IP Library › Granted Patent US 10,048,137
Granted Patent B2
US 10,048,137 · App. 14/506,956 · Granted Aug 14, 2018

Semiconductor devices including electrodes for temperature measurement

Inventors: Kyongtaek Lee (Suwon-si, KR); Sangwoo Pae (Seongnam-si, KR); Junekyun Park (Yongin-si, KR)
Assignee: Samsung Electronics Co., Ltd.
G01K7/01B82Y40/00H01L27/0886H01L29/0673H01L29/775H01L29/785H01L23/34H01L2924/0002
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Quick Facts
Patent No.
US 10,048,137
App. No.
14/506,956
Granted
Aug 14, 2018
Kind
B2
Abstract

A semiconductor device includes: a semiconductor substrate; a plurality of conductive lines formed on the semiconductor substrate; and an electrode for temperature measurement. The electrode is connected to the plurality of conductive lines. An electronic device includes a semiconductor device and has a temperature sensing function. The semiconductor device includes: a semiconductor substrate; a plurality of conductive lines formed on the semiconductor substrate; and an electrode for temperature measurement.

Claims (38)

1. A semiconductor device comprising:

a semiconductor substrate;

a plurality of conductive lines formed on the semiconductor substrate;

an electrode for temperature measurement, the electrode being connected to the plurality of conductive lines; and

an active region in the semiconductor substrate, wherein

the plurality of conductive lines connected to the electrode for temperature measurement are gate lines,

the active region extends in a first direction,

the active region includes a source region, a drain region, and a channel region,

the channel region is between the source region and the drain region,

the gate lines pass a top surface of the channel region, and

the gate lines extend in a second direction, the second direction being different from the first direction.

2. The semiconductor device of claim 1 , wherein the gate lines include at least one dummy gate line.

3. The semiconductor device of claim 1 , wherein the gate lines include at least one wordline and at least one dummy wordline.

4. The semiconductor device of claim 1 , wherein:

the active region is fin-shaped; and

the gate lines pass the top surface and sidewalls of the channel region.

5. The semiconductor device of claim 4 , wherein the active region includes a plurality of fm-shaped structures that are shared at sides of the active region.

6. The semiconductor device of claim 1 , wherein the gate lines are dummy gate lines.

7. The semiconductor device of claim 6 , wherein the dummy gate lines are dummy gate lines positioned closest to an element for which temperature is to be measured.

8. The semiconductor device of claim 1 , wherein the electrode connected to the plurality of conductive lines is a 4-point probe.

9. The semiconductor device of claim 8 , wherein the semiconductor device is configured to output temperature according to resistance measured by the 4-point probe using a temperature coefficient of resistance (TCR).

10. An electronic device comprising:

the semiconductor device of claim 1 ; and

a circuit configured to receive a temperature measured using the electrode, and to output a signal corresponding to the temperature.

11. The electronic device of claim 10 , wherein the circuit that operates according to the temperature is at least one of a current and voltage controller.

12. A semiconductor device, comprising:

a semiconductor substrate;

a plurality of conductive lines formed on the semiconductor substrate; and

an electrode for temperature measurement, the electrode being connected to the plurality of conductive lines, wherein

the plurality of conductive lines include at least one bitline and at least one dummy bitline.

13. An electronic device comprising:

at least one multipoint probe connected to at least one of a plurality of conductive lines of a semiconductor device, the at least one multipoint probe being configured to measure resistance of the at least one of the plurality of conductive lines, the resistance being indicative of temperature changes in the semiconductor device; and

a temperature calculation circuit configured to calculate a temperature based on the resistance measured by the at least one multipoint probe according to a temperature coefficient of resistance (TCR).

14. The electronic device of claim 13 , wherein the multipoint probe is one of a 4-point and a 2-point probe configured to measure a resistance variation rate of the at least one of the plurality of conductive lines.

15. The electronic device of claim 13 , wherein the at least one of the plurality of conductive lines includes at least one of a gate line, a wordline, a bitline, a dummy gate line, a dummy wordline and a dummy bitline.

16. The electronic device of claim 13 , wherein the multipoint probe is connected directly to the at least one of the plurality of conductive lines.

17. The electronic device of claim 13 , further comprising:

a temperature output circuit configured to output at least one of the temperature, a voltage and a current according to the temperature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 6, 2014
From: LEE, KYONGTAEK; PAE, SANGWOO; PARK, JUNEKYUN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 033892/0773 →
Priority Claims (1)
KR 10-2013-0119446 · Oct 7, 2013 · national
Continuity (1)
Related Publication 20150098489A1 · Apr 9, 2015
Cited By (1)
US 12,422,465