Decorative WPC panel comprising a low-porous profiled edge and method for producing the same
A decorative panel comprising a plate-shaped carrier made of a wood plastic composite (WPC) material, wherein the plate-shaped carrier comprises a profile and/or a cut edge in at least one edge region, and wherein the profile and/or the cut edge has a substantially sealed surface. A method for producing such panel including a step of subjecting a surface of a profile and/or cut edge to a thermal treatment to at least partially melt the WPC material in the region of the profile and seal the surface.
1. A method for producing a decorative panel, comprising the steps of: providing a plate-shaped carrier made of a WPC (wood plastic composite) material comprising wood particles and plastic;
forming a profile in at least one edge of the plate-shaped carrier by milling using a milling head;
subjecting a surface of the profile to a thermal treatment to at least partially melt the WPC material in the region of the profile and seal the surface.
2. The method according to claim 1 , wherein the profile is a functional profile in the shape of a tongue or groove for connecting panels together.
3. The method according to claim 2 , wherein the melting of the WPC material is implemented by heating the milling head used in the process for the profiling of the at least one edge of the plate-shaped carrier to a temperature greater than or equal to a melting temperature of the WPC material and less than a decomposition temperature of the WPC material.
4. The method according to claim 1 , wherein the profile is a decorative profile in the shape of a chamfer.
5. The method according to claim 4 , wherein the melting of the WPC material is implemented by heating the milling head used in the process for the profiling of the at least one edge of the plate-shaped carrier to a temperature greater than or equal to a melting temperature of the WPC material and less than a decomposition temperature of the WPC material.
6. The method according to claim 1 , wherein the melting of the WPC material is implemented by heating the milling head used in the process for the profiling of the at least one edge of the plate-shaped carrier to a temperature greater than or equal to a melting temperature of the WPC material and less than a decomposition temperature of the WPC material.
7. The method according to claim 6 , wherein the surface of the profile after the thermal treatment comprises a closed layer of plastic.
8. The method according to claim 6 , wherein the surface of the profile after the thermal treatment comprises a closed layer of plastic and wood fibers disposed on the surface surrounded by plastic.
9. The method according to claim 6 , wherein the milling head is temperature controlled to a maximum temperature of 30° C. above the melting temperature of the WPC material.
10. The method according to claim 9 , wherein the temperature of the milling head is monitored contact-free.
11. The method according to claim 9 , wherein at least the profiled region of the edge of the plate-shaped carrier is cooled down to a temperature below the melting point after the melting of the WPC material and sealing of the surface.
12. The method according to claim 11 , wherein the cooling is carried out within a period of ≤60 s.
13. The method according to claim 11 , comprising applying a decor to the carrier by a direct printing process subsequently to the forming the profile in the edge of the plate-shaped carrier.
14. The method according to claim 1 , comprising applying a decor to the carrier by a direct printing process subsequently to the providing the plate-shaped carrier.
15. The method according to claim 14 , comprising a step for applying a printing base prior to the step of applying a decor.
16. The method according to claim 1 , comprising applying a decor to the carrier by a direct printing process subsequently to the forming the profile in the edge of the plate-shaped carrier.
17. The method according to claim 1 comprising:
the providing the carrier;
the forming the profile;
and the thermal treatment;
wherein the thermal treatment is performed during the forming the profile by heating the milling head used in the forming the profile; and
applying a decor to the carrier by a printing process performed after the forming the profile.
18. The method according to claim 17 further comprising applying a wear layer over the decor.
19. The method according to claim 1 , wherein the WPC material comprises wood and polymer in a ratio between 40/60 and 70/30.
20. The method according to claim 1 , wherein 3 the WPC material comprises wood in a proportion between 45 wt % and 55 wt %.