Selective plasma etching method of a first region containing a silicon atom and an oxygen atom
A method includes performing one or more times of a sequence and reducing a film thickness of a fluorocarbon-containing film formed by performing one or more times of the sequence. Each of the one or more times of the sequence includes forming the fluorocarbon-containing film on a processing target object by generating plasma of a processing gas containing a fluorocarbon gas and not containing an oxygen gas; and etching a first region with radicals of fluorocarbon contained in the fluorocarbon-containing film. In the method, an alternating repetition in which the one or more times of the sequence and the reducing of the film thickness of the fluorocarbon-containing film are alternately repeated is performed.
1. A method of etching a first region containing a silicon atom and an oxygen atom selectively with respect to a second region made of a material different from the first region by performing a plasma processing on a processing target object, the processing target object including the second region in which a recess is formed, the first region which fills the recess and covers the second region, and a mask which is provided with an opening above the recess and is provided on the first region, the method comprising:
(1) performing one or more times of a sequence each comprising:
(1-1) forming a fluorocarbon-containing film on the processing target object by generating plasma of a first processing gas containing a fluorocarbon gas and not containing an oxygen gas such that the fluorocarbon-containing film is formed on a surface of the first region and a surface of the second region; and
(1-2) etching the first region with radicals of fluorocarbon contained in the fluorocarbon-containing film by irradiating active species of atoms of a rare gas to the processing target object; and
(2) reducing a film thickness of the fluorocarbon-containing film,
wherein an alternating repetition in which (1) the performing of the one or more times of the sequence and (2) the reducing of the film thickness are alternately repeated is performed.
2. The method of claim 1 ,
wherein plasma of a second processing gas containing only a nitrogen trifluoride gas is generated in the reducing of the film thickness.
3. The method of claim 1 ,
wherein plasma of a third processing gas containing a nitrogen trifluoride gas and a rare gas is generated in the reducing of the film thickness.
4. The method of claim 1 ,
wherein plasma of a fourth processing gas containing a nitrogen trifluoride gas and a rare gas is generated in a preset number of the reducing of the film thickness included in the alternating repetition, and
plasma of a fifth processing gas containing only a nitrogen trifluoride gas is generated in a predetermined number of the reducing of the film thickness included in the alternating repetition.
5. The method of claim 1 ,
wherein plasma of a sixth processing gas containing only an oxygen gas is generated in the reducing of the film thickness.
6. The method of claim 1 ,
wherein plasma of a seventh processing gas containing an oxygen gas and a rare gas is generated in the reducing of the film thickness.
7. The method of claim 1 ,
wherein plasma of an eighth processing gas containing an oxygen gas and a rare gas is generated in a preset number of the reducing of the film thickness included in the alternating repetition, and
plasma of a ninth processing gas containing only an oxygen gas is generated in a predetermined number of the reducing of the film thickness included in the alternating repetition.
8. The method of claim 1 ,
wherein a pressure within a processing vessel in which the processing target object is accommodated is set to be equal to or less than 2.666 Pa in the forming of the fluorocarbon-containing film.
9. The method of claim 1 ,
wherein a high frequency power for plasma generation, which allows an effective bias voltage ranging from 100 V to 300 V to be generated, is used in the forming of the fluorocarbon-containing film.
10. The method of claim 1 ,
wherein, in the forming of the fluorocarbon-containing film, a capacitively coupled plasma processing apparatus is used, and a voltage for attracting positive ions is applied to a silicon-made electrode plate of an upper electrode of the plasma processing apparatus.
11. The method of claim 1 ,
wherein plasma of the rare gas is generated in the etching of the first region.
12. The method of claim 1 ,
wherein the first region is made of silicon oxide, silicon oxynitride or carbon-containing silicon oxide.
13. The method of claim 1 ,
wherein the second region is made of silicon, carbon, silicon nitride or a metal.
14. The method of claim 1 ,
wherein, in the forming of the fluorocarbon-containing film, etching of the first region progresses down to an inside of the recess formed in the second region.
15. The method of claim 1 ,
wherein, in the etching of the first region, a high frequency power supply is supplied to a lower electrode which is placed under the processing target object.
16. The method of claim 1 ,
wherein, in the forming of the fluorocarbon-containing film, a ratio of a flow rate of the fluorocarbon gas to a total flow rate of the first processing gas is set to be in a range from 0.1% to 1%.
17. The method of claim 1 ,
wherein, in the forming of the fluorocarbon-containing film, a high frequency power for plasma generation, modulated in a pulse shape, is provided.
18. The method of claim 1 ,
wherein a pressure within a processing vessel in which the processing target object is accommodated is set to be equal to or less than 4 Pa in the etching of the first region.
19. The method of claim 1 ,
wherein (1-2) the etching of the first region is performed without adding an additional fluorocarbon gas.
20. The method of claim 1 ,
wherein a nitrogen trifluoride gas is used in (2) the reducing of the film thickness, and a flow rate of the nitrogen trifluoride gas is changed depending on the number of the alternating repetitions.