IP Library Granted Patent US 10,192,871
Granted Patent B2
US 10,192,871 · App. 15/698,138 · Granted Jan 29, 2019

Semiconductor device

Inventors: Tatsuya Onuki (Atsugi, JP); Kiyoshi Kato (Atsugi, JP)
Assignee: Semiconductor Energy Laboratory Co., Ltd.
H01L27/1052G11C5/025G11C11/404G11C11/4097H01L23/34H01L27/10814H01L27/124H01L27/1207H01L27/1225H01L27/1255H01L29/7869H01L29/78648H03K17/687G11C11/40G11C11/4072G11C11/4094G11C2211/4016
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Quick Facts
Patent No.
US 10,192,871
App. No.
15/698,138
Granted
Jan 29, 2019
Kind
B2
Abstract

To provide a semiconductor device in which the on-state current is high and the operation speed is high. The semiconductor device includes a transistor, a first circuit, and a second circuit. The transistor includes a first gate and a second gate. The first gate and the second gate overlap with each other with a semiconductor layer positioned therebetween. The first circuit includes a temperature sensor. The temperature sensor obtains temperature information. The first circuit is configured to apply a voltage to the second gate depending on the temperature information. The first circuit preferably includes a comparator. The second circuit is configured to apply a negative voltage to the second gate and hold the negative voltage.

Claims (54)

1. A semiconductor device comprising:

a transistor; and

a first circuit,

wherein the transistor includes a first gate and a second gate,

wherein the first gate and the second gate overlap with each other with a semiconductor layer positioned therebetween,

wherein the first circuit includes a temperature sensor and a comparator,

wherein the temperature sensor is configured to obtain temperature information, and

wherein the first circuit is configured to apply, to the second gate, a voltage depending on the temperature information.

2. The semiconductor device according to claim 1 ,

wherein the semiconductor layer includes a metal oxide.

3. The semiconductor device according to claim 1 , further comprising a second circuit,

wherein the second circuit is configured to apply a negative voltage to the second gate.

4. The semiconductor device according to claim 3 ,

wherein the second circuit is configured to hold the negative voltage.

5. The semiconductor device according to claim 4 ,

wherein the second circuit includes a transistor including a metal oxide in a channel formation region.

6. A semiconductor device comprising:

a transistor; and

a first circuit,

wherein the transistor includes a first gate and a second gate,

wherein the first gate and the second gate overlap with each other with a semiconductor layer positioned therebetween,

wherein the first circuit includes a temperature sensor and a capacitor,

wherein the temperature sensor is configured to obtain temperature information, and

wherein the first circuit is configured to apply a voltage to the second gate through the capacitor, the voltage depending on the temperature information.

7. The semiconductor device according to claim 6 ,

wherein the first circuit includes a comparator.

8. The semiconductor device according to claim 6 ,

wherein the semiconductor layer includes a metal oxide.

9. The semiconductor device according to claim 6 , further comprising a second circuit,

wherein the second circuit is configured to apply a negative voltage to the second gate.

10. The semiconductor device according to claim 9 ,

wherein the second circuit is configured to hold the negative voltage.

11. The semiconductor device according to claim 10 ,

wherein the second circuit includes a transistor including a metal oxide in a channel formation region.

12. A semiconductor device comprising:

a first transistor;

a first circuit;

a voltage generation circuit; and

a second circuit,

wherein the first transistor includes a first gate and a second gate,

wherein the first gate and the second gate overlap with each other with a semiconductor layer positioned therebetween,

wherein the first circuit includes a temperature sensor and a capacitor,

wherein the voltage generation circuit is electrically connected to the second gate of the first transistor through the second circuit;

wherein the temperature sensor is configured to obtain temperature information,

wherein the first circuit is configured to apply a voltage to the second gate through the capacitor, the voltage depending on the temperature information, and

wherein the second circuit includes a second transistor including an oxide semiconductor in a channel formation region.

13. The semiconductor device according to claim 12 ,

wherein the first circuit includes a comparator.

14. The semiconductor device according to claim 12 ,

wherein the semiconductor layer in the first transistor includes a metal oxide.

15. The semiconductor device according to claim 12 ,

wherein the second circuit is configured to apply a negative voltage to the second gate.

16. The semiconductor device according to claim 15 ,

wherein the second circuit is configured to hold the negative voltage.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 7, 2017
From: ONUKI, TATSUYA; KATO, KIYOSHI
To: SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
Reel/Frame 043526/0930 →
Priority Claims (1)
JP 2016-185129 · Sep 23, 2016 · national
Continuity (1)
Related Publication 20180090498A1 · Mar 29, 2018
Cited By (2)
US 12,211,539 US 12,597,448