Semiconductor memory device and method of manufacturing the same
According to an embodiment, a semiconductor memory device comprises first wiring lines, second wiring lines, and first variable resistance elements. The first wiring lines are arranged in a first direction and have as their longitudinal direction a second direction intersecting the first direction. The second wiring lines are arranged in the second direction and have the first direction as their longitudinal direction. The first variable resistance elements are respectively provided at intersections of the first wiring lines and the second wiring lines. In addition, this semiconductor memory device comprises a first contact extending in a third direction that intersects the first direction and second direction and having one end thereof connected to the second wiring line. The other end and a surface intersecting the first direction of this first contact are covered by a first conductive layer.
1. A memory device comprising:
a substrate;
a first wiring extending in a first direction;
a second wiring being provided between the substrate and the first wiring extending in the first direction, the second wiring being located away from the first wiring in a second direction crossing the first direction and perpendicular to the substrate;
a third wiring being provided between the first wiring and the second wiring, the third wiring extending in a third direction crossing the first and the second directions, the third direction being parallel to the substrate;
a first variable resistance element being provided between the first wiring and the third wiring;
a second variable resistance element being provided between the second wiring and the third wiring;
a first contact extending in the second direction, one end of the first contact being connected to the first wiring, and a length between the first contact and the third wiring in the first direction being a first length and a length between the first contact and the second wiring in the first direction being a second length shorter than the first length;
a second contact being located below the second wiring in the second direction, one end of the second contact being connected to the other end of the first contact, and the second contact extending in the second direction; and
a third contact being connected to the second wiring, the third contact extending in the second direction, and a length between the second contact and the third contact in the first direction being a third length longer than the second length.
2. The semiconductor memory device according to claim 1 , wherein
the second wiring is shorter than the first wiring in the first direction.
3. The semiconductor memory device according to claim 1 , further comprising
a first film being provided on the first wiring.
4. The semiconductor memory device according to claim 1 , wherein
the first film includes a nitride.
5. The semiconductor memory device according to claim 1 , further comprising
an insulating film being provided between the first contact and the second wiring.
6. The semiconductor memory device according to claim 1 , wherein
a fourth length in the second direction from a connecting surface of the first wiring and the first contact to a connecting surface of the second contact and the first contact is longer than a fifth length in the second direction from the first wiring to the third wiring.
7. The semiconductor memory device according to claim 1 , wherein
the second contact is provided in a first layer different from a second layer in which the second wiring is provided.