Mark, method for forming same, and exposure apparatus
A mark forming method includes: forming recessed portion on a mark formation area of a substrate; coating the recessed portion with a polymer layer containing a block copolymer, allowing the polymer layer in the recessed portion to form a self-assembled area; selectively removing a portion of the self-assembled area; and forming a positioning mark by using the self-assembled area from which the portion thereof has been removed.
1. A method for producing a device comprising:
setting a mark formation area and a device production area different from the mark formation area on a substrate;
coating the mark formation area and the device production area with a polymer layer containing a block copolymer;
allowing the polymer layer to form a self-assembled area;
selectively removing a portion of the self-assembled area;
forming an alignment mark in the mark formation area by using the self-assembled area from which the portion of the self-assembled area has been removed.
2. The method for producing the device according to claim 1 , wherein the mark formation area includes a first area and a second area, and
the forming of the alignment mark in the mark formation area by using the self-assembled area from which the portion of the self-assembled area has been removed includes forming a first structure in the first area and forming a second structure different from the first structure in the second area.
3. The method for producing the device according to claim 2 , wherein the first structure includes a first periodic pattern having a periodic direction in a first direction, and
the second structure includes a second periodic pattern having a periodic direction in a second direction different from the first direction.
4. The method for producing the device according to claim 2 , further comprising:
forming a first guide pattern in the first area of the mark formation area; and
forming a second guide pattern in the second area of the mark formation area.
5. The method for producing the device according to claim 4 , wherein the allowing of the polymer layer to form the self-assembled area includes allowing the polymer layer in the first area to form the self-assembled area having a periodic direction in a first direction and allowing the polymer layer in the second area to form the self-assembled area having a periodic direction in a second direction different from the first direction.
6. The method for producing the device according to claim 2 , wherein the first structure includes a hole pattern array.
7. The method for producing the device according to claim 6 , wherein the second structure includes a random pattern.
8. The method for producing the device according to claim 1 , further comprising:
detecting a position of the substrate by using the alignment mark, and
processing the substrate of which position has been detected.
9. The method for producing the device according to claim 8 , wherein the processing of the substrate includes exposing the substrate.
10. A method for producing a device comprising:
setting a mark formation area including a first area and a second area on a substrate;
coating the mark formation area with a polymer layer containing a block copolymer;
allowing the polymer layer to form a self-assembled area;
selectively removing a portion of the self-assembled area;
forming a first structure in the first area of the mark formation area and forming a second structure different from the first structure in the second area of the mark formation area, by using the self-assembled area from which the portion of the self-assembled area has been removed; and
detecting a position of the substrate by using at least one of the first and second structures.
11. The method for producing the device according to claim 10 , wherein the first structure includes a first periodic pattern having a periodic direction in a first direction, and
the second structure includes a second periodic pattern having a periodic direction in a second direction different from the first direction.
12. The method for producing the device according to claim 10 , further comprising:
forming a first guide pattern in the first area of the mark formation area; and
forming a second guide pattern in the second area of the mark formation area.
13. The method for producing the device according to claim 12 , wherein the allowing of the polymer layer to form the self-assembled area includes allowing the polymer layer in the first area to form the self-assembled area having a periodic direction in a first direction and allowing the polymer layer in the second area to form the self-assembled area having a periodic direction in a second direction different from the first direction.
14. The method for producing the device according to claim 10 , wherein the first structure includes a hole pattern array.
15. The method for producing the device according to claim 14 , wherein the second structure includes a random pattern.
16. The method for producing the device according to claim 10 , further comprising processing the substrate of which position has been detected.
17. The method for producing the device according to claim 16 , wherein the processing of the substrate includes exposing the substrate.