IP Library › Granted Patent US 10,281,429
Granted Patent B2
US 10,281,429 · App. 15/408,677 · Granted May 7, 2019

Semiconductor micro-analysis chip and method of manufacturing the same

Inventors: Kentaro Kobayashi (Tokyo, JP); Michihiko Nishigaki (Kawasaki Kanagawa, JP); Hiroshi Hamasaki (Hiratsuka Kanagawa, JP); Naofumi Nakamura (Tokyo, JP)
Assignee: KABUSHIKI KAISHA TOSHIBA
G01N27/44791G01N15/1031G01N15/1056G01N2015/1006
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Quick Facts
Patent No.
US 10,281,429
App. No.
15/408,677
Granted
May 7, 2019
Kind
B2
Abstract

According to one embodiment, a semiconductor micro-analysis chip includes a first flow channel provided with a substrate surface, the flow channel engraved on the substrate into which a sample liquid can flow, micropore provided with a part of the flow channel, a reservoir provided with at least one end of the flow channel, the reservoir engraved on the substrate for inlet and outlet of the sample liquid, and a first electrode provided with a part of the flow channel or of the reservoir. The electrode is disposed from the bottom surface of the flow channel or of the reservoir to the substrate surface, and a side surface which connects the bottom surface and the substrate surface is tapered for reducing a bend in a height direction of the electrode.

Claims (55)

1. A semiconductor microanalysis chip, comprising:

a first flow channel provided at a substrate surface, the first flow channel being engraved in the substrate and being configured to have a sample liquid flow therein;

a micropore provided at a part of the first flow channel, the micropore being configured to have microparticles in the sample liquid pass therethrough;

a reservoir provided at at least one end of the first flow channel, the reservoir being engraved in the substrate and providing an inlet and outlet for the sample liquid;

a first electrode provided in proximity to the micropore of the first flow channel; and

a groove provided in an area where the first electrode is provided, the groove having a bottom surface that is engraved to a same depth as the first flow channel,

wherein the first electrode includes (i) an electrode portion formed at a bottom surface of the first flow channel in proximity to the micropore and extending to the bottom surface of the groove, (ii) and a drawn-out portion contacting an upper surface of the electrode portion and being drawn out on the substrate surface, and

wherein the bottom surface of the groove forms an obtuse angle with a side wall surface in the area where the first electrode is provided.

2. The chip of claim 1 , further comprising a second flow channel provided at the substrate surface and having a part close to the first flow channel, the second flow channel being engraved in the substrate and being configured to have the sample liquid or an electrolyte solution flow therein,

wherein the micropore is provided at a closest point of the first and second flow channels.

3. The chip of claim 2 , further comprising a second electrode at a part of the second flow channel,

wherein the second electrode is provided from a bottom surface of the second flow channel to the substrate surface, and

wherein a side wall surface which connects the bottom surface of the second flow channel and the substrate surface is tapered to reduce a bend in a height direction of the second electrode.

4. The chip of claim 3 , wherein the bottom surface of the second flow channel forms an obtuse angle with a side wall surface in an area where the second electrode is provided.

5. The chip of claim 1 , further comprising a second flow channel provided on the substrate surface and having a part that crosses the first flow channel, the second flow channel comprising an insulating film tunnel and being configured to have the sample liquid or an electrolyte solution flow therein,

wherein the micropore is provided at a crossing point of the first and second flow channels.

6. The chip of claim 5 , further comprising a second electrode at a part of the second flow channel,

wherein the second electrode is provided from an inner wall upper surface of the second flow channel to the substrate surface, and

wherein the inner wall upper surface of the second flow channel forms an obtuse angle with a side wall surface in an area where the second electrode is provided.

7. The chip of claim 1 , further comprising a plurality of pillars inside the first flow channel, the pillars extending from the bottom surface to an upper surface of the first flow channel.

