Substrate processing apparatus and substrate processing method
The substrate processing apparatus includes a substrate holding unit that holds a substrate horizontally, a substrate rotating unit that rotates the substrate held by the substrate holding unit around a prescribed rotational axis extending along a vertical direction, a processing liquid supply nozzle that moves in a horizontal direction and supplies a processing liquid onto an upper surface of the substrate held by the substrate holding unit, a shielding member that shields an atmosphere between the shielding member and the upper surface of the substrate held by the substrate holding unit from an ambient atmosphere, an inert gas supply unit that supplies an inert gas between the upper surface of the substrate held by the substrate holding unit and the shielding member, and a shielding member rotating unit that rotates the shielding member around the rotational axis. The shielding member includes an annular portion that surrounds the substrate held by the substrate holding unit, and a passage-allowing portion that is provided in the annular portion and allows the processing liquid supply nozzle to pass through the annular portion. The substrate processing apparatus includes a controller that is programmed so as to control the shielding member rotating unit to adjust a position of the passage-allowing portion in the rotational direction such that the processing liquid supply nozzle is to be passed through the annular portion.
1. A substrate processing apparatus comprising:
a substrate holding unit that holds a substrate horizontally;
a substrate rotating unit that rotates the substrate held by the substrate holding unit around a prescribed rotational axis extending along a vertical direction;
a processing liquid supply nozzle that moves in a horizontal direction and supplies a processing liquid onto an upper surface of the substrate held by the substrate holding unit;
a shielding member that shields an atmosphere between the shielding member and the upper surface of the substrate held by the substrate holding unit from an ambient atmosphere, and includes an annular portion that surrounds the substrate held by the substrate holding unit and a passage-allowing portion that is provided at the annular portion and allows the processing liquid supply nozzle to pass through the annular portion;
an inert gas supply unit that supplies an inert gas between the upper surface of the substrate held by the substrate holding unit and the shielding member;
a shielding member rotating unit that rotates the shielding member around the rotational axis; and
a controller that is programmed so as to control the shielding member rotating unit to adjust a position of the passage-allowing portion in the rotational direction such that the processing liquid supply nozzle is to be passed through the annular portion.
2. A substrate processing apparatus according to claim 1 , wherein the processing liquid supply nozzle moves through the passage-allowing portion, between a location more toward the rotational axis side than the annular portion and a location on an opposite side of the rotational axis with respect to the annular portion.
3. A substrate processing apparatus according to claim 1 , further comprising a shielding member elevating/lowering unit that elevates and lowers the shielding member;
wherein the annular portion further includes a liquid receiver that is provided at upper side than the passage-allowing portion and receives the processing liquid removed off from the substrate.
4. A substrate processing apparatus according to claim 1 , wherein the shielding member includes a facing portion that faces the upper surface of the substrate held by the substrate holding unit,
the substrate processing apparatus further comprises an annular portion moving mechanism that moves the annular portion vertically with respect to the facing portion.
5. A substrate processing apparatus according to claim 1 , wherein the passage-allowing portion includes a penetrating hole that penetrates through the annular portion.
6. A substrate processing apparatus according to claim 1 , wherein the passage-allowing portion includes a notch where the annular portion is notched upward from the bottom end.
7. A substrate processing apparatus according to claim 1 , further comprising:
an axis-shaped nozzle arm that supports the processing liquid supply nozzle and extends in the horizontal direction; and
a nozzle rotating unit that rotates the processing liquid supply nozzle around a central axis of the nozzle arm;
wherein the processing liquid supply nozzle extends in a direction crossing the central axis of the nozzle arm; and
the passage-allowing portion includes a long hole that is long in the horizontal direction and penetrates through the annular portion.
8. A substrate processing apparatus according to claim 1 , further comprising a processing liquid passage suppressing unit that suppresses the processing liquid removed off from the substrate held by the substrate holding unit, from passing through the annular portion via the passage-allowing portion.