Substrate cleaning apparatus and polishing apparatus

1. A substrate cleaning apparatus, comprising:

a cleaning vessel for housing a substrate therein;

a substrate holder arranged in the cleaning vessel;

a chemical liquid nozzle for supplying a chemical liquid onto the substrate held by the substrate holder;

a plurality of cleaning liquid nozzles for supplying a cleaning liquid toward a hydrophilic inner surface of the cleaning vessel, the hydrophilic inner surface surrounding the substrate holder, each one of the plurality of cleaning liquid nozzles being oriented outwardly in a non-vertical direction away from the substrate holder and toward the hydrophilic inner surface; and

an oscillation mechanism for causing the plurality of cleaning liquid nozzles to oscillate,

wherein the plurality of cleaning liquid nozzles are arranged so as to form a film of the cleaning liquid on the hydrophilic inner surface such that the film surrounds an entire circumference of the substrate holder while the chemical liquid nozzle supplies the chemical liquid onto the substrate held by the substrate holder,

the hydrophilic inner surface comprises a front surface, a back surface, and two side surfaces, and

the plurality of cleaning liquid nozzles includes a first nozzle oriented toward the front surface, a second nozzle oriented toward the back surface, a third nozzle oriented toward one of the two side surfaces, and a fourth nozzle oriented toward other of the two side surfaces.

2. The substrate cleaning apparatus according to claim 1 , wherein the plurality of cleaning liquid nozzles are arranged along an entirety of the hydrophilic inner surface.

3. The substrate cleaning apparatus according to claim 1 , wherein the plurality of cleaning liquid nozzles are located above the substrate holder.

4. The substrate cleaning apparatus according to claim 1 , wherein the hydrophilic inner surface comprises a surface with a hydrophilic material coating.

5. A polishing apparatus, comprising:

a polishing section for polishing a substrate; and

the substrate cleaning apparatus according to claim 1 for cleaning the polished substrate.

6. The substrate cleaning apparatus according to claim 1 , wherein the cleaning vessel is formed of polyvinyl chloride.

7. The substrate cleaning apparatus according to claim 1 , wherein the oscillation mechanism includes a linkage coupled to the plurality of cleaning liquid nozzles and an actuator configured to drive the linkage.

8. The substrate cleaning apparatus according to claim 1 , wherein the plurality of cleaning liquid nozzles is arranged so as to surround an entire circumference of the substrate holder.

9. The substrate cleaning apparatus according to claim 1 , wherein the oscillation mechanism is configured to rotate each cleaning liquid nozzle about an associated axis.

10. The substrate cleaning apparatus according to claim 9 , wherein the associated axis of each cleaning liquid nozzle is vertical.

11. The substrate cleaning apparatus according to claim 9 , wherein the oscillation mechanism is configured to rotate the plurality of cleaning liquid nozzles in synchronization with each other.

12. The substrate cleaning apparatus according to claim 9 , wherein the oscillation mechanism includes a plurality of linkages that are coupled to the plurality of cleaning liquid nozzles such that oscillation of the plurality of linkages causes the plurality of cleaning liquid nozzles to oscillate.

13. The substrate cleaning apparatus according to claim 12 , wherein the oscillation mechanism further includes a motor having a shaft that rotates to oscillate the plurality of linkages and plurality of cleaning liquid nozzles.

14. The substrate cleaning apparatus according to claim 12 , wherein the oscillation mechanism further includes a cylinder having a piston rod that reciprocates to oscillate the plurality of linkages and plurality of cleaning liquid nozzles.

15. The substrate cleaning apparatus according to claim 1 , wherein the chemical liquid nozzle is configured to supply the chemical liquid having an etching action on the substrate.

16. The substrate cleaning apparatus according to claim 1 , wherein the chemical liquid ranges from an ordinary temperature to 100° C.

17. The substrate cleaning apparatus according to claim 1 , wherein the hydrophilic inner surface comprises a roughened surface, a surface with hydrophilic material coating, a surface that has been subjected to a plasma surface modification, or a combination thereof.

18. The substrate cleaning apparatus according to claim 1 , wherein the cleaning vessel has an opening through which the substrate is carried into and out of the cleaning vessel, and further has a shutter configured to close the opening.

19. The substrate cleaning apparatus according to claim 1 , further comprising a connection pipe extending horizontally along an entirety of the hydrophilic inner surface, the connection pipe being located in the cleaning vessel, the plurality of cleaning liquid nozzles being coupled to the connection pipe.

20. A polishing apparatus comprising:

a polishing section for polishing a substrate; and

a cleaning section for cleaning the polished substrate;

wherein the cleaning section has:

a first substrate cleaning apparatus for cleaning the polished substrate, the first substrate cleaning apparatus having a upper roll-shaped sponge and a lower roll-shaped sponge, the upper roll-shaped sponge and the lower roll-shaped sponges are configured to rotate and press against front and rear surfaces of the substrate, respectively, to clean the front and rear surfaces of the substrate;

a second substrate cleaning apparatus having the substrate cleaning apparatus according to claim 1 , for cleaning the substrate cleaned by the first substrate cleaning apparatus; and

a drying apparatus for drying the substrate cleaned by the second substrate cleaning apparatus.