Semiconductor device and a method for fabricating the same
In a method of manufacturing a semiconductor device, a first contact hole is formed in one or more dielectric layers disposed over a source/drain region or a gate electrode. An adhesive layer is formed in the first contact hole. A first metal layer is formed on the adhesive layer in the first contact hole. A silicide layer is formed on an upper surface of the first metal layer. The silicide layer includes a same metal element as the first metal layer.
1. A method of manufacturing a semiconductor device, the method comprising:
forming a first contact hole in one or more dielectric layers disposed over a source/drain region or a gate electrode;
forming an adhesive layer in the first contact hole;
forming a first metal layer on the adhesive layer in the first contact hole;
forming a silicide layer on an upper surface of the first metal layer; and
forming an insulating layer in contact with the silicide layer and an uppermost layer of the one or more dielectric layers, wherein:
the silicide layer includes a same metal element as the first metal layer,
the source/drain region includes a source/drain silicide layer, and
the adhesive layer is in contact with the source/drain silicide layer.
2. The method of claim 1 , wherein the insulating layer is made of a different material than the uppermost layer of the one or more dielectric layers.
3. The method of claim 2 , wherein the insulating layer is made of at least one of SiN, SiC, SiCN and SiON.
4. The method of claim 2 , further comprising:
forming an additional dielectric layer over the insulating layer;
forming a second contact hole in the additional dielectric layer and the insulating layer; and
forming a second metal layer above the first metal layer electrically connected to the first metal layer.
5. The method of claim 4 , wherein the second metal layer is in direct contact with an upper surface of the silicide layer.
6. The method of claim 4 , wherein the second metal layer passes through the silicide layer and in direct contact with the first metal layer.
7. The method of claim 1 , wherein the silicide layer fully covers the upper surface of the first metal layer.
8. The method of claim 1 , wherein the silicide layer partially covers the upper surface of the first metal layer.
9. The method of claim 8 , further comprising:
forming an additional dielectric layer over the insulating layer;
forming a second contact hole in the additional dielectric layer and the insulating layer; and
forming a second metal layer above the first metal layer to be electrically connected to the first metal layer.
10. The method of claim 9 , wherein the second metal layer is in direct contact with the first metal layer.
11. The method of claim 9 , wherein the second metal layer is in direct contact with the silicide layer.
12. A method of manufacturing a semiconductor device, the method comprising:
forming a first contact hole in one or more dielectric layers disposed over a source/drain region or a gate electrode;
forming an adhesive layer in the first contact hole;
forming a first metal layer on the adhesive layer in the first contact hole; and
forming an upper silicide layer on an upper surface of the first metal layer, wherein:
at least one of the source/drain region and the gate electrode includes a lower silicide layer,
the adhesive layer is in contact with the lower silicide layer,
the upper silicide layer at least partially covers the upper surface of the first metal layer,
side faces of the upper silicide layer is covered by the adhesive layer or the first metal layer, and
the upper silicide layer includes a same metal element as the first metal layer.
13. The method of claim 12 , further comprising forming an insulating layer in contact with the upper silicide layer and an uppermost layer of the one or more dielectric layers,
wherein the insulating layer is made of a different material than the uppermost layer of the one or more dielectric layers.
14. The method of claim 13 , further comprising:
forming an additional dielectric layer over the insulating layer;
forming a second contact hole in the additional dielectric layer and the insulating layer; and
forming a second metal layer above the first metal layer electrically connected to the first metal layer.
15. The method of claim 12 , wherein the upper silicide layer protrudes above an upper surface of an uppermost layer of the one or more dielectric layers.
16. A method of manufacturing a semiconductor device, the method comprising:
forming a first contact hole in one or more dielectric layers disposed over a source/drain region or a gate electrode;
forming an adhesive layer in the first contact hole and over an uppermost layer of the one or more dielectric layers;
forming a Co layer on the adhesive layer;
performing a planarization operation on the Co layer and the adhesive layer, thereby forming a conductive plug in the first contact hole; and
forming a Co-silicide layer on the planarized upper surface of the Co layer by a reaction between the planarized upper surface and a Si source gas.
17. The method of claim 16 , wherein the Co-Silicide layer is formed by supplying at least one silicon source gas of a SiH 4 gas and a Si 2 H 6 gas to a surface of the Co layer.
18. The method of claim 17 , wherein a H 2 gas is supplied to the surface of the Co layer before supplying at least one silicon source gas of a SiH 4 gas and a Si 2 H 6 gas, thereby removing a cobalt oxide layer formed on the planarized upper surface of the Co layer.
19. The method of claim 17 , wherein the at least one silicon source gas of a SiH 4 gas and a Si 2 H 6 gas is diluted with a dilution gas without containing a nitrogen source.