MEMS die and MEMS-based sensor
Various implementations of MEMS sensors include an IC die having a cavity that forms at least part of the back volume of the sensor. This arrangement helps to address the problems of lateral velocity gradients and viscosity-induced losses. In some of the embodiments, the cavity is specially configured (e.g., with pillars, channels, and/or rings) to reduce the lateral movement of air. Other solutions (used in conjunction with such cavities) include ways to make a diaphragm move more like a piston (e.g., by adding a protrusion that gives it more “up-down” motion and less lateral motion) or to use a piston (e.g., a rigid piece of silicon such as an integrated circuit die) in place of a diaphragm.
1 . A micro-electro-mechanical systems (MEMS) sensor comprising:
an integrated circuit (IC) die having an electrode and a cavity defined in the IC die;
a MEMS die comprising a conductive piston, at least one wall and one or more external conductors facing the electrode of the IC die, wherein the conductive piston is rigid, as compared to the one or more external conductors, and said each external conductor is a resilient member and is electrically connected to the conductive piston at one end and to the at least one wall at the other end;
a resilient structure coupling the IC die and the MEMS die;
a substantially enclosed back volume comprising the cavity and at least partially bounded by the conductive piston and the resilient structure, the resilient structure located to prevent air flow radially outwardly from a central portion of the back volume,
wherein a capacitance is detectable by a circuit of the IC die in response to a change in separation between the conductive piston of the MEMS die and the electrode of the IC die when the conductive piston and the electrode are electrically connected to the circuit.
2 . The MEMS sensor of claim 1 , further comprising a boss that extends from a center of the conductive piston opposite the back volume.
3 . The MEMS sensor of claim 1 , further comprising one or more structures extending from the IC die into the cavity and toward the conductive piston, wherein the one or more structures are separated from walls of the cavity and from other structures in the cavity by a distance configured to reduce thermal-acoustic noise in the MEMS sensor.
4 . The MEMS sensor of claim 3 , wherein the one or more structures comprise a plurality of pillars.
5 . The MEMS sensor of claim 3 , wherein the electrode of the IC die is located on an end portion of at least one of the one or more structures.
6 . The MEMS sensor of claim 1 , wherein the conductive piston is laterally constrained by said one or more resilient external conductors.
7 . A micro-electro-mechanical systems (MEMS) sensor comprising:
a conductive piston comprising an integrated circuit (IC) die;
a substrate comprising an electrode facing the conductive piston;
a resilient structure coupling the piston and the substrate, the electrode and the piston electrically coupled to a circuit of the IC die;
a substantially enclosed back volume comprising a cavity between the electrode and the piston, the back volume at least partially defined by the substrate and the resilient structure,
wherein the cavity is located in the piston and comprises one or more structures that extend from an inner surface of the cavity toward the electrode, each structure is separated from walls of the cavity and from other structures in the cavity by a distance configured to reduce thermal-acoustic noise in the MEMS sensor, and a conductive portion of the piston is located on an end portion of at least one of the one or more structures, the one or more structures comprising a plurality of pillars, and
wherein, during operation of the MEMS sensor, a capacitance between the piston and the electrode changes as a distance between the piston and the electrode changes.
8 . The MEMS sensor of claim 7 , wherein the back volume comprises a pierce connected to an environment surrounding the MEMS sensor, and wherein the resilient structure is located to prevent air flow radially outwardly from a central portion of the back volume.
9 . The MEMS sensor of claim 7 , wherein the electrode is distributed about at least one end portion of the one or more structures.
10 . The MEMS sensor of claim 9 , wherein the back volume comprises a pierce connected to an environment surrounding the MEMS sensor, and wherein the resilient structure is located to prevent air flow radially outwardly from a central portion of the back volume.
11 . A micro-electro-mechanical systems (MEMS) sensor comprising:
an integrated circuit (IC) die having an electrode;
a cavity defined in the IC die and comprising one or more structures extending into the cavity, the one or more structures separated from walls of the cavity and from other structures in the cavity by a distance configured to reduce thermal-acoustic noise in the MEMS sensor;
a MEMS die comprising a conductive piston, at least one wall and one or more external conductors facing the electrode of the IC die, each said external conductor is a resilient member and is electrically connected to the conductive piston at one end and to the at least one wall at the other end, the one or more structures comprising a plurality of pillars extending toward the conductive piston;
a substantially enclosed back volume comprising the cavity and at least partially bounded by the conductive piston; and
a resilient structure coupling the IC die and the MEMS die, wherein the back volume is at least partially bounded by the resilient structure, wherein a capacitance is detectable by a circuit of the IC die in response to a change in separation between the conductive piston of the MEMS die and the electrode of the IC die when the conductive piston and the electrode are electrically connected to the circuit,
wherein the conductive piston is a rigid body, as compared to each said one or more resilient external conductors, each said external conductor is configured to laterally constrain the conductive piston as the separation between the conductive piston of the MEMS die and the electrode of the IC die changes, and
wherein the electrode is located on an end portion of at least one of the one or more structures extending into the cavity and toward the conductive piston.