Light emitting device
A light emitting device includes a package, a light emitting element, and a sealing member. The package is equipped with a lead and a molded resin that holds the lead. The lead has an upper surface and a lower surface, and has a metal board and a plating layer. The plating layer includes a first plating layer that contains a nickel plating layer, a gold plating layer, and a silver plating layer, that is provided to an upper surface of the metal board, and that is not provided to a lower surface of the metal board. The light emitting element is mounted in the package. The sealing member seals the light emitting element.
1. A light emitting device comprising:
a package equipped with at least two leads, with each of the leads having an upper surface and a lower surface, and each of the leads having a metal board and a plating layer covering at least an upper surface and a lateral side surface of the metal board with a lowermost surface of the metal board being not covered by the plating layer, the plating layer covering the lateral side surface of the metal board including a lowermost edge that is flush with the lowermost surface of the metal board, the plating layer containing a nickel plating layer, a gold plating layer, and a silver plating layer, and a molded resin that holds the lead with a part the lowermost surface of the metal board and a part the lowermost edge of the plating layer being exposed from the molded resin on a lower surface of the package; a light emitting element mounted in the package; and a sealing member that seals the light emitting element.
2. The light emitting device according to claim 1 , wherein
the plating layer includes a palladium plating layer.
3. The light emitting device according to claim 1 , wherein
the package has a recess, and a part of the upper surface of the lead is exposed on a bottom surface of the recess.
4. The light emitting device according to claim 1 , wherein
in the plating layer, the nickel plating layer, the gold plating layer, and the silver plating layer are arranged in an order of the nickel plating layer, the gold plating layer, and the silver plating layer from the upper surface of the metal board.
5. The light emitting device according to claim 1 , wherein
the lead has a protruding portion on an upper surface side of a lateral side surface of the lead.
6. The light emitting device according to claim 5 , wherein
a thickness of the protruding portion is one-fifth to one-half a thickness of the lead in a height direction.
7. The light emitting device according to claim 5 , wherein
the plating layer is further formed on a lower surface of the protruding portion.
8. The light emitting device according to claim 1 , wherein
the lead has an exposed portion exposed on an outer side surface of the light emitting device.
9. The light emitting device according to claim 8 , wherein
a part of the plating layer surrounds a surface of the exposed portion as viewed from a lateral side surface of the light emitting element.
10. The light emitting device according to claim 1 , wherein
the metal board has copper as a main component.
11. The light emitting device according to claim 10 , wherein
a lowermost surface of the lead includes a part of the plating layer and the copper of the metal board.