IP Library › Granted Patent US 10,231,061
Granted Patent B2
US 10,231,061 · App. 15/581,744 · Granted Mar 12, 2019

Sound transducer with housing and MEMS structure

Inventors: Alfons Dehe (Reutlingen, DE); Ulrich Krumbein (Rosenheim, DE)
Assignee: INFINEON TECHNOLOGIES AG
H04R19/04B81B3/0089H04R7/04H04R19/005B81B2201/0257H04R2201/003
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Quick Facts
Patent No.
US 10,231,061
App. No.
15/581,744
Granted
Mar 12, 2019
Kind
B2
Abstract

A sound transducer includes a housing with a sound port and a MEMS structure disposed in an interior space of the housing. The MEMS structure and the sound port are acoustically coupled to each other. The MEMS structure separates a front volume from a back volume of the housing. At least one vent hole of the MEMS structure allows a gas exchange between the front volume and the back volume. The sound port allows a liquid to enter the front volume. Further, the MEMS structure prevents liquid from entering the back volume.

Claims (59)

1. A sound transducer,

comprising a housing and a MEMS structure,

wherein a sound port is disposed in the housing,

wherein the MEMS structure is disposed in an interior space of the housing,

wherein the MEMS structure and the sound port are acoustically coupled to each other,

wherein the MEMS structure separates a front volume of the housing from a back volume of the housing,

wherein at least one vent hole of the MEMS structure allows a gas exchange between the front volume and the back volume,

wherein the sound port allows a liquid to enter the front volume, and

wherein the MEMS structure prevents liquid from entering the back volume from the front volume.

2. The sound transducer of claim 1 ,

wherein the MEMS structure provides a liquid tight seal between the front volume and the back volume.

3. The sound transducer of claim 1 ,

wherein the vent hole is disposed in a diaphragm of the MEMS structure.

4. The sound transducer of claim 3 ,

wherein the diaphragm is a membrane or a back plate.

5. The sound transducer of claim 1 ,

wherein at least a part of a surface of the MEMS structure adjacent the front volume is covered with a hydrophobic coating.

6. The sound transducer of claim 5 ,

wherein the hydrophobic coating comprises a self-assembled monolayer.

7. The sound transducer of claim 1 ,

wherein at least a part of a surface of the MEMS structure facing the sound port comprises a hydrophobic structure.

8. The sound transducer of claim 7 ,

wherein the hydrophobic structure comprises a plurality of pillars configured to repel liquid.

9. The sound transducer of claim 8 ,

wherein the plurality of pillars closes manufacturing holes of the MEMS structure used for at least one manufacturing step of the MEMS structure.

10. The sound transducer of claim 8 , wherein the plurality of pillars comprise:

a pitch between 5 μm and 10 μm;

a diameter between 1 μm and 3 μm; and

a height between 0.5 μm and 5 μm.

11. The sound transducer of claim 1 ,

wherein a sidewall of the vent hole comprises a hydrophobic structure.

12. The sound transducer of claim 10 ,

wherein the hydrophobic structure comprises pillars with inwardly-dented or concave tops.

13. The sound transducer of claim 1 ,

wherein the vent hole belongs to a plurality of vent holes being disposed in a diaphragm of the MEMS structure, and

wherein the plurality of vent holes allows the gas exchange between the front volume and the back volume.

14. The sound transducer of claim 13 ,

wherein a size of the vent holes prevents passage of liquid through the vent holes.

15. The sound transducer of claim 1 , wherein a surface of the MEMS structure directly facing the sound port comprises a movable membrane of the MEMS structure.

16. The sound transducer of claim 1 , wherein a diaphragm of the MEMS structure comprises a hydrophobic structure that prevents the liquid from entering the back volume from the front volume.

17. A sound transducer,

comprising a housing and a MEMS structure,

wherein at least one vent hole is disposed in a diaphragm of the MEMS structure, and

wherein a sidewall of the vent hole of the diaphragm of the MEMS structure comprises a hydrophobic structure configured to prevent liquid from passing from a front volume of the housing to a back volume of the MEMS structure through the diaphragm via the vent hole of the diaphragm.

18. The sound transducer of claim 17 ,

wherein the hydrophobic structure comprises a plurality of pillars.

19. The sound transducer of claim 17 ,

wherein the sidewall of the vent hole is made as the hydrophobic structure.

20. The sound transducer of claim 17 ,

wherein the diaphragm is a membrane or a back plate.

21. The sound transducer of claim 17 ,

wherein the MEMS structure allows converting between acoustic signals and electrical signals.

22. The sound transducer of claim 17 , wherein at least a part of an external surface of the MEMS structure comprises a plurality of pillars configured to repel liquid.

23. The sound transducer of claim 22 , wherein the plurality of pillars comprise:

a pitch between 5 μm and 10 μm;

a diameter between 1 μm and 3 μm; and

a height between 0.5 μm and 5 μm.

24. The sound transducer of claim 22 , wherein the external surface of the MEMS structure comprises a movable membrane of the MEMS structure.

25. The sound transducer of claim 17 , wherein the housing comprises a port configured to allow liquid to enter the housing.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 19, 2017
From: DEHE, ALFONS; KRUMBEIN, ULRICH
To: INFINEON TECHNOLOGIES AG
Reel/Frame 043039/0261 →
Continuity (1)
Related Publication 20180317021A1 · Nov 1, 2018
Cited By (3)
US 12,240,748 US 12,552,659 US 12,745,026