IP Library Granted Patent US 10,124,558
Granted Patent B2
US 10,124,558 · App. 14/262,012 · Granted Nov 13, 2018

Thermal expansion suppressing member and anti-thermally-expansive member

Inventors: Makoto Kubota (Yokohama, JP); Kaoru Miura (Matsudo, JP); Hisato Yabuta (Machida, JP); Yoshihiko Matsumura (Tokyo, JP); Yuichi Shimakawa (Uji, JP); Masaki Azuma (Uji, JP)
Assignees: KYOTO UNIVERSITY; CANON KABUSHIKI KAISHA
B32B7/02C01G53/40C04B35/50C04B35/505H01L23/3731B32B2307/734H01L2924/0002H01L2924/09701H05K3/0058H05K2201/068
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Quick Facts
Patent No.
US 10,124,558
App. No.
14/262,012
Granted
Nov 13, 2018
Kind
B2
Abstract

Provided are a thermal expansion suppressing member having negative thermal expansion properties and a metal-based anti-thermally-expansive member having small thermal expansion. More specifically, provided are a thermal expansion suppressing member, including at least an oxide represented by the following general formula (1), and an anti-thermally-expansive member, including a metal having a positive linear expansion coefficient at 20° C., and a solid body including at least an oxide represented by the following general formula (1), the metal and solid being joined to each other: (Bi 1-x M x )NiO 3 (1) where M represents at least one metal selected from the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In; and x represents a numerical value of 0.02≤x≤0.15.

Claims (17)

1. An oxide represented by general formula (1):

(Bi 1-x M x )NiO 3   (1),

wherein M represents at least one metal selected from the group consisting of Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In, and

wherein x represents a numerical value of 0.02≤x≤0.15.

2. A member, comprising:

a base having a positive linear expansion coefficient at 20° C.; and

a solid body including an oxide represented by general formula (1):

(Bi 1-x M x )NiO 3   (1),

the group consisting of La, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Ho, Er, Tm, Yb, Lu, Y, and In,

wherein x represents a numerical value of 0.02≤x≤0.15,

wherein the base and the solid body are directly joined to each other, and

wherein a linear expansion coefficient at 20° C. of the member is less than that of the base.

3. The member according to claim 2 , wherein the linear expansion coefficient at 20° C. of the base is from 10x10 −6 /K to 30x10 −6 /K.

4. The member according to claim 2 , wherein a thermal conductivity κ at 0° C. of the base is from 100 W/mK to 410 W/mK.

5. The member according to claim 2 , wherein the base comprises at least one of aluminum and copper as a component.

6. A spacer member comprising the member according to claim 2 .

7. A spring comprising the member according to claim 2 .

Priority Claims (2)
JP 2010-180885 · Aug 12, 2010 · national
JP 2011-097851 · Apr 26, 2011 · national
Continuity (2)
Division 13205272 · Aug 8, 2011
Related Publication 20140234643A1 · Aug 21, 2014
Cited By (1)
US 12,479,972