Etching gas composition for silicon compound, and etching method
Provided are an etching gas composition and an etching method which enable an object, such as a substrate to be etched, to be efficiently precision processed during thin film formation, and which enable efficient removal of an accumulated or adhered silicon-based compound, other than the object such as the substrate to be etched, by means of plasma etching. The etching gas composition is characterized by containing: (1) a fluorinated halogen compound represented by XF (X is Cl, Br or I) as a primary component; (2) F 2 ; (3) a fluorinated halogen compound represented by XF n (X is Cl, Br or I, and n is an integer of 3 or higher); (4) HF; (5) O 2 ; and (6) at least one type of halogen gas molecule selected from among Cl 2 , Br 2 and I 2 .
1. An etching gas composition comprising (1) a halogen fluoride compound represented by XF (X is Cl, Br, or I) as a main component and further comprising (2) F 2 , (3) a halogen fluoride compound represented by XF n (X is Cl, Br, or I, and n is an integer of 3 or more), (4) HF, (5) O 2 , and (6) at least one halogen gas selected from Cl 2 , Br 2 , and I 2 .
2. The etching gas composition according to claim 1 , comprising 90.00 vol % to 99.999 vol % of (1) the halogen fluoride compound represented by XF (X is Cl, Br, or I), 0.000005 vol % to 0.20 vol % of the sum of (2) F 2 and (6) the halogen gas, 0.000005 vol % to 0.10 vol % of (3) the halogen fluoride compound represented by XF n (X is Cl, Br, or I, and n is an integer of 3 or more), 0.000003 vol % to 0.30 vol % of (4) HF, and (5) the balance of O 2 .
3. The etching gas composition according to claim 1 , comprising 90.00 vol % to 99.999 vol % of (1) the halogen fluoride compound represented by XF (X is Cl, Br, or I), 0.000005 vol % to 0.20 vol % of the sum of (2) F 2 and (6) the halogen gas, 0.000005 vol % to 0.10 vol % of (3) the halogen fluoride compound represented by XF n (X is Cl, Br, or I, and n is an integer of 3 or more), 0.000003 vol % to 0.30 vol % of (4) HF, (5) the balance of, O 2 and a diluent.
4. A method for etching or processing a semiconductor substrate via excitation of an etching gas by thermal energy, comprising processing or etching a deposit or thin film of a silicon compound selected from crystalline silicon, amorphous silicon, polycrystalline silicon, SiC, SiOC, SiOCN, SiON, SiCN, SiN, SiO m (m is a natural number), Poly-Si, and Poly-SiO m (m is a natural number) using the etching gas composition according to claim 1 and without using plasma.
5. A method for etching or processing a semiconductor substrate via excitation of an etching gas by thermal energy, comprising processing or etching a deposit or thin film of a silicon compound selected from crystalline silicon, amorphous silicon, polycrystalline silicon, SiC, SiOC, SiOCN, SiON, SiCN, SiN, SiO m (m is a natural number), Poly-Si, and Poly-SiO m (m is a natural number) using the etching gas composition according to claim 1 at an etching temperature of −10° C. to 800° C. and without using plasma.
6. The etching method according to claim 5 , wherein the etching temperature is 0° C. to 400° C.