Image sensor having first fixed charge film for anti-reflection and second fixed charge film for moisture protection
An image sensor includes a substrate including a plurality of photoelectric conversion parts and a pixel isolation trench extending from a surface of the substrate between the photoelectric conversion parts, a first fixed charge film directly on the surface of the substrate, a second fixed charge film directly on the first fixed charge film and an inner wall of the pixel isolation trench, and an insulating layer directly on the second fixed charge film, the insulating layer configured to fill the pixel isolation trench.
1. An image sensor comprising:
a substrate including a plurality of photoelectric conversion parts and a pixel isolation trench extending from a surface of the substrate between the photoelectric conversion parts;
a first fixed charge film directly on the surface of the substrate;
a second fixed charge film directly on the first fixed charge film and an inner wall of the pixel isolation trench; and
an insulating layer directly on the second fixed charge film, the insulating layer configured to fill the pixel isolation trench.
2. The image sensor of claim 1 , wherein
the first fixed charge film and the second fixed charge film include a metal oxide; and
the insulating layer includes a non-metal oxide.
3. The image sensor of claim 2 , wherein the first fixed charge film includes one of hafnium oxide, hafnium silicon oxide, titanium oxide, zirconium oxide, magnesium oxide, tantalum oxide, scandium oxide, lutetium oxide, yttrium oxide, and lanthanum oxide.
4. The image sensor of claim 2 , wherein the second fixed charge film includes aluminum oxide.
5. The image sensor of claim 2 , wherein the insulating layer includes silicon oxide.
6. The image sensor of claim 1 , further comprising:
a first hole accumulation region between a lower portion of the first fixed charge film and upper portions of the photoelectric conversion parts; and
a second hole accumulation region along a sidewall and a bottom surface of the pixel isolation trench in the substrate.
7. The image sensor of claim 6 , wherein
the first fixed charge film and the second fixed charge film include different metals;
the first fixed charge film and the second fixed charge film are on the first hole accumulation region; and
the second fixed charge film is on side surfaces of the second hole accumulation region.
8. The image sensor of claim 1 , wherein the insulating layer has a planar upper surface configured to extend onto the second fixed charge film.
9. The image sensor of claim 1 , further comprising:
an air gap inside the pixel isolation trench.
10. An image sensor comprising:
a lower substrate;
a lower interlayer insulating layer on the lower substrate;
an upper interlayer insulating layer on the lower interlayer insulating layer;
an upper substrate on the upper interlayer insulating layer, the upper substrate including a pixel isolation trench configured to define pixel regions in the upper substrate, and extending into the upper substrate from an upper surface of the upper substrate;
a first insulating layer directly on the upper surface of the upper substrate, the first insulating layer including a metal oxide;
a second insulating layer directly on the first insulating layer and inner walls of the pixel isolation trench, the second insulating layer including a metal oxide having a lower refractive index than the first insulating layer; and
a third insulating layer directly on the second insulating layer, the third insulating layer configured to fill the pixel isolation trench.
11. The image sensor of claim 10 , wherein the first insulating layer does not extend into the pixel isolation trench.
12. The image sensor of claim 10 , further comprising:
a plurality of color filters on the third insulating layer, the color filters vertically arranged with the photoelectric conversion parts; and
a plurality of micro-lenses on the color filters.
13. The image sensor of claim 10 , wherein
the lower interlayer insulating layer includes a lower interconnection; and
the upper interlayer insulating layer includes an upper interconnection.
14. The image sensor of claim 10 , wherein
the first insulating layer and the second insulating layer are on the upper surface of the upper substrate;
the first insulating layer and the second insulating layer include different metals; and
the second insulating layer is on the inner walls and a bottom surface of the pixel isolation trench.
15. An image sensor comprising:
a substrate including a plurality of photoelectric conversion parts and a pixel isolation trench configured to extend between the photoelectric conversion parts from a surface of the substrate;
a first metal oxide film conformally formed on the surface of the substrate, the first metal oxide film including a first metal oxide; and
a second metal oxide film conformally formed on the first metal oxide film and an inner wall of the pixel isolation trench, the second metal oxide film including a second metal oxide different from the first metal oxide.
16. The image sensor of claim 15 , wherein the first metal oxide includes one of hafnium oxide, hafnium silicon oxide, titanium oxide, zirconium oxide, magnesium oxide, tantalum oxide, scandium oxide, lutetium oxide, yttrium oxide, and lanthanum oxide.
17. The image sensor of claim 15 , wherein the second metal oxide is aluminum oxide.
18. The image sensor of claim 15 , further comprising:
an insulating layer on the second metal oxide film and configured to fill the pixel isolation trench, the insulating layer including silicon oxide.
19. The image sensor of claim 15 , further comprising:
a first hole accumulation region between a lower portion of the first metal oxide film and upper portions of the photoelectric conversion parts; and
a second hole accumulation region along a sidewall and a bottom surface of the pixel isolation trench in the substrate.
20. The image sensor of claim 15 , further comprising:
an air gap inside the pixel isolation trench.