Apparatus to control device temperature utilizing multiple thermal paths

1. An apparatus to control a temperature of a device comprises:

a thermal fluid path in which a thermal transfer fluid is capable of flowing, wherein at least a portion of the thermal fluid path is disposed so that the device is heated or cooled in response to the thermal transfer fluid;

a controller being operable to input temperature data responsive to the thermal fluid path;

a first path in thermal contact with a heating assembly, which first path is fluidly connected at a first end to the thermal fluid path;

a second path in thermal contact with a cooling assembly, which second path is fluidly connected at a first end to the thermal fluid path;

a third path fluidly connected at a first end to the thermal fluid path; and

a supply apparatus which is disposed to receive thermal transfer fluid from the thermal fluid path and to apply it as input to a valve assembly that is fluidly connected to a second end of the first path, a second end of the second path, and a second end of the third path;

wherein the valve assembly is operable, in response to the controller, to regulate flow of thermal transfer fluid flow into the second end of the first path, the second end of the second path, and the second end of the third path; and

wherein the valve assembly includes:

a first valve operable in response to the controller wherein the first valve regulates flow of thermal transfer fluid into the second end of the first path;

a second valve operable in response to the controller wherein the second valve regulates flow of thermal transfer fluid into the second end of the second path; and

a third valve operable in response to the controller wherein the third valve regulates flow of thermal transfer fluid into the second end of the third path.

2. The apparatus of claim 1 wherein one or more of the first, second and third valves is a pulse-width modulated valve.

3. The apparatus of claim 1 wherein the at least a portion of the thermal fluid path is adapted to bring thermal fluid into direct contact with the device.

4. The apparatus of claim 1 wherein the at least a portion of the thermal fluid path is capable of flowing the thermal transfer fluid into a thermal head having conduits or fluid channels, which thermal head is in thermal contact with the device.

5. The apparatus of claim 4 wherein the at least a portion of the thermal fluid path is adapted to bring thermal fluid into direct contact with the device.

6. An apparatus to control a temperature of a device comprises:

a thermal fluid path in which a thermal transfer fluid is capable of flowing, wherein at least a portion of the thermal fluid path is disposed so that the device is heated or cooled in response to the thermal transfer fluid;

a controller being operable to input temperature data responsive to the thermal fluid path;

a first path in thermal contact with a heating assembly, which first path is fluidly connected at a first end to the thermal fluid path;

a second path in thermal contact with a cooling assembly, which second path is fluidly connected at a first end to the thermal fluid path;

a third path fluidly connected at a first end to the thermal fluid path; and

a supply apparatus which is disposed to receive thermal transfer fluid from the thermal fluid path and to apply it as input to a valve assembly that is fluidly connected to a second end of the first path, a second end of the second path, and a second end of the third path;

wherein the valve assembly is operable, in response to the controller, to regulate flow of thermal transfer fluid flow into the second end of the first path, the second end of the second path, and the second end of the third path; and

wherein the apparatus further comprises:

a first path temperature sensor in communication with the controller and being operable to sense a temperature in response to the first path; and

a second path temperature sensor in communication with the controller and being operable to sense a temperature in response to the second path;

wherein:

the heating assembly is operable in response to the controller; and

the cooling assembly is operable in response to the controller.

7. The apparatus of claim 6 wherein the at least a portion of the thermal fluid path is capable of flowing the thermal transfer fluid into a thermal head having conduits or fluid channels, which thermal head is in thermal contact with the device.