Semiconductor device including non-volatile memory cells
View Patent ↗A semiconductor device includes a non-volatile memory (NVM) cell. The NVM cell includes a semiconductor wire disposed over an insulating layer disposed on a substrate. The NVM cell includes a select transistor and a control transistor. The select transistor includes a gate dielectric layer disposed around the semiconductor wire and a select gate electrode disposed on the gate dielectric layer. The control transistor includes a stacked dielectric layer disposed around the semiconductor wire and a control gate electrode disposed on the stacked dielectric layer. The stacked dielectric layer includes a charge trapping layer. The select gate electrode is disposed adjacent to the control gate electrode with the stacked dielectric layer interposed therebetween.
1. A semiconductor device including a non-volatile memory (NVM) cell, wherein:
the NVM cell includes a semiconductor wire disposed over an insulating layer disposed on a substrate,
the NVM cell includes a select transistor and a control transistor,
the select transistor includes a gate dielectric layer disposed around the semiconductor wire and a select gate electrode disposed on the gate dielectric layer,
the control transistor includes a first stacked dielectric layer disposed around the semiconductor wire and a control gate electrode disposed on the first stacked dielectric layer,
the select gate electrode is disposed adjacent to the control gate electrode with a second stacked dielectric layer interposed therebetween, and
the first and second stacked dielectric layers include a charge trapping layer.
2. The semiconductor device of claim 1 , wherein:
the first and second stacked dielectric layers further include a first dielectric layer made of oxide and a third dielectric layer made of oxide and disposed on the charge trapping layer, and
the charge trapping layer is disposed on the first dielectric layer.
3. The semiconductor device of claim 2 , wherein the charge trapping layer includes one or more materials selected from the group consisting of SiN, SiON, HfO 2 , ZrO 2 and Si-dots.
4. The semiconductor device of claim 1 , wherein a part of the gate dielectric layer is disposed between the select gate electrode and the insulating layer.
5. The semiconductor device of claim 1 , wherein a part of the second stacked dielectric layer is disposed between the control gate electrode and the insulating layer.
6. The semiconductor device of claim 1 , wherein a height of the control gate electrode is greater than a height of the select gate electrode.
7. A semiconductor device including a non-volatile memory (NVM) cell, wherein:
the NVM cell includes a semiconductor wire disposed over an insulating layer disposed on a substrate,
the NVM cell includes a first control transistor, a first select transistor, a second select transistor and a second control transistor, which are arranged in this order along an extending direction of the semiconductor wire,
the first and second select transistors include a gate dielectric layer disposed around the semiconductor wire and a select gate electrode disposed on the gate dielectric layer,
the first and second control transistors include a first stacked dielectric layer disposed around the semiconductor wire and a control gate electrode disposed on the first stacked dielectric layer,
the select gate electrode is disposed adjacent to the control gate electrode with a second stacked dielectric layer interposed therebetween,
the first and second stacked dielectric layers include a charge trapping layer, and
the semiconductor wire includes a shared drain portion disposed between the select gate electrode of the first select transistor and the select gate electrode of the second select transistor.
8. The semiconductor device of claim 7 , wherein:
the first and second stacked dielectric layers further include a first dielectric layer made of an oxide and a third dielectric layer made of an oxide and disposed on the charge trapping layer.
9. The semiconductor device of claim 8 , wherein:
the charge trapping layer is disposed on the first dielectric layer, and
the charge trapping layer includes one or more materials selected from the group consisting of SiN, SiON, HfO 2 and ZrO 2 .
10. The semiconductor device of claim 7 , wherein:
a part of the gate dielectric layer is disposed between the select gate electrode and the insulating layer, and
a part of the second stacked dielectric layer is disposed between the control gate electrode and the insulating layer.
11. The semiconductor device of claim 10 , wherein no portion of the gate dielectric layer is disposed between the first stacked dielectric layer and the control gate electrode.
12. The semiconductor device of claim 7 , wherein a height of the control gate electrode is greater than a height of the select gate electrode.
13. A semiconductor non-volatile memory (NVM) comprising:
a pair of semiconductor wires disposed over an insulating layer disposed on a substrate,
a first control gate electrode disposed over the pair of semiconductor wires;
a second control gate electrode disposed over the pair of semiconductor wires;
a first select gate electrode disposed over the pair of semiconductor wires; and
a second select gate electrode disposed over the pair of semiconductor wires, wherein:
the first control gate electrode, the first select gate electrode, the second select gate electrode and the second control gate electrode are arranged in this order along an extending direction of the pair of semiconductor wires,
a gate dielectric layer is disposed around each of the pair of semiconductor wires under the first and second select gate electrodes,
a first stacked dielectric layer is disposed around each of the pair of semiconductor wires under the first and second control gate electrodes,
the first select gate electrode is disposed adjacent to the first control gate electrode with a second stacked dielectric layer interposed therebetween,
the second select gate electrode is disposed adjacent to the second control gate electrode with a third stacked dielectric layer interposed therebetween,
the first, second and third stacked dielectric layers include a charge trapping layer, and
each of the pair of semiconductor wires includes a shared drain portion disposed between the first select gate electrode and the second select gate electrode.
14. The semiconductor device of claim 13 , wherein the first, second and third stacked dielectric layers further include a first dielectric layer made of an oxide and a third dielectric layer made of an oxide and disposed on the charge trapping layer.
15. The semiconductor device of claim 14 , wherein:
the charge trapping layer is disposed on the first dielectric layer, and
the charge trapping layer includes one or more materials selected from the group consisting of SiN, SiON, HfO 2 and ZrO 2 .
16. The semiconductor device of claim 13 , wherein:
a part of the gate dielectric layer is disposed between the first select gate electrode and the insulating layer, and
a part of the gate dielectric layer is disposed between the second select gate electrode and the insulating layer.
17. The semiconductor device of claim 16 , wherein:
a part of the second stacked dielectric layer is disposed between the first control gate electrode and the insulating layer, and
a part of the third stacked dielectric layer is disposed between the second control gate electrode and the insulating layer.
18. The semiconductor device of claim 17 , wherein no portion of the gate dielectric layer is disposed between the first stacked dielectric layer and the first control gate electrode.
19. The semiconductor device of claim 17 , wherein no portion of the gate dielectric layer is disposed between the first stacked dielectric layer and the second control gate electrode.
20. The semiconductor device of claim 13 , wherein a height of the first and second control gate electrodes is greater than a height of the first and second select gate electrodes.