Semiconductor method of protecting wafer from bevel contamination

1. A method, comprising:

coating an edge portion of a wafer by a first chemical solution including a chemical mixture of an acid-labile group, a solubility control unit and a thermal acid generator;

curing the first chemical solution to form a first protecting layer on the edge portion of the wafer;

coating a resist layer on a front surface of the wafer;

removing the first protecting layer by a first removing solution; and

performing an exposure process to the resist layer.

2. The method of claim 1 , wherein

the coating of the edge portion of the wafer includes spray-coating the first chemical solution to the edge portion of the wafer; and

the curing of the first chemical solution includes performing a first baking process to the first chemical solution.

3. The method of claim 2 , wherein the spray-coating of the first chemical solution includes

delivering the first chemical solution to the edge portion of the wafer using a spray head configured to aim at the edge portion of the wafer; and

simultaneously spinning the wafer during the delivering of the first chemical solution.

4. The method of claim 2 , wherein the first baking process includes a baking temperature that is able to trigger the thermal acid generator to release acid.

5. The method of claim 1 , wherein the first removing solution is designed to dissolve the solubility control unit, wherein the first removing solution includes 70% propylene glycol methyl ether (PGME) and 30% propylene glycol methyl ether acetate (PGMEA).

6. The method of claim 5 , wherein the solubility control unit is chosen from lactone, ester, ether, ketone and a combination thereof.

7. The method of claim 1 , further comprising

coating the edge portion of the wafer by a second chemical solution including the chemical mixture, after the performing of the exposure process to the resist layer; and

curing the second chemical solution to form a second protecting layer on the edge portion of the wafer.

8. The method of claim 7 , further comprising:

performing a post-exposure baking process to the exposed resist layer;

developing the exposed resist layer to form a patterned resist layer; and

removing the second protecting layer by a second removing solution that includes 70% PGME and 30% PGMEA.

9. The method of claim 8 , wherein

the developing of the exposed resist layer is implemented when the wafer is positioned on a first wafer stage of a track tool; and

the removing of the second protecting layer is implemented thereafter when the wafer is positioned on the first wafer stage of the track tool.

10. The method of claim 9 , wherein

the coating of the resist layer is implemented when the wafer is positioned on a second wafer stage of the track tool; and

the removing of the first protecting layer is implemented thereafter when the wafer is positioned on the second wafer stage of the track tool.

11. The method of claim 1 , wherein

the first protecting layer includes a thickness ranging between 500 angstrom and 1000 angstrom; and

the resist layer includes a thickness ranging between 150 angstrom and 250 angstrom.

12. The method of claim 1 , wherein

the acid-labile group includes a t-butoxycardbonyl (tBOC); and

the thermal acid generator is chosen from NH 4 + C 4 F 9 SO 3 − and NH 4 + CF 3 SO 3 − .

13. The method of claim 1 , further comprising

after the exposure process, performing a developing process to the resist layer to form a patterned resist layer; and

applying a fabrication process to the front surface of the wafer through openings of the patterned resist layer.

14. A method, comprising:

coating an edge portion of a front surface of a wafer by a first protecting layer of a polymeric material;

coating a resist layer on the front surface of the wafer;

removing the first protecting layer;

performing an exposure process to the resist layer;

coating the edge portion of the front surface of the wafer by a second protecting layer of the polymeric material;

performing a post-exposure baking process to the resist layer;

performing a developing process to the resist layer to form a patterned resist layer; and

removing the second protecting layer.

15. The method of claim 1 , wherein the coating of the edge portion of the wafer by the first protecting layer includes

spray-coating a first chemical solution to the edge portion of the wafer; and

curing the first chemical solution by a first baking process to form the first protecting layer.

16. The method of claim 15 , wherein the coating of the edge portion of the wafer by the second protecting layer includes

spray-coating a second chemical solution to the edge portion of the wafer; and

curing the second chemical solution by a second baking process to form the second protecting layer, wherein

each of the first and second chemical solutions includes an acid-labile group, a solubility control unit and a thermal acid generator; and

each of the first and second baking processes includes a baking temperature that is able to trigger the thermal acid generator to release acid.

17. The method of claim 16 , wherein each of the removing of the first protecting layer and the removing of the second protecting layer uses a removing solution designed to dissolve the solubility control unit, wherein the removing solution includes propylene glycol methyl ether (PGME) and propylene glycol methyl ether acetate (PGMEA).

18. The method of claim 16 , wherein the solubility control unit is chosen from lactone, ester, ether, ketone and a combination thereof.

19. A method, comprising:

coating an edge portion of a wafer by a first chemical solution including a chemical mixture of an acid-labile group, a solubility control unit and a thermal acid generator;

curing the first chemical solution to form a first protecting layer on the edge portion of the wafer;

coating a resist layer on a front surface of the wafer;

removing the first protecting layer by a removing solution that includes propylene glycol methyl ether (PGME) and propylene glycol methyl ether acetate (PGMEA); and

thereafter, performing an exposure process to the resist layer.

20. The method of claim 19 , further comprising

coating the edge portion of the wafer by a second chemical solution including the chemical mixture, after the performing of the exposure process to the resist layer; and

curing the second chemical solution to form a second protecting layer on the edge portion of the wafer.