Joint replacement or joint resurfacing devices, systems and methods
Joint resurfacing and/or replacement devices, systems and methods that include thin film ternary ceramic coatings that are effective to provide reliable articulation and bearing surfaces and protection of both articular and modular junction surfaces from the potential for corrosion, wear, and fretting, and reduce the potential for release of metal ions from the joint systems. Isoelasticity is provided according to the particular joint resurfacing/replacement devices, systems and methods based on parameters that include material of construction, porosity and coating system. The thin film ternary ceramic coatings may be functionalized to enhance hydrophilicity and may be employed in any anatomical articulating joint region. Titanium alloy composite structures are provided that include an ultra-porous structured titanium alloy bone fixation surface and an opposed solid articular surface and a thin film ternary ceramic coating applied to one or both opposed surfaces.
1. A modular junction for an orthopedic application, comprising:
a first metallic element defining a first portion;
a second metallic element defining a second portion configured and dimensioned to receive at least a portion of the first portion;
a thin film, non-porous ternary ceramic coating applied to at least one of the first portion and the second portion;
wherein the thin film, non-porous ternary ceramic coating is selected from the group consisting of titanium aluminum nitride (TiAlN), titanium carbon nitride (TiCN), titanium niobium nitride (TiNbN), titanium silicon nitride (TiSiN), titanium zirconium nitride (TiZrN), titanium chromium nitride (TiCrN), and combinations thereof; and
wherein the thin film, non-porous ternary ceramic coating is effective to prevent wear, fretting, metal ion release, and galvanic and crevice corrosion at the coated surface.
2. The modular junction of claim 1 , wherein the thin film, non-porous ternary ceramic coating is functionalized to provide at least one of (i) improved wear properties, (ii) improved biological affinity of an implant that includes the first element and the second element, (iii) improved biological fixation of an implant that includes the first element and the second element, and (iv) to promote osteoblast activity for bone fixation of an implant that includes the first element and the second element.
3. The modular junction of claim 1 , wherein the first and second metallic portions are configured and dimensioned as part of a hip implant or a knee implant.
4. The modular junction of claim 1 , wherein the first element and the second element are configured and dimensioned for use in a joint replacement or joint resurfacing application.
5. The modular junction of claim 1 , wherein the second element further comprises a polyethylene liner, insert or spacer.
6. The modular junction of claim 1 , further comprising one or more intermediate coating layers between (i) at least one of the first element and the second element, and (ii) the thin film, non-porous ternary ceramic coating.
7. The modular junction of claim 1 , wherein at least one of the first metallic material and the second metallic material is a cobalt chrome alloy.
8. The modular junction of claim 1 , wherein at least one of the first metallic material and the second metallic material is selected from the group consisting of titanium, a titanium alloy and stainless steel.
9. The modular junction of claim 1 , wherein the first metallic material and the second metallic material are the same metallic material.
10. The modular junction of claim 1 , wherein the first metallic material and the second metallic material are different metallic materials.
11. The modular junction of claim 10 , wherein one of the first metallic material and the second metallic material is a cobalt chrome alloy, and the other of the first metallic material and the second metallic material is titanium, a titanium alloy or stainless steel.
12. The modular junction of claim 1 , wherein the thin film, non-porous ternary ceramic is applied at a thickness of 20 microns or less.
13. The modular junction of claim 1 , wherein the first portion is a stem portion.
14. The modular junction of claim 1 , wherein the second portion is a bore.
15. The modular junction of claim 14 , wherein the bore is a tapered bore.