Bevel edge removal methods, tools, and systems
A tool and methods of removing films from bevel regions of wafers are disclosed. The bevel film removal tool includes an inner motor nested within an outer motor and a bevel brush secured to the outer motor. The bevel brush is adjustable radially outward to allow the wafer to be inserted in the bevel brush and to be secured to the inner motor. The bevel brush is adjustable radially inward to engage one or more sections of the bevel brush and to bring the bevel brush in contact with a bevel region of the wafer. Once engaged, a solution may be dispensed at the engaged sections of the bevel brush and the inner motor and the outer motor may be rotated such that the bevel brush is rotated against the wafer such that the bevel films of the wafer are both chemically and mechanically removed.
1. A semiconductor device processing system comprising:
an inner motor comprising a top surface that is a rotatable platform, the inner motor being nested within a first motor;
a bevel brush attached to the first motor, wherein the bevel brush surrounds the top surface in a top down view, wherein the bevel brush comprises a first portion and a second portion movable relative to the first portion, wherein the first portion and the second portion are arranged in a circle in a top down view; and
a groove located within the bevel brush.
2. The semiconductor device processing system of claim 1 , wherein the bevel brush comprises nylon.
3. The semiconductor device processing system of claim 1 , wherein the first portion has a first porosity and the second portion has a second porosity different from the first porosity.
4. The semiconductor device processing system of claim 3 , wherein the first porosity is between about 0% by volume and about 70% by volume.
5. The semiconductor device processing system of claim 4 , wherein the first porosity is about 30% by volume.
6. The semiconductor device processing system of claim 1 , wherein the rotatable platform is rotatable in a first direction and the bevel brush is rotatable in both the first direction and a second direction different from the first direction.
7. A semiconductor device processing system comprising:
a first motor nested within an co-axially aligned with an outer motor, the first motor comprising a flat, circular-shaped, upper surface service as a rotatable platform;
a bevel brush attached to the outer motor, wherein the bevel brush is a circle that surrounds the rotatable platform in a top down view, wherein the circle comprises a first portion and a second portion movable relative to the first portion, the first portion and the second portion both being in a single plane of the circle, the single plane also comprising a diameter of the circle; and
a groove located within the bevel brush.
8. The semiconductor device processing system of claim 7 , wherein the bevel brush comprises nylon.
9. The semiconductor device processing system of claim 7 , wherein the first portion has a first porosity and the second portion has a second porosity different from the first porosity.
10. The semiconductor device processing system of claim 9 , wherein the first porosity is between about 0% by volume and about 70% by volume.
11. The semiconductor device processing system of claim 10 , wherein the first porosity is about 30% by volume.
12. The semiconductor device processing system of claim 7 , wherein the rotatable platform is rotatable in a first direction and the bevel brush is rotatable in both the first direction and a second direction different from the first direction.
13. A semiconductor device processing system comprising:
an inner motor nested within a first motor, the nested motor comprising a flat, circular-shaped, upper surface that is a rotatable platform;
a bevel brush attached to the first motor, wherein the bevel brush surrounds the rotatable platform in a top down view, wherein the bevel brush comprises a first portion and a second portion movable relative to the first portion;
a first groove located within the first portion of the bevel brush, the first groove extending across the first portion and the second portion; and
dispensers housed along sidewalls of the first groove.
14. The semiconductor device processing system of claim 13 , wherein the bevel brush comprises nylon.
15. The semiconductor device processing system of claim 13 , wherein the first portion has a first porosity and the second portion has a second porosity different from the first porosity.
16. The semiconductor device processing system of claim 15 , wherein the first porosity is between about 0% by volume and about 70% by volume.
17. The semiconductor device processing system of claim 16 , wherein the first porosity is about 30% by volume.
18. The semiconductor device processing system of claim 1 , wherein the bevel brush comprises a third portion and a fourth portion movable relative to the first portion, wherein the first portion, the second portion, the third portion, and the fourth portion are arranged in the circle in the top down view.
19. The semiconductor device processing system of claim 7 , wherein the groove extends across the first portion and the second portion.
20. The semiconductor device processing system of claim 13 , wherein the dispensers are housed along sidewalls of the first groove in both the first portion and the second portion.