IP Library › Granted Patent US 10,229,951
Granted Patent B2
US 10,229,951 · App. 15/674,136 · Granted Mar 12, 2019

Photosensitive imaging devices and associated methods

Inventors: Jutao Jiang (Tigard, OR); Jeffrey McKee (Tualatin, OR); Martin U. Pralle (Wayland, MA)
Assignee: SiOnyx, LLC
H01L27/14649H01L25/167H01L27/1461H01L27/1464H01L27/14612H01L27/14625H01L27/14645H01L27/14647H04N5/2256H04N5/3765H04N5/37452H04N9/045H01L2924/0002
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Quick Facts
Patent No.
US 10,229,951
App. No.
15/674,136
Granted
Mar 12, 2019
Kind
B2
Abstract

A monolithic sensor for detecting infrared and visible light according to an example includes a semiconductor substrate and a semiconductor layer coupled to the semiconductor substrate. The semiconductor layer includes a device surface opposite the semiconductor substrate. A visible light photodiode is formed at the device surface. An infrared photodiode is also formed at the device surface and in proximity to the visible light photodiode. A textured region is coupled to the infrared photodiode and positioned to interact with electromagnetic radiation.

Claims (38)

1. A monolithic sensor for detecting infrared and visible light, comprising:

a semiconductor substrate;

a semiconductor layer coupled to the semiconductor substrate, the semiconductor layer having a device surface opposite the semiconductor substrate;

a visible light photodiode formed at the device surface;

an infrared photodiode formed at the device surface in proximity to the visible light photodiode;

a light diffusing region associated with the infrared photodiode and positioned to interact with electromagnetic radiation; and

a global shutter coupled to said infrared photodiode and configured to activate signal integration in substantial synchronization with emission of infrared pulses generated by an infrared radiation source and to discontinue signal integration between said infrared pulses generated by said infrared radiation source.

2. The sensor of claim 1 , wherein the light diffusing region is a textured region positioned between the infrared photodiode and the semiconductor substrate.

3. The sensor of claim 1 , wherein the light diffusing region is a textured region, wherein the infrared photodiode is positioned between the textured region and the semiconductor substrate.

4. The sensor of claim 1 , wherein the visible light photodiode comprises a plurality of visible light photodiodes each being configured to detect a different color of visible light.

5. The sensor of claim 1 , wherein the infrared photodiode comprises a photodiode configured to detect infrared light having a wavelength of greater than 1000 nm.

6. The sensor of claim 1 , further comprising an infrared narrow bandpass filter coupled to the infrared photodiode.

7. The sensor of claim 1 , further comprising an image processor for combining a first output from the infrared light photodiode with a second output from the visible light photodiode to form a composite image.

8. The sensor of claim 1 , further comprising circuitry for capturing signals generated by the infrared light photodiode in response to detection of a pulse of infrared light from an infrared light source.

9. The sensor of claim 8 , further comprising circuitry for integrating the signals generated by the infrared light photodiode across multiple pulses of infrared light from the infrared light source to create a composite infrared signal image.

10. The sensor of claim 1 , wherein said infrared light source is a laser source.

11. The sensor of claim 1 , wherein operation of said visible light photodiode is independent from activation and deactivation of said infrared photodiode.

12. A system for detecting infrared and visible light, comprising:

an infrared radiation source for generating one or more pulses of infrared radiation; and

a monolithic sensor, comprising:

a semiconductor substrate;

a semiconductor layer coupled to the semiconductor substrate, the semiconductor layer having a device surface opposite the semiconductor substrate;

a visible light photodiode formed at the device surface;

an infrared photodiode formed at the device surface in proximity to the visible light photodiode;

a light diffusing region associated with the infrared photodiode and positioned to interact with electromagnetic radiation; and

a global shutter coupled to said infrared photodiode and configured to activate signal integration in substantial synchronization with emission of infrared pulses generated by said infrared radiation source and to discontinue signal integration between said infrared pulses generated by said infrared radiation source.

13. The system of claim 12 , wherein the light diffusing region is a textured region positioned between the infrared photodiode and the semiconductor substrate.

14. The system of claim 12 , wherein the light diffusing region is a textured region, wherein the infrared photodiode is positioned between the textured region and the semiconductor substrate.

15. The system of claim 12 , wherein the visible light photodiode comprises a plurality of visible light photodiodes each being configured to detect a different color of visible light.

16. The system of claim 12 , wherein the infrared photodiode comprises a photodiode configured to detect infrared light having a wavelength of greater than 1000 nm.

17. The system of claim 12 , further comprising an infrared narrow bandpass filter coupled to the infrared photodiode.

18. The system of claim 12 , further comprising an image processor for combining a first output from the infrared light photodiode with a second output from the visible light photodiode to form a composite image.

19. The system of claim 12 , further comprising circuitry for capturing signals generated by the infrared light photodiode in response to detection of a pulse of infrared light from an infrared light source.

20. The system of claim 19 , further comprising circuitry for integrating the signals generated by the infrared light photodiode across multiple pulses of infrared light from the infrared light source to create a composite infrared signal image.

21. The system of claim 12 , wherein said infrared light source is a laser source.

22. The system of claim 12 , wherein operation of said visible light photodiode is independent from activation and deactivation of said infrared photodiode.

23. The system of claim 12 , wherein the infrared light source and the infrared diode are co-located.

24. The system of claim 12 , wherein the infrared light source and the infrared diode are separately located.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 31, 2018
From: JIANG, JUTAO; MCKEE, JEFF; PRALLE, MARTIN U.
To: SIONYX, INC.
Reel/Frame 047368/0259 →
ENTITY CONVERSION Recorded Oct 31, 2018
From: SIONYX, INC.
To: SIONYX, LLC
Reel/Frame 047928/0051 →
Continuity (4)
Continuation 14245872 · Apr 4, 2014
Continuation 13091969 · Apr 21, 2011
Provisional Application 61326489 · Apr 21, 2010
Related Publication 20170358621A1 · Dec 14, 2017