Sputtering apparatus and method thereof
A method of forming a layer including disposing a first target and a second target to face each other with a first space therebetween, disposing a substrate to face the first space, generating plasma between the first target and the second target to perform sputtering on the substrate, disposing a capture net between the substrate and the the first space, and capturing anions and/or electrons that propagate toward the substrate from the first space.
1. A sputtering apparatus for forming a thin film comprising:
a first target mounting portion;
a second target mounting portion facing the first target mounting portion with a first space therebetween, the first space being a plasma forming area;
a first electrode spaced apart from the first target mounting portion by a second space;
a second electrode spaced apart from the second target mounting portion by a third space, the second electrode being opposite to the first electrode;
a power supply portion configured to apply a voltage between the first target mounting portion and the first electrode and between the second target mounting portion and the second electrode;
a substrate mounting stand configured to mount a substrate, the substrate mounting stand facing the first space; and
a capture net between the first space and the substrate mounting stand,
wherein the first target mounting portion and the second target mounting portion each function as magnets to provide a magnetic field therebetween, and the first electrode and the second electrode face each other and align in a first direction such that the sputtering apparatus generates cations using collision between a plasma generation gas atom and electrons, accelerates the cations along the first direction, and emits atoms or molecules from at least one of the first target or the second target by colliding the cations with the at least one of the first target or the second target in response to application of the voltage,
a substrate is mounted on the substrate mounting stand and being parallel to the first direction,
the capture net is configured to be grounded,
the capture net includes a material having a relative dielectric constant of less than or equal to about 1.2 and has an electrical conductivity, and
the capture net is configured to,
capture at least one of anions or the electrons scattered from the plasma forming area and propagating toward the substrate from the first space, and
pass at least one of the atoms or the molecules.
2. The sputtering apparatus of claim 1 , wherein the material included in the capture net includes at least one of silver, copper, lead, aluminum, or palladium.
3. The sputtering apparatus of claim 1 , wherein the capture net has at least one of a lattice shape, a spider web shape, or a shape of binding a plurality of concentric circles with radiation lines.
4. The sputtering apparatus of claim 1 , wherein the first target mounting portion and the second target mounting portion each function as magnets such that a magnetic field powered by a direct current (DC) power is provided therebetween.
5. The sputtering apparatus of claim 1 , wherein at least one of a magnetic field powered by a direct current (DC) power, radio frequency (RF) electric field, or a pulsed electric field is applied between the first target mounting portion and the first electrode and between the second target mounting portion and the second electrode.
6. A method of forming a thin film layer comprising:
disposing a first target on a first target mounting portion and a second target on a second target mounting portion such that the first target faces the second target with a first space therebetween, the first space being an area in which plasma is to be formed;
disposing a first electrode to be spaced apart from the first target mounting portion by a second space and a second electrode to be spaced apart from the second target mounting portion by a third space and to be opposite to the first electrode such that the first electrode and the second electrode are aligned to each other in a first direction;
providing a magnetic field between the first target mounting portion and the second target mounting portion, the first target mounting portion and the second target mounting portion each functioning as magnets;
disposing a substrate on a substrate mounting stand such that the substrate faces the first space, and is mounted to be parallel to the first direction;
generating plasma between the first target and the second target to perform sputtering on the substrate;
generating cations using collision between a plasma generation gas atom or electrons;
accelerating the cations along the first direction;
emitting atoms or molecules from at least one of the first target or the second target by colliding the cations with the at least one of first target or second target;
disposing a capture net, the capture net including a material having a relative dielectric constant of less than or equal to about 1.2 and having an electrical conductivity;
grounding the capture net;
capturing, using the capture net, at least one of anions or the electrons scattered from the plasma forming area and propagating toward the substrate from the first space; and
passing at least one of the atoms or the molecules emitted from the first and second targets through the capture net.
7. The method of claim 6 , wherein the capturing comprises:
disposing the capture net between the first space and the substrate.
8. The method claim 6 , wherein the material included in the capture net includes at least one of silver, copper, lead, aluminum, or palladium.
9. The method of claim 8 , wherein the capture net has at least one of a lattice shape, a spider web shape, or a shape binding a plurality of concentric circles with radiation lines.
10. The method of claim 6 , wherein the disposing, the generating, and the capturing cooperatively form an ITO layer having a thickness of less than or equal to about 100 nm on the substrate.