IP Library › Granted Patent US 10,041,195
Granted Patent B2
US 10,041,195 · App. 14/989,591 · Granted Aug 7, 2018

Woven signal-routing substrate for wearable electronic devices

Inventors: You Ge (Tianjin, CN); Meng Kong Lye (Petaling Jaya, MY); Zhijie Wang (Tianjin, CN)
Assignee: NXP USA, INC.
D03D1/0088D03D15/00D10B2101/12D10B2101/20D10B2401/16
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,041,195
App. No.
14/989,591
Granted
Aug 7, 2018
Kind
B2
Abstract

A woven signal-routing substrate for a wearable electronic device has conductive warps and wefts that are woven with each other and with insulative warps and wefts. Woven electrical cross-connections are formed at some of the intersections of the conductive warps and wefts, while no electrical cross-connections are formed at other intersections, to provide a signal-routing architecture for the substrate that can be used to route signals between electronic components of the wearable device. Non-connecting intersections are formed using insulative warps that are sufficiently thicker than the relatively thin conductive warps to enable a conductive weft to cross a conductive warp without making physical contact at intersection locations where an electrical cross-connection is not desired. The woven electrical cross-connections may be formed at other intersection locations using weaving topologies that ensure that the corresponding mutually orthogonal warps and wefts do contact one another.

Claims (41)

1. An article of manufacture comprising a woven layer, comprising:

a plurality of insulative warps having a first thickness interleaved with and parallel to a plurality of conductive warps having a second thickness that is less than the first thickness of the insulative warps;

a plurality of insulative wefts interleaved with and parallel to a plurality of conductive wefts, wherein the warps are woven with the wefts; and

one or more woven electrical cross-connections, each comprising at least one conductive warp physically contacting at least one conductive weft, wherein:

the relative thicknesses between the insulative warps and the conductive warps enable at least one conductive warp to cross at least one conductive weft without making physical contact at an intersection not having an electrical cross-connection.

2. The article of claim 1 , wherein:

the wefts are orthogonal to the warps; and

the conductive wefts are thinner than the insulative wefts.

3. The article of claim 1 , wherein at least one woven cross-connection comprises a first conductive warp and first and second conductive wefts, wherein:

the first and second conductive wefts are both located between first and second adjacent insulative wefts;

the first conductive warp is located between first and second adjacent insulative warps;

the first conductive weft crosses in front of the first insulative warp, behind the first conductive warp, and in front of the second insulative warp; and

the second conductive weft crosses behind the first insulative warp, in front of the first conductive warp, and behind the second insulative warp.

4. The article of claim 3 , wherein:

the first conductive weft physically contacts the first conductive warp with a forward force; and

the second conductive weft physically contacts the first conductive warp with a backward force.

5. The article of claim 3 , wherein a second conductive warp crosses the first and second conductive wefts between third and fourth adjacent insulative warps without forming an electrical cross-connection, wherein:

the first conductive weft crosses in front of each of the third insulative warp, the second conductive warp, and the fourth insulative warp;

the second conductive weft crosses behind each of the third insulative warp, the second conductive warp, and the fourth insulative warp; and

the thickness of the third and fourth insulative warps prevents physical contact between (i) the second conductive warp and (ii) the first and second conductive wefts.

6. The article of claim 3 , wherein:

there are no conductive warps between fifth and sixth insulative warps;

the first conductive weft crosses in front of the fifth insulative warp and behind the sixth insulated warp; and

the second conductive weft crosses behind the fifth insulative warp and in front of the sixth insulative warp.

7. The article of claim 1 , wherein at least one woven electrical cross-connection comprises a first conductive warp and a first conductive weft, wherein:

the first conductive weft is located between first and second adjacent insulative wefts;

the first conductive warp is located between first and second adjacent insulative warps; and

the first conductive weft is wrapped around the first conductive warp.

8. The article of claim 7 , wherein:

a second conductive warp crosses the first conductive weft between third and fourth adjacent insulative warps without forming an electrical cross-connection;

the first conductive weft crosses either (i) in front of each of the third insulative warp, the second conductive warp, and the fourth insulative warp or (ii) behind each of the third insulative warp, the second conductive warp, and the fourth insulative warp; and

the thickness of the third and fourth insulative warps prevents physical contact between (i) the second conductive warp and (ii) the first conductive weft.

9. The article of claim 1 , wherein the conductive warps and wefts are conducting carbon fibers.

10. The article of claim 1 , wherein the insulative warps and wefts are non-conducting fibers.

11. The article of claim 1 , wherein the woven layer comprised a non-conducting sealant material that protects the woven electrical cross-connections.

12. The article of claim 1 , wherein the woven layer is sandwiched between two or more protective layers to form a laminated fabric.

13. The article of claim 1 , further comprising a plurality of electrical components supported by the woven layer, each electrical component having one or more conducting leads, each conducting lead electrically connected to one of the conductive warps or one of the conductive wefts.

14. The article of claim 13 , wherein a conducting lead of a first electrical component is electrically connected to a conducting lead of a second electrical component via at least two conductive warps/wefts and at least one woven electrical cross-connection.

15. The article of claim 14 , wherein the conducting lead of the first electrical component is electrically connected to the conducting lead of the second electrical component via three conductive warps/wefts and two woven electrical cross-connections.

16. The article of claim 13 , wherein the article comprises a wearable electronic device comprising the electrical components electrically interconnected by the conductive warps and wefts that are woven into the woven layer, which functions as a signal-routing substrate for the electronic device.

17. The article of claim 13 , wherein a conducting lead of a first electrical component is connected to a conducting lead of a second electrical component via different redundant signal-routing paths through the woven layer to provide fault protection.

Assignments (5)
RELEASE OF SECURITY INTEREST Recorded Sep 10, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: NXP B.V.
Reel/Frame 050744/0097 →
CORRECTIVE ASSIGNMENT TO CORRECT THE NATURE OF CONVEYANCE PREVIOUSLY RECORDED AT REEL: 040626 FRAME: 0683. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER AND CHANGE OF NAME EFFECTIVE NOVEMBER 7, 2016. Recorded Jan 12, 2017
From: NXP SEMICONDUCTORS USA, INC. (MERGED INTO); FREESCALE SEMICONDUCTOR, INC. (UNDER)
To: NXP USA, INC.
Reel/Frame 041414/0883 →
CHANGE OF NAME Recorded Nov 16, 2016
From: FREESCALE SEMICONDUCTOR INC.
To: NXP USA, INC.
Reel/Frame 040626/0683 →
SUPPLEMENT TO THE SECURITY AGREEMENT Recorded Jun 16, 2016
From: FREESCALE SEMICONDUCTOR, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 039138/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 6, 2016
From: GE, YOU; LYE, MENG KONG; WANG, ZHIJIE
To: FREESCALE SEMICONDUCTOR,INC.
Reel/Frame 037424/0239 →
Priority Claims (1)
CN 2015 1 0532739 · Jul 7, 2015 · national
Continuity (1)
Related Publication 20170009387A1 · Jan 12, 2017