Method and apparatus for aligning nanowires deposited by an electrospinning process
Embodiments of the invention generally include apparatus and methods for depositing nanowires in a predetermined pattern during an electrospinning process. An apparatus includes a nozzle for containing and ejecting a deposition material, and a voltage source coupled to the nozzle to eject the deposition material. One or more electric field shaping devices are positioned to shape the electric field adjacent to a substrate to control the trajectory of the ejected deposition material. The electric field shaping device converges an electric field at a point near the surface of the substrate to accurately deposit the deposition material on the substrate in a predetermined pattern. The methods include applying a voltage to a nozzle to eject an electrically-charged deposition material towards a substrate, and shaping one or more electric fields to control the trajectory of the electrically-charged deposition material. The deposition material is then deposited on the substrate in a predetermined pattern.
1. An apparatus for electrospinning a material on a substrate, comprising:
a reservoir for containing a deposition material;
a nozzle in fluid communication with the reservoir, the nozzle adapted to deliver the deposition material to a surface of a substrate;
a stage;
a substrate support coupled to the stage and movable via the stage relative the nozzle, wherein the substrate support comprises a height and a frame having a central opening therethough;
a voltage source coupled to the nozzle to apply an electric potential to the nozzle to eject the deposition material from the nozzle;
two or more coils positioned around a process region located between the nozzle and the substrate support, the two or more coils have decreasing diameters in a direction from the nozzle towards to the substrate support and adapted to influence the trajectory of the deposition material ejected from the nozzle; and
a counter electrode extending from the stage into the central opening, wherein a height of the counter electrode is less than the height of the substrate support.
2. The apparatus of claim 1 , wherein the counter electrode is positioned opposite of the nozzle, and wherein the counter electrode is coupled to the voltage source and is adapted to influence the trajectory of the deposition material ejected from the nozzle.
3. The apparatus of claim 2 , wherein the voltage source is adapted to apply an electric potential to the two or more coils, and the electric potential applied to the two or more coils is of the same polarity as the electric potential applied to the nozzle.
4. The apparatus of claim 3 , wherein the voltage source is adapted to apply an electric potential to the counter electrode, and the electric potential applied to the counter electrode is of the opposite polarity as the electric potential applied to the nozzle.
5. The apparatus of claim 4 , wherein the counter electrode is a pin having a conical tip directed towards the central opening of the substrate support.
6. The apparatus of claim 1 , wherein the two or more coils comprises a plurality of coils vertically spaced apart from one another and having axially aligned centers.
7. The apparatus of claim 1 , wherein the two or more coils comprise an electrically conductive material.
8. The apparatus of claim 1 , wherein the two or more coils comprises aluminum.
9. An apparatus for electrospinning a material on a substrate, comprising:
a reservoir for containing a deposition material;
a housing;
a nozzle disposed in the housing and in fluid communication with the reservoir, the nozzle adapted to deliver the deposition material to a surface of a substrate;
a stage;
a substrate support disposed in the housing, coupled to the stage, and movable via the stage relative the nozzle, wherein the substrate support comprises a height and a frame having a central opening therethough;
a counter electrode extending from the stage into the central opening of the substrate support and positioned opposite of the nozzle, a height of the counter electrode being less than the height of the substrate support, wherein the counter electrode is coupled to the voltage source and is adapted to influence the trajectory of the deposition material ejected from the nozzle;
a voltage source coupled to the nozzle to apply an electric potential to the nozzle to eject the deposition material from the nozzle; and
one or more coils disposed in the housing and positioned around a process region located between the nozzle and the substrate support, the one or more coils adapted to influence the trajectory of the deposition material ejected from the nozzle.
10. The apparatus of claim 9 , wherein the housing comprises poly(methyl methacrylate).
11. The apparatus of claim 9 , wherein the voltage source is adapted to apply an electric potential to the one or more coils, and the electric potential applied to the one or more coils is of the same polarity as the electric potential applied to the nozzle, and wherein the voltage source is adapted to apply an electric potential to the counter electrode, and the electric potential applied to the counter electrode is of the opposite polarity as the electric potential applied to the nozzle.