molybdenum, nickel, titanium tungstenate, WSi, and tungsten.

7. The method of claim 1 , wherein the adherence of the second sub-layer to the first sub-layer is low so that the second sub-layer slides on the first sub-layer under the effect of a shearing applied to the stack of the first and second sub-layers.

8. The method of claim 1 , wherein the first sub-layer has a ductility substantially equal to that of the pads.

9. The method of claim 1 , wherein the inoxidizable metal is a noble metal.