IP Library › Granted Patent US 10,199,459
Granted Patent B2
US 10,199,459 · App. 15/080,807 · Granted Feb 5, 2019

Superjunction with surrounding lightly doped drain region

Inventors: Patrick M. Shea (Oviedo, FL); Samuel J. Anderson (Tempe, AZ); David N. Okada (Chandler, AZ)
Assignee: Great Wall Semiconductor Corporation
H01L29/0634H01L29/404H01L29/66659H01L29/7835H01L29/41766
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Quick Facts
Patent No.
US 10,199,459
App. No.
15/080,807
Granted
Feb 5, 2019
Kind
B2
Abstract

A semiconductor device has a substrate and a lightly doped drain (LDD) region formed in the substrate. A superjunction is formed in the LDD region.

Claims (20)

1. A method of making a semiconductor device, comprising:

providing a substrate;

forming a lightly doped drain (LDD) region in the substrate using ion implantation; and

forming a superjunction in the LDD region using ion implantation through a mask, the superjunction having a length with respect to a surface of the substrate, the superjunction having first and second stripes having opposite dopant types and first and second respective adjacent widths perpendicular to the length with respect to the surface of the substrate;

forming the first stripe doped with a first type of dopant using a first mask; and

forming the second stripe doped with a second type of dopant opposite to the first type of dopant using a second mask separate from the first mask,

the method further including forming the first stripe extending out of the LDD region.

2. The method of claim 1 , further including forming the first stripe extending farther into the substrate than the LDD region.

3. The method of claim 2 , wherein the second stripe is surrounded by the LDD.

4. The method of claim 1 , further including doping the first stripe with a first dopant concentration different from a second dopant concentration of the second stripe.

5. The method of claim 4 , wherein the first stripe includes a dopant concentration gradient.

6. The method of claim 1 , further including:

forming a gate over the substrate; and

forming the first stripe tapered toward the gate.

7. The method of claim 1 , further including:

forming a MOSFET in the substrate to include the LDD region and the superjunction.

8. The method of claim 1 , wherein forming the superjunction includes:

forming the first stripe to have a width less than a width of the second stripe.

9. The method of claim 1 , wherein forming the superjunction includes causing the superjunction to be charge balanced.

10. The method of claim 1 , wherein forming the first stripe includes using a first dopant concentration at a first depth in the substrate and wherein forming the second stripe includes using a second dopant concentration at a second depth in the substrate.

Continuity (4)
Continuation In Part 14333323 · Jul 16, 2014
Provisional Application 61856631 · Jul 19, 2013
Provisional Application 61857193 · Jul 22, 2013
Related Publication 20160211365A1 · Jul 21, 2016