IP Library › Granted Patent US 10,227,517
Granted Patent B2
US 10,227,517 · App. 15/525,017 · Granted Mar 12, 2019

Polishing method and polishing composition

Inventors: Shuhei Takahashi (Kiyosu, JP); Masatoshi Tomatsu (Kiyosu, JP)
Assignee: Fujimi Incorporated
C09K3/1409B24B1/00B24B37/042B24B37/044C09G1/02C09K3/1463H01L21/02024H01L21/304H01L29/1608
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Quick Facts
Patent No.
US 10,227,517
App. No.
15/525,017
Granted
Mar 12, 2019
Kind
B2
Abstract

Provided is a method for polishing a material having a Vickers hardness of 1500 Hv or higher. The polishing method comprises a step of carrying out preliminary polishing using a preliminary polishing composition that comprises an abrasive A PRE and a step of carrying out final polishing using a final polishing composition that comprises an abrasive A FIN lower in hardness than the abrasive A PRE .

Claims (17)

1. A method for polishing a material comprising the steps of:

providing a material having a Vickers hardness of 1500 Hv or higher;

preliminarily polishing the material using a preliminary polishing composition comprising an abrasive A PRE and a water-soluble polishing aid B PRE ; and

final polishing the material using a final polishing composition that comprises an abrasive A FIN lower in hardness than the abrasive A PRE ;

wherein the polishing aid B PRE comprises a composite metal oxide CMO PRE , the composite metal oxide CMO PRE having a monovalent or divalent metal (but not a transition metal, and a transition metal in the fourth period of the periodic table.

2. The polishing method according to claim 1 wherein the abrasive A PRE has a Vickers hardness in a range of 800 Hv to 3000 Hv, and the abrasive A FIN has a Vickers hardness in a range of 200 Hv to 1500 Hv.

3. The polishing method according to claim 1 wherein the mean secondary particle diameter P PRE of the abrasive A PRE is greater than the mean secondary particle diameter P FIN of the abrasive A FIN .

4. The polishing method according to claim 1 wherein the final polishing composition comprises a water-soluble polishing aid B FIN .

5. The polishing method according to claim 4 wherein the polishing aid B FIN comprises a composite metal oxide CMO FIN , the composite metal oxide CMO FIN having a monovalent or divalent metal (but not a transition metal) or ammonia, and a transition metal in group 5 or 6 of the periodic table.

6. The polishing method according to claim 5 wherein the polishing aid B FIN further comprises an oxygen-containing substance capable of supplying oxygen to the composite metal oxide CMO FIN .

7. A method for polishing a material comprising the steps of:

providing a material having a Vickers hardness of 1500 Hv or higher;

preliminarily polishing the material using a preliminary polishing composition, and

final polishing the material using a final polishing composition, wherein

the preliminary polishing composition has an oxidation-reduction potential ORP PRE vs. standard hydrogen electrode, and the final polishing composition has an oxidation-reduction potential ORP FIN vs. standard hydrogen electrode, satisfying a relation ORP PRE >ORP FIN ; and

the oxidation-reduction potential ORP PRE of the preliminary polishing composition is in a range of 700 mV to 1500 mV, and the oxidation-reduction potential ORP FIN of the final polishing composition is in a range of 300 mV to 650 mV.

8. The polishing method according to claim 7 having a ratio ORP PRE :ORP FIN of the oxidation-reduction potential ORP PRE of the preliminary polishing composition to the oxidation-reduction potential ORP FIN of the final polishing composition, satisfying 1.2≤ORP PRE :ORP FIN ≤4.0.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 5, 2017
From: TAKAHASHI, SHUHEI; TOMATSU, MASATOSHI
To: FUJIMI INCORPORATED
Reel/Frame 042260/0579 →
Continuity (1)
Related Publication 20170320187A1 · Nov 9, 2017
Cited By (1)
US 12,577,430