LED display module
An LED display module is disclosed. The LED display module includes a substrate; a plurality of multi-pixel packages arrayed in a matrix with rows and columns, respectively, each of the multi-pixel packages including a package substrate and two or more pixels located on the package substrate and each of the pixels including a red LED chip, a green LED chip, and a blue LED chip; and a driver IC adapted to independently control the pixels of the multi-pixel packages. Anode terminals of the LED chips in the pixels adjacent in the row direction are connected in common to one another such that the pixels are scanned in rows in response to scan signals.
1. An LED display module comprising:
a substrate;
a plurality of multi-pixel packages arrayed in a matrix with rows and columns on the substrate, each multi-pixel package comprising:
a package substrate;
a plurality of pixels on the package substrate, each pixel comprising a red LED chip, a green LED chip, and a blue LED chip; and
a plurality of common electrode pads disposed on an upper surface of the package substrate, each common electrode pad being connected in common to anode terminals of the LED chips of the corresponding pixel; and
a driver IC adapted to independently control the pixels of the multi-pixel packages,
wherein the plurality of common electrode pads that are disposed adjacent to one another in the row direction are connected to each other.
2. The LED display module according to claim 1 , wherein each of the multi-pixel packages comprises the same number of common terminals disposed on the bottom surface of the package substrate as the number of the rows.
3. The LED display module according to claim 1 , wherein each of the multi-pixel packages comprises a common connector through which common electrode pads assigned to the respective pixels are connected to common terminals disposed on the bottom surface of the package substrate.
4. The LED display module according to claim 1 , wherein the multi-pixel packages adjacent in the row direction receive common scan signals applied to row-wise interconnection lines through common terminals disposed in the multi-pixel packages.
5. The LED display module according to claim 1 , wherein each of the multi-pixel packages comprises individual electrode pads disposed on the upper surface of the package substrate and to which cathode terminals of the LED chips are connected independently.
6. The LED display module according to claim 5 , wherein the individual electrode pads are arrayed in lines in the column direction.
7. The LED display module according to claim 5 , wherein the individual electrode pads are arrayed in lines in the row direction.
8. The LED display module according to claim 1 , wherein each of the multi-pixel packages comprises R terminals, G terminals, and B terminals disposed on the bottom surface of the package substrate for the red LED chips, the green LED chips, and the blue LED chips, respectively, and each of the numbers of the R terminals, the G terminals, and the B terminals in each multi-pixel package is the same as the number of the columns in the multi-pixel package.
9. The LED display module according to claim 1 , wherein each of the multi-pixel packages comprises R individual electrode pads, G individual electrode pads, and B individual electrode pads disposed on the upper surface of the package substrate and to which cathode terminals of the LED chips are connected independently, R connection means through which the R individual electrode pads are connected to R terminals, G connection means through which the G individual electrode pads are connected to G terminals, and B connection means through which the B individual electrode pads are connected to B terminals.