Method for manufacturing mixed-dimension and void-free MRAM structure

1. A method for manufacturing a semiconductor structure, the method comprising:

providing a substrate;

forming an semiconductor structure over the substrate;

forming a first dielectric layer over the semiconductor structure;

forming a stop layer over the first dielectric layer;

forming a second dielectric layer over the stop layer; and

removing the second dielectric layer, the stop layer and at least a portion of the first dielectric layer through a CMP operation without exposing a top surface of the semiconductor structure.

2. The method of claim 1 , further comprising:

exposing the top surface of the semiconductor structure through a thinning operation.

3. The method of claim 2 , wherein the exposure of the top surface of the semiconductor structure through the thinning operation comprises:

exposing the top surface of the semiconductor structure through an etch operation.

4. The method of claim 1 , wherein the formation of the first dielectric layer over the semiconductor structure comprises:

conformally forming a Tetraethyl Orthosilicate (TEOS) layer over the semiconductor structure.

5. The method of claim 1 , wherein the formation of the first dielectric layer over the semiconductor structure comprises:

conformally forming a high density plasma-oxide (HDP-oxide) layer over the semiconductor structure.

6. The method of claim 1 , wherein the formation of the stop layer over the first dielectric layer comprises:

conformally forming a silicon nitride (SiN) layer over the first dielectric layer.

7. The method of claim 1 , wherein the formation of the second dielectric layer over the stop layer comprises:

conformally forming a un-doped Silicate Glass (USG) layer over the stop layer.

8. A method for manufacturing a semiconductor structure, the method comprising:

providing a substrate including a first region and a second region formed thereon;

forming a semiconductor structure over the first region, wherein a top surface of the semiconductor structure is higher than a top surface of the second region;

conformally forming a first dielectric layer over the semiconductor structure and the second region, wherein a top surface of the first dielectric layer directly over the second region is higher than the top surface of the semiconductor structure, and the top surface of the first dielectric layer directly over the first region is higher than the top surface of the first dielectric layer directly over the second region;

conformally forming a stop layer over the first dielectric layer;

conformally forming a second dielectric layer over the stop layer;

performing a planarization operation upon at least the second dielectric layer; and

stopping the planarization at a level of the stop layer over the second region.

9. The method of claim 8 , further comprising:

exposing the top surface of the semiconductor structure through a thinning operation.

10. The method of claim 8 , wherein the performing of the planarization operation upon at least the second dielectric layer comprises:

performing a CMP operation upon at least the second dielectric layer.

11. The method of claim 9 , wherein the exposure of the top surface of the semiconductor structure through the thinning operation comprises:

exposing the top surface of the semiconductor structure through an etch operation.

12. The method of claim 8 , wherein the formation of the first dielectric layer over the semiconductor structure and the second region comprises:

conformally forming a Tetraethyl Orthosilicate (TEOS) layer over the semiconductor structure and the second region.

13. The method of claim 8 , wherein the formation of the first dielectric layer over the semiconductor structure and the second region comprises:

conformally forming a high density plasma-oxide (HDP-oxide) layer over the semiconductor structure and the second region.

14. A method for manufacturing a semiconductor structure, the method comprising:

providing a substrate including a first region and a second region formed thereon, wherein the second region has a greater area than the first region;

forming a first semiconductor structure over the first region, wherein a top surface of the first semiconductor structure is higher than a top surface of the second region;

forming a second semiconductor structure over the first region, wherein a top surface of the second semiconductor structure is substantially level with the top surface of the first semiconductor structure, and a width of the first semiconductor structure is greater than a width of the second semiconductor structure;

conformally forming a first dielectric layer over the first and second semiconductor structures and the second region to fill a gap between the first and second semiconductor structures;

conformally forming a stop layer over the first dielectric layer;

conformally forming a second dielectric layer over the stop layer; and

performing a planarization operation upon at least the second dielectric layer according to an indication of the stop layer.

15. The method of claim 14 , wherein the formation of the first dielectric layer over the first and second semiconductor structures and the second region comprises:

conformally forming the first dielectric layer over the first and second semiconductor structures and the second region to allow a top surface of the first dielectric layer over the second region is substantially higher than the top surfaces of the first and the second semiconductor structure.

16. The method of claim 14 , further comprising:

exposing a top surface of the first semiconductor structure and a top surface of the second semiconductor structure through a thinning operation.

17. The method of claim 14 , wherein the performing of the planarization operation upon at least the second dielectric layer according to an indication of the stop layer comprises:

performing a CMP operation upon at least the second dielectric layer according to an indication of the stop layer over the second region.

18. The method of claim 16 , wherein the exposure of the top surface of the first semiconductor structure and the top surface of the second semiconductor structure through the thinning operation comprises:

exposing the top surface of the first semiconductor structure and the top surface of the second semiconductor structure through an etch operation.

19. The method of claim 14 , wherein the formation of the first dielectric layer over the first and second semiconductor structures and the second region comprises:

conformally forming a Tetraethyl Orthosilicate (TEOS) layer over the first and second semiconductor structures and the second region.

20. The method of claim 14 , wherein the formation of the first dielectric layer over the first and second semiconductor structures and the second region comprises:

conformally forming a high density plasma-oxide (HDP-oxide) layer over the first and second semiconductor structures and the second region.