Method of manufacturing switching element
A method of manufacturing a switching element is provided. The method including: preparing a semiconductor substrate which includes an n-type drain region, a p-type body region, and a trench penetrating the body region and reaching the drain region; and forming a lateral surface p-type region extending along a lateral surface of the trench below the body region by heating the semiconductor substrate so as to make a part of the body region flow into the trench. The switching element includes: a gate insulating layer covering an inner surface of the trench; a bottom p-type region in contact with the gate insulating layer at a bottom surface of the trench and connected to the lateral surface p-type region; an n-type source region; and a gate electrode provided in the trench.
1. A method of manufacturing a switching element, the method comprising:
preparing a semiconductor substrate which comprises an n-type drain region, a p-type body region, and a trench, the body region being provided on the drain region and located at a surface of the semiconductor substrate, and the trench extending from the surface so as to penetrate the body region and reach the drain region; and
forming a lateral surface p-type region extending along a lateral surface of the trench below the body region by heating the semiconductor substrate so as to make a part of the body region flow into the trench;
wherein
the switching element comprises:
a gate insulating layer covering an inner surface of the trench;
a bottom p-type region provided in the semiconductor substrate, in contact with the gate insulating layer at a bottom surface of the trench, and connected to the lateral surface p-type region;
an n-type source region provided in the semiconductor substrate, in contact with the gate insulating layer at the lateral surface of the trench, and separated from the drain region by the body region; and
a gate electrode provided in the trench, insulated from the semiconductor substrate by the gate insulating layer, and facing the source region, the body region and the drain region via the gate insulating layer.
2. The method of claim 1 , further comprising covering a part of the surface with a protection film before the formation of the lateral surface p-type region,
wherein the semiconductor substrate is heated with the protection film in the formation of the lateral surface p-type region.
3. The method of claim 2 , further comprising forming the source region so that the source region is located at the surface in a position adjacent to the trench,
wherein a surface of the source region is covered with the protection film in the covering of the part of the surface with the protection film.
4. The method of claim 1 , further comprising forming the bottom p-type region before the formation of the lateral surface p-type region.