Specific device for cleaning electronic components and/or circuits
View Patent ↗The disclosure relates to a device for cleaning electronic components and/or circuits. The cleaning device comprises a first vessel containing a liquid, a support for holding the electronic components and/or circuits, a fluid injection system including nozzles allowing the projection of jets of fluid to sweep the surface of the components, and a fluid mixer including a first inlet suitable for receiving a pressurized liquid, a second inlet suitable for receiving a pressurized gas, and an outlet designed to supply the injection system with two-phase fluid. The first inlet is coupled to the outlet by an inner duct, the second inlet is coupled to a pressurized gas supply and to an injector for injecting the gas into the inner duct.
1. A method, comprising:
keeping electronic components and/or a circuit immersed in a first vessel containing a liquid,
producing a two-phase fluid by mixing a pressurized liquid with a pressurized gas using a fluid mixer having a first inlet suitable for receiving the pressurized liquid, a second inlet suitable for receiving the pressurized gas, an outlet designed for supplying the two-phase fluid produced by mixing the pressurized liquid and pressurized gas,
spraying jets of the two-phase fluid onto the electronic components and/or circuit, using a fluid injection system comprising nozzles,
sweeping the surface of the electronic components and/or circuit with jets of the two-phase fluid from the nozzles, wherein the first inlet of the fluid mixer is coupled to the outlet by an inner duct, the second inlet being supplied with the pressurized gas and connected to an injector for injecting said pressurized gas into the inner duct,
injecting the pressurized liquid into the fluid mixer at a pressure between about 3 bar and 5 bar with a flow rate of 20 l/min,
injecting the pressurized gas at a center of the inner duct of the fluid mixer, with a difference between the pressure of the pressurized liquid and a pressure of the pressurized gas inside the fluid mixer being about 1 bar, and
the outlet supplies the injection system with the two-phase fluid.
2. The method according to claim 1 , wherein the pressure of the pressurized gas injected into the fluid mixer is 0.5 bar to 2 bar greater than that of the pressurized liquid with a flow rate of about 10 l/min.
3. The method according to claim 1 , wherein the pressure at the nozzles is less than or equal to 5 bar.
4. The method according to claim 1 , wherein the liquid contained in the first vessel overflows into an overflow vessel.
5. The method according to claim 1 , further comprising filtering the pressurized liquid prior to the pressurized liquid entering the fluid mixer.
6. The method according to claim 1 , wherein the injecting of the pressurized gas is performed upstream of the first vessel.
7. The method according to claim 1 , wherein the sweeping includes vertically sweeping the surface of the electronic components and/or circuit by the jets of the two-phase fluid from the nozzles.
8. The method according to claim 1 , wherein the sweeping includes horizontally sweeping the surface of the electronic components and/or circuit by the jets of the two-phase fluid from the nozzles.
9. The method according to claim 1 , wherein the spraying includes spraying jets of the two-phase fluid from the nozzles which are positioned on first and second sides of the electronic components and/or circuit, the nozzles being part of two nozzle arrays that are interconnected and arranged on the first and second sides of the electronic components and/or circuit.
10. The method according to claim 1 , wherein the pressurized gas injected in the second inlet of the fluid mixer is a neutral gas.
11. The method according to claim 4 , wherein the liquid contained in the overflow vessel is routed to the fluid mixer.