IP Library › Granted Patent US 10,096,493
Granted Patent B2
US 10,096,493 · App. 15/432,379 · Granted Oct 9, 2018

Substrate treatment apparatus, and substrate treatment method

Inventors: Akiyoshi Aomatsu (Kyoto, JP); Shoji Uemae (Kyoto, JP); Kazuki Nakamura (Kyoto, JP); Yoshinori Izumi (Kyoto, JP); Nobutaka Tanahashi (Kyoto, JP)
Assignee: SCREEN Holdings Co., Ltd.
H01L21/67051B08B3/022B08B3/041B08B3/08
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Quick Facts
Patent No.
US 10,096,493
App. No.
15/432,379
Granted
Oct 9, 2018
Kind
B2
Abstract

The inventive substrate treatment apparatus includes: a rotative treatment control unit which controls a first chemical liquid supplying unit and a second chemical liquid supplying unit to perform a first chemical liquid supplying step of supplying a first chemical liquid to a substrate rotated by a substrate holding and rotating mechanism and a second chemical liquid supplying step of supplying a second chemical liquid to the substrate rotated by the substrate holding and rotating mechanism after the first chemical liquid supplying step; and a cleaning control unit which controls the cleaning liquid supplying unit to spout the cleaning liquid from the cleaning liquid outlet port to supply the cleaning liquid to the cup inner wall and/or the base wall surface before start of the second chemical liquid supplying step after end of the first chemical liquid supplying step, and/or during and/or after the second chemical liquid supplying step.

Claims (28)

1. A substrate treatment apparatus comprising:

a treatment chamber;

a substrate holding mechanism provided in the treatment chamber for holding a substrate;

a tubular treatment cup provided in the treatment chamber and surrounding the substrate holding mechanism;

a first chemical liquid nozzle which spouts a first chemical liquid to the substrate held by the substrate holding mechanism;

a second chemical liquid nozzle which spouts a second chemical liquid different from the first chemical liquid to the substrate held by the substrate holding mechanism;

a first moving mechanism which moves the first chemical liquid nozzle between a first outer space and an upper position above the substrate held by the substrate holding mechanism, the first outer space being a predetermined space defined outside the treatment cup in the treatment chamber;

a second moving mechanism which moves the second chemical liquid nozzle between a second outer space different from the first outer space and the upper position above the substrate held by the substrate holding mechanism, the second outer space being a predetermined space defined outside the treatment cup in the treatment chamber;

a first vat disposed at least in a bottom of the first outer space for receiving liquid from above and guiding the received liquid toward a first drain port; and

a second vat disposed in a bottom of the second outer space for receiving liquid from above and guiding the received liquid toward a second drain port different from the first drain port;

wherein at least bottom portions of the first outer space and the second outer space are isolated from each other.

2. The substrate treatment apparatus according to claim 1 ,

wherein the first moving mechanism includes a mechanism of moving the first chemical liquid nozzle between a first home position defined in the first outer space and a treatment position defined above the substrate held by the substrate holding mechanism,

wherein the second moving mechanism includes a mechanism of moving the second chemical liquid nozzle between a second home position defined in the second outer space and a treatment position defined above the substrate held by the substrate holding mechanism.

3. The substrate treatment apparatus according to claim 1 ,

wherein the second vat extends over the bottom of the second outer space and the bottom of an inner space, the inner space being a predetermined space defined inside the treatment cup.

4. The substrate treatment apparatus according to claim 1 ,

wherein the upper surface of the first vat includes a first inclined surface, and the first inclined surface guides the received liquid toward the first drain port,

wherein the upper surface of the second vat includes a second inclined surface, and the second inclined surface guides the received liquid toward the second drain port disposed at the lowermost portion of the upper surface of the second vat.

5. The substrate treatment apparatus according to claim 1 ,

wherein the first moving mechanism includes a first pivoting mechanism of pivoting the first chemical liquid nozzle around a first pivoting axis; and

wherein the second moving mechanism includes a second pivoting mechanism of pivoting the second chemical liquid nozzle around a second pivoting axis.

6. The substrate treatment apparatus according to claim 1 , further comprising:

a first chemical liquid supply line of supplying the first chemical liquid to the first chemical liquid nozzle; and

a suction mechanism for sucking the inside of the first chemical liquid supply line.

7. The substrate treatment apparatus according to claim 1 ,

wherein the first chemical liquid includes a sulfuric acid-containing liquid,

wherein the second chemical liquid includes an organic solvent.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 14, 2017
From: AOMATSU, AKIYOSHI; UEMAE, SHOJI; NAKAMURA, KAZUKI; IZUMI, YOSHINORI; TANAHASHI, NOBUTAKA
To: SCREEN HOLDINGS CO., LTD.
Reel/Frame 041253/0794 →
Priority Claims (2)
JP 2014-165555 · Aug 15, 2014 · national
JP 2014-165556 · Aug 15, 2014 · national
Continuity (2)
Division 14822242 · Aug 10, 2015
Related Publication 20170154796A1 · Jun 1, 2017