Semiconductor device and manufacturing method thereof
A transistor with stable electrical characteristics. A semiconductor device includes a first insulator over a substrate, a second insulator over the first insulator, an oxide semiconductor in contact with at least part of a top surface of the second insulator, a third insulator in contact with at least part of a top surface of the oxide semiconductor, a first conductor and a second conductor electrically connected to the oxide semiconductor, a fourth insulator over the third insulator, a third conductor which is over the fourth insulator and at least part of which is between the first conductor and the second conductor, and a fifth insulator over the third conductor. The first insulator contains a halogen element.
1. A semiconductor device comprising:
a first insulator over a substrate;
a second insulator over the first insulator;
an oxide semiconductor in contact with at least part of a top surface of the second insulator;
a third insulator in contact with at least part of a top surface of the oxide semiconductor;
a first conductor and a second conductor electrically connected to the oxide semiconductor;
a fourth insulator over the third insulator;
a third conductor which is over the fourth insulator and at least part of which is between the first conductor and the second conductor;
a fifth insulator over the third conductor;
a sixth insulator under the first insulator; and
a fourth conductor between the sixth insulator and the first insulator,
wherein the first insulator contains a halogen element,
wherein the sixth insulator is less permeable to hydrogen and water than the first insulator, and
wherein at least part of the fourth conductor overlaps with the oxide semiconductor.
2. The semiconductor device according to claim 1 , wherein the number of water molecules released from the first insulator measured by thermal desorption spectroscopy is greater than or equal to 1.0 ×10 13 molecules/cm 2 and less than or equal to 1.4 ×10 16 molecules/cm 2 .
3. The semiconductor device according to claim 1 , further comprising a seventh insulator between the fourth conductor and the first insulator, wherein the seventh insulator contains hafnium.
4. The semiconductor device according to claim 3 , wherein the number of water molecules released from a stacked film of the first insulator and the seventh insulator measured by thermal desorption spectroscopy is greater than or equal to 1.0 ×10 13 molecules/cm 2 and less than or equal to 1.4 ×10 16 molecules/cm 2 .
5. The semiconductor device according to claim 3 , wherein the number of hydrogen molecules released from a stacked film of the first insulator and the seventh insulator measured by thermal desorption spectroscopy is greater than or equal to 1.0 ×10 13 molecules/cm 2 and less than or equal to 1.2 ×10 15 molecules/cm 2 .
6. The semiconductor device according to claim 1 , wherein the halogen element is fluorine, chlorine, or bromine.
7. A semiconductor device comprising:
a first insulator over a substrate;
a second insulator over the first insulator;
an oxide semiconductor in contact with at least part of a top surface of the second insulator;
a third insulator in contact with at least part of a top surface of the oxide semiconductor;
a first conductor and a second conductor electrically connected to the oxide semiconductor;
a fourth insulator over the third insulator;
a fifth insulator under the first insulator; and
a third conductor between the fifth insulator and the first insulator,
wherein the first insulator contains a halogen element,
wherein the fifth insulator is less permeable to hydrogen and water than the first insulator, and
wherein at least part of the third conductor overlaps with the oxide semiconductor.
8. The semiconductor device according to claim 7 , wherein the number of water molecules released from the first insulator measured by thermal desorption spectroscopy is greater than or equal to 1.0 ×10 13 molecules/cm 2 and less than or equal to 1.4 ×10 16 molecules/cm 2 .
9. The semiconductor device according to claim 7 , further comprising a sixth insulator between the third conductor and the first insulator, wherein the sixth insulator contains hafnium.
10. The semiconductor device according to claim 9 , wherein the number of water molecules released from a stacked film of the first insulator and the sixth insulator measured by thermal desorption spectroscopy is greater than or equal to 1.0 ×10 13 molecules/cm 2 and less than or equal to 1.4 ×10 16 molecules/cm 2 .
11. The semiconductor device according to claim 9 , wherein the number of hydrogen molecules released from a stacked film of the first insulator and the sixth insulator measured by thermal desorption spectroscopy is greater than or equal to 1.0 ×10 13 molecules/cm 2 and less than or equal to 1.2 ×10 15 molecules/cm 2 .
12. The semiconductor device according to claim 7 , wherein the halogen element is fluorine, chlorine, or bromine.