8. A semiconductor microanalysis chip, comprising:

a first flow channel provided at a substrate surface, the first flow channel being engraved in the substrate and being configured to have a sample liquid flow therein;

a second flow channel provided at the substrate surface and having a part close to or crossing the first flow channel, the second flow channel being configured to have the sample liquid or an electrolyte solution flow therein;

a micropore provided at a closest point or a crossing point of the first and second flow channels, the micropore being configured to have microparticles in the sample liquid pass therethrough;

first reservoirs provided at both ends of the first flow channel, the first reservoirs being engraved in the substrate and providing an inlet and outlet for the sample liquid;

second reservoirs provided at both ends of the second flow channel, the second reservoirs being engraved in the substrate and providing an inlet and outlet for the sample liquid or the electrolyte solution;

a first electrode provided at a part of the first flow channel;

a second electrode provided at a part of the second flow channel; and

a groove provided in an area where the first electrode is provided, the groove having a bottom surface that is engraved to a same depth as the first flow channel,

wherein the first electrode includes (i) an electrode portion formed at a bottom surface of the first flow channel in proximity to the micropore and extending to the bottom surface of the groove, and (ii) a drawn-out portion contacting an upper surface of the electrode portion and being drawn out on the substrate surface via the groove, and

wherein the bottom surface of the groove forms an obtuse angle with a side wall surface in the area where the first electrode is provided.

9. The chip of claim 8 , wherein:

the second flow channel is engraved in the substrate and has a part close to the first flow channel,

the second electrode is provided from a bottom surface of the second flow channel to the substrate surface, and

a side wall surface which connects the bottom surface of the second flow channel and the substrate surface is tapered to reduce a bend in a height direction of the second electrode.

10. The chip of claim 9 , wherein the bottom surface of the second flow channel forms an obtuse angle with a side wall surface in an area where the second electrode is provided.

11. The chip of claim 8 , wherein:

the second flow channel comprises an insulating film tunnel and has a part crossing the first flow channel,

the second electrode is provided from an inner wall upper surface of the second flow channel to the substrate surface, and

the inner wall upper surface of the second flow channel forms an obtuse angle with a side wall surface in an area where the second electrode is provided.

12. The chip of claim 11 , wherein the second flow channel is formed in a trapezoidal shape whose upper side is shorter than its lower side in cross section.

13. The chip of claim 8 , wherein the first and second electrodes are provided in proximity to the micropore.

14. A manufacturing method of a semiconductor micro-analysis chip, the method comprising:

performing selective etching of a substrate surface to form a first flow channel engraved in a substrate into which a sample liquid can flow and a reservoir engraved in the substrate to provide an inlet or outlet for the sample liquid;

forming a micropore at a part of the first flow channel, the micropore being configured to have microparticles in the sample liquid pass therethrough;

forming a side wall taper surface in a part of the first flow channel or a part of the reservoir such that a bottom surface of the first flow channel or a bottom surface of the reservoir forms an obtuse angle with a side wall surface thereof; and

forming a first electrode in a part of the first flow channel or a part of the reservoir, from the bottom surface of the first flow channel or the reservoir to the substrate surface of the substrate along the side wall taper surface.

15. A semiconductor micro-analysis chip, comprising:

a first flow channel provided at a substrate surface, the first flow channel being engraved in the substrate and being configured to have a sample liquid flow therein;

a second flow channel provided at the substrate surface and having a part close to or crossing the first flow channel, the second flow channel being configured to have the sample liquid or an electrolyte solution flow therein;

a micropore provided at a closest point or a crossing point of the first and second flow channels, the micropore being configured to have microparticles in the sample liquid pass therethrough;

first reservoirs provided at both ends of the first flow channel, the first reservoirs being engraved in the substrate and providing an inlet and outlet for the sample liquid;

second reservoirs provided at both ends of the second flow channel, the second reservoirs being engraved in the substrate and providing an inlet and outlet for the sample liquid or the electrolyte solution;

a first electrode provided from a bottom surface of the first reservoir on a sample liquid inlet side to the substrate surface, wherein a side surface which connects the bottom surface of the first reservoir and the substrate surface is tapered to reduce a bend in a height direction of the first electrode; and

a second electrode provided from a bottom surface of the second reservoir on a sample liquid or electrolyte solution inlet side to the substrate surface.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 27, 2020
From: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
To: AIPORE, INC.
Reel/Frame 054477/0524 →
SPLIT AND SUCCESSION Recorded Sep 1, 2020
From: KABUSHIKI KAISHA TOSHIBA
To: TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION
Reel/Frame 053837/0424 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 18, 2017
From: KOBAYASHI, KENTARO; NISHIGAKI, MICHIHIKO; HAMASAKI, HIROSHI; NAKAMURA, NAOFUMI
To: KABUSHIKI KAISHA TOSHIBA
Reel/Frame 041005/0381 →
Priority Claims (1)
JP 2014-147613 · Jul 18, 2014 · national
Continuity (2)
Continuation PCTJP2015057607 · Mar 10, 2015
Related Publication 20170122905A1 · May 4, 2